Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies FF6MR12KM1HHPSA1

Part No.:
FF6MR12KM1HHPSA1
Manufacturer:
Infineon Technologies
Category:
FET, MOSFET Arrays
Package:
-
Datasheet:
AetrixFF6MR12KM1HHPSA1.pdf
Description:
MOSFET
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:10

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

FF6MR12KM1HHPSA1 from Infineon is a 62 mm C-Series dual-channel SiC MOSFET power module with integrated body diodes, rated for 1200 V drain-source voltage and 180 A nominal continuous current per switch. It employs CoolSiC™ trench technology to deliver low RDS(on) (5.5 mΩ typ. at 25 °C), ultra-low switching losses (Eon/Eoff ≤ 3.6/3.3 mJ at 175 °C), and 4 kV AC insulation - enabling high-efficiency, high-frequency operation in DC/DC converters and EV DC chargers.

For engineers reviewing the FF6MR12KM1HHPSA1 datasheet, FF6MR12KM1HHPSA1 pinout, FF6MR12KM1HHPSA1 application, or FF6MR12KM1HHPSA1 equivalent, key selection criteria include its 1200 V/180 A rating, 20 nH stray inductance, 0.188 K/W junction-to-case thermal resistance, gate drive compatibility with ±3 V/18 V logic, and qualification per IEC 60747/60749/60068 for industrial environments.

Technical Context

This module integrates two independent 1200 V CoolSiC™ trench MOSFETs with co-packaged body diodes in a single 62 mm press-fit package. Each channel supports 360 A peak repetitive drain current and operates up to 175 °C junction temperature, with gate threshold voltage tightly distributed (3.45–5.15 V) and total gate charge of 0.446 µC at 800 V.

Its electrical architecture enables hard-switched topologies at >100 kHz with minimal loss trade-offs: typical turn-on/off delays are 58–61 ns and 101–111 ns respectively, while Eon and Eoff remain stable across temperature (2.8–3.6 mJ and 2.9–3.3 mJ). The Al2O3 baseplate provides 29 mm creepage to heatsink and CTI >400 for reinforced isolation.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 1200 V - Enables use in 1000 V DC bus systems with 20% safety margin for overvoltage transients.
IDN 180 A - Continuous conduction capability per switch at TC = 115 °C, supporting high-power density designs.
RDS(on) 5.5 mΩ (typ., 25 °C) - Reduces conduction loss to <1.8 W per switch at 180 A, critical for thermal management.
Eon/Eoff 3.6 / 3.3 mJ (175 °C) - Enables >100 kHz switching in DC/DC converters without excessive thermal burden.
LsCE 20 nH - Low stray inductance minimizes voltage overshoot during fast dI/dt switching (up to 5.5 kA/µs).
RthJC 0.188 K/W - Allows efficient heat transfer from junction to heatsink, supporting compact thermal design.
VISOL 4.0 kV AC, 1 min - Meets reinforced insulation requirements for UPS, solar inverters, and EV charging systems.

Pinout & Package

FF6MR12KM1HHPSA1 uses a standardized 62 mm C-Series press-fit module package with copper baseplate and Al2O3 isolation. Dimensions: 106.4 × 62.2 × 17.0 mm (L × W × H); weight: 340 g; mounting torque: M6 screws, 3–6 Nm for module, 2.5–5 Nm for terminals.

Pin/Terminal Circuit Role Design Meaning
P1, P2 High-side source / Low-side source Common source connection point for half-bridge configuration; electrically tied internally in dual-MOSFET layout.
N1, N2 High-side drain / Low-side drain Power output terminals; support parallel connection for higher current handling or separate phase legs.
G1, G2 Gate inputs (CH1, CH2) Isolated gate terminals accepting ±3 V/18 V drive; internal 1.4 Ω gate resistor reduces ringing risk.
S1, S2 Source sense (CH1, CH2) Kelvin source connections for accurate gate drive referencing and current sensing feedback paths.
NC No connect Unused terminal; must remain unconnected per datasheet to avoid parasitic coupling or reliability impact.

Key Features

Feature Design Value
CoolSiC™ trench MOSFET technology Delivers 5.5 mΩ RDS(on) at 1200 V - 40% lower on-resistance than planar SiC equivalents, reducing conduction loss.
Integrated body diode with low VSD VSD = 3.95 V (175 °C, 180 A) - Enables efficient freewheeling in hard-switched topologies without external diodes.
Low stray inductance (20 nH) Minimizes voltage overshoot during 5.5 kA/µs dI/dt transitions - critical for reliable operation in high-frequency DC/DC stages.
IEC-qualified industrial reliability Validated per IEC 60747 (semiconductors), 60749 (discrete reliability), and 60068 (environmental stress) - ensures long-term field stability.
Al2O3 isolation + CTI >400 Supports 29 mm creepage to heatsink and 23 mm terminal-to-terminal clearance - meets reinforced insulation for 1000 V AC systems.

Applications

UPS Systems Solar Inverters

Use Scenario: Three-phase online double-conversion UPS with bidirectional power flow and battery backup.

IC Role / Device Role / Timing Role: Dual-channel SiC MOSFET module implementing interleaved boost and inverter stages in a single 62 mm footprint.

Use Value: Enables >98.5% system efficiency at full load via low RDS(on) and sub-111 ns turn-off delay, reducing cooling requirements and cabinet size.

Use Scenario: Central string inverter for utility-scale PV plants operating at 1500 V DC input.

IC Role / Device Role / Timing Role: High-voltage switching element in three-level NPC topology handling 1200 V blocking and 180 A conduction per leg.

Use Value: Achieves 20 kHz switching with <3.3 mJ Eoff, cutting magnetics volume by 35% versus IGBT-based designs while maintaining grid compliance.

EV DC Fast Chargers Energy Storage Systems

Use Scenario: 150 kW+ liquid-cooled DC charger with active front-end rectifier and isolated DC/DC stage.

IC Role / Device Role / Timing Role: Primary switching device in dual-active-bridge (DAB) DC/DC converter operating at 100–200 kHz.

Use Value: 20 nH LsCE and 0.188 K/W RthJC allow sustained 180 A operation at 175 °C junction, enabling compact, air-cooled charger modules.

Use Scenario: Grid-tied battery energy storage system (BESS) with bi-directional PCS using modular multilevel architecture.

IC Role / Device Role / Timing Role: Power switch in half-bridge submodules rated for 1200 V DC link and 180 A continuous discharge current.

Use Value: Qualified per IEC 60068 ensures resilience to thermal cycling and humidity exposure in outdoor BESS enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET module applications.

Alternative Part Technical Difference Application Difference Selection Advice
FS800R08A6P2B 800 V rating, 800 A current, planar SiC die, higher RDS(on) (7.2 mΩ) Better suited for 800 V DC bus systems; less suitable for 1000+ V solar/EV applications requiring 1200 V margin. Select when system DC link is ≤800 V and cost sensitivity outweighs efficiency gain from CoolSiC™ trench.
FF6MR12KM1H Same die and package, but lacks HP (High Performance) suffix - no enhanced gate oxide or extended lifetime validation. Approved for standard industrial use but not qualified for extended lifetime in high-stress EV charging cycles. Choose FF6MR12KM1HHPSA1 for mission-critical EV infrastructure where IEC 60749 lifetime validation is mandatory.

Compared with FS800R08A6P2B and FF6MR12KM1H, FF6MR12KM1HHPSA1 uniquely combines 1200 V rating, trench-SiC performance, and IEC-validated lifetime - making it the only option qualified for 175 °C continuous operation in EV DC fast charging and 1500 V solar inverters.

Availability

FF6MR12KM1HHPSA1 is available at Aetrix Electronics and suitable for UPS systems, solar inverters, and EV DC fast chargers requiring stable component supply, long-lifecycle assurance, and validated high-temperature reliability.

Supply support for FF6MR12KM1HHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions, with global R&D and manufacturing infrastructure.

This part belongs to Infineon's CoolSiC™ 62 mm C-Series module family, engineered specifically for high-efficiency, high-power-density industrial and automotive traction applications demanding 1200 V SiC switching performance.

FAQ

What gate drive voltage is recommended for FF6MR12KM1HHPSA1?

The datasheet specifies VGS(on) = 15–18 V and VGS(off) = –5 to 0 V. A –3 V/18 V gate drive is validated for optimal switching loss and reliability; using 0 V off-state increases Miller-induced false turn-on risk under high dv/dt conditions.

Does FF6MR12KM1HHPSA1 include anti-parallel diodes?

Yes - each MOSFET channel integrates a monolithic body diode optimized for SiC operation, with forward voltage VSD = 3.95 V at 180 A and 175 °C. No external diodes are required for freewheeling in half-bridge configurations.

What is the maximum allowable junction temperature during overload?

Tvj,op may exceed 150 °C during short-term overload conditions, up to 175 °C continuously rated. The device is qualified for 175 °C operation per IEC 60747, and transient overloads beyond this require adherence to AN 2021-13 derating guidelines.

How does the 4 kV AC isolation rating impact system-level safety certification?

The 4.0 kV AC, 1 min isolation between terminals and heatsink satisfies reinforced insulation requirements for 1000 V AC mains-connected equipment (IEC 62109, UL 62368-1), eliminating need for additional isolation barriers in UPS and solar inverter designs.

FF6MR12KM1HHPSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
-
Packaging:
Tray
Product Status:
Active
Technology:
-
Configuration:
-
FET Feature:
-
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
-
Rds On (Max) @ Id, Vgs:
-
Vgs(th) (Max) @ Id:
-
Gate Charge (Qg) (Max) @ Vgs:
-
Input Capacitance (Ciss) (Max) @ Vds:
-
Power - Max:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

FF6MR12KM1HHPSA1 FAQ

1.How can I place an order for FF6MR12KM1HHPSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for FF6MR12KM1HHPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FF6MR12KM1HHPSA1 reliable?

The price and inventory of FF6MR12KM1HHPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FF6MR12KM1HHPSA1 is usually 5 days.

3.What payment methods are accepted for FF6MR12KM1HHPSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FF6MR12KM1HHPSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FF6MR12KM1HHPSA1?

FF6MR12KM1HHPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FF6MR12KM1HHPSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FF6MR12KM1HHPSA1?

For technical support, including FF6MR12KM1HHPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FF6MR12KM1HHPSA1 requirements.

6.How does Aetrix verify that FF6MR12KM1HHPSA1 is sourced from the original manufacturer or authorized distributors?

All FF6MR12KM1HHPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FF6MR12KM1HHPSA1 meets industry standards.

7.What is the process for return or replacement of FF6MR12KM1HHPSA1?

All FF6MR12KM1HHPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FF6MR12KM1HHPSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FF6MR12KM1HHPSA1 part is unused and in its original packaging.

Return procedure for FF6MR12KM1HHPSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

FF6MR12KM1HHPSA1 Tags

  • FF6MR12KM1HHPSA1
  • FF6MR12KM1HHPSA1 PDF
  • FF6MR12KM1HHPSA1 Datasheet
  • FF6MR12KM1HHPSA1 Specifications
  • FF6MR12KM1HHPSA1 Images
  • Infineon Technologies
  • Infineon Technologies FF6MR12KM1HHPSA1
  • Buy FF6MR12KM1HHPSA1
  • FF6MR12KM1HHPSA1 Price
  • FF6MR12KM1HHPSA1 Distributor
  • FF6MR12KM1HHPSA1 Supplier
  • FF6MR12KM1HHPSA1 Wholesale
Related Products
SSM6N7002KFU,LF
SSM6N7002KFU,LF

Toshiba Semiconductor and Storage

2N7002DW-7-F
2N7002DW-7-F

Diodes Incorporated

SSM6L56FE,LM
SSM6L56FE,LM

Toshiba Semiconductor and Storage

SSM6N37FU,LF
SSM6N37FU,LF

Toshiba Semiconductor and Storage

2N7002DWH6327XTSA1
2N7002DWH6327XTSA1

Infineon Technologies

2N7002BKS,115
2N7002BKS,115

Nexperia USA Inc.

DMG1016UDW-7
DMG1016UDW-7

Diodes Incorporated

UM6K33NTN
UM6K33NTN

Rohm Semiconductor

DMG6602SVT-7
DMG6602SVT-7

Diodes Incorporated

EM6K34T2CR
EM6K34T2CR

Rohm Semiconductor

UM6K34NTCN
UM6K34NTCN

Rohm Semiconductor

DMG6601LVT-7
DMG6601LVT-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER