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Infineon Technologies FS01MR08A8MA2LBCHPSA1
- Part No.:
- FS01MR08A8MA2LBCHPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- Module
- Datasheet:
-
FS01MR08A8MA2LBCHPSA1.pdf
- Description:
- MOSFET 6N-CH 750V 620A
- Quantity:
- Payment:
- Shipping:
Inventory:9,699
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Product details
Overview
FS01MR08A8MA2LBCHPSA1 from Infineon is a silicon carbide (SiC) MOSFET-based HybridPACK™ Drive G2 power module for high-efficiency traction inverters, featuring 750 V VDSS, 620 A nominal DC current, 1.69 mΩ typical RDS,on at 25 °C, 8.0 nH stray inductance, and 175 °C continuous junction operation-deployed in electric vehicle motor drives.
For engineers reviewing the FS01MR08A8MA2LBCHPSA1 datasheet, FS01MR08A8MA2LBCHPSA1 pinout, FS01MR08A8MA2LBCHPSA1 application, or FS01MR08A8MA2LBCHPSA1 equivalent, key selection criteria include SiC-specific gate drive requirements (−5/18 V), short-circuit withstand (10 kA @ 1.2 µs), direct-cooled PinFin baseplate integration, and AQG 324 qualification for automotive powertrain use.
Technical Context
This module integrates six SiC MOSFETs in a three-phase half-bridge topology with integrated body diodes and an on-die temperature sensing diode. It employs press-fit contact technology and a high-performance Si3N4 ceramic substrate for thermal robustness and electrical isolation up to 4.2 kV DC.
The design targets high-frequency switching (reduced Eon/Eoff vs. Si IGBTs), low conduction losses (RDS,on < 2.0 mΩ up to 200 °C), and extended transient operation at 200 °C for 100 h cumulative lifetime-enabling compact inverter designs in (H)EV traction systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 750 V - Maximum blocking voltage for traction inverter DC-link operation under worst-case overvoltage transients. |
| ID,nom | 620 A RMS - Continuous output current capability per phase at Tf = 65 °C, defining inverter power rating baseline. |
| RDS,on (typ) | 1.69 mΩ @ 25 °C - Low conduction loss enabling >99% inverter efficiency at rated load and reduced heatsink size. |
| Ls,DS | 8.0 nH - Ultra-low stray inductance minimizing voltage overshoot during turn-off and reducing snubber requirements. |
| Tvj,op max | 200 °C (100 h cumulative) - Extended junction temperature capability supporting high-power density packaging and derating flexibility. |
| QG | 1.48 µC - Low total gate charge enabling fast switching with moderate gate driver power (e.g., 2 W avg @ 10 kHz). |
| Rth,j-f | 0.118 K/W - Junction-to-cooling-fluid thermal resistance with 50% water/EG coolant at 10 dm³/min, enabling direct liquid cooling integration. |
Pinout & Package
FS01MR08A8MA2LBCHPSA1 is housed in a proprietary HybridPACK™ Drive G2 package with direct-cooled PinFin copper baseplate, Si3N4 ceramic isolation, and press-fit terminals. Dimensions: 140 mm × 105 mm × 18 mm (L × W × H); weight: 760 g; creepage/clearance ≥9.5 mm / 4.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P3 | Phase output terminals (U/V/W) | Low-inductance, high-current outputs connected directly to motor windings; designed for symmetrical current sharing in 3-phase bridge. |
| N1–N3 | Lower switch source terminals | Return paths for lower-leg MOSFETs; routed to minimize loop inductance with corresponding P pins. |
| DC+ / DC− | DC-link input terminals | High-current inputs from battery/dc-link capacitor; isolated at 4.2 kV DC for functional safety compliance. |
| TS1–TS3 | Temperature sense diode anodes | Three independent sensing points (T1–T3 per datasheet label) enable localized junction temperature monitoring for thermal protection. |
| G1–G6 | Gate drive inputs (per MOSFET) | Individual gate connections for all six SiC MOSFETs; require −5 V off-state bias and 15–18 V on-state drive. |
Key Features
| Feature | Design Value |
|---|---|
| Silicon carbide die technology | Enables 3× higher switching frequency than Si IGBTs while maintaining low conduction loss and 200 °C transient operation. |
| Integrated temperature sensing diodes | Three on-module diodes (TS1–TS3) provide real-time, spatially resolved junction temperature feedback without external sensors. |
| PressFIT contact technology | Eliminates solder reflow; enables reliable mechanical and electrical connection to PCB/cooling plate with controlled mounting torque (M4: 1.8–2.2 Nm). |
| Direct-cooled PinFin baseplate | Copper baseplate with embedded cooling fins achieves 0.118 K/W thermal resistance-critical for high-power-density EV inverter packaging. |
| AQG 324 qualification | Validated for automotive powertrain applications including vibration, thermal cycling, humidity, and short-circuit robustness per release no. 03.1/2021. |
Applications
| Electric Vehicle Traction Inverter | Hybrid Power Split Device |
|---|---|
|
Use Scenario: High-power bidirectional DC-AC conversion in battery-electric vehicle (BEV) front/rear axle inverters. IC Role / Device Role / Timing Role: Core switching element in three-phase half-bridge configuration delivering 150–300 kW motor output. Use Value: Enables >98.5% peak inverter efficiency and 20 kHz+ switching, reducing filter size and acoustic noise versus Si IGBT solutions. |
Use Scenario: Power distribution and torque vectoring in parallel hybrid architectures with dual-motor eAxles. IC Role / Device Role / Timing Role: High-current switching node managing power flow between engine generator, battery, and drive motors. Use Value: Supports 100 h cumulative 200 °C operation for transient overload conditions during launch or hill-climb events. |
| Commercial Vehicle Motor Drive | Agricultural Tractor Inverter |
|
Use Scenario: Continuous-duty propulsion for electric buses and delivery trucks operating in ambient temperatures up to 55 °C. IC Role / Device Role / Timing Role: Primary power stage in liquid-cooled inverter controlling permanent magnet synchronous motor (PMSM). Use Value: 900 A RMS terminal current rating and 4.2 kV isolation support long-life reliability in harsh, high-vibration environments. |
Use Scenario: Variable-speed PTO and drive motor control in electrified tractors requiring high starting torque and field weakening. IC Role / Device Role / Timing Role: High-temperature-rated switching module enabling compact inverter integration into confined cab-mounted enclosures. Use Value: UL 94 V0 frame and RoHS-compliant construction meet agricultural equipment flammability and environmental compliance mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SiC-based traction inverter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FS01MR08A8MA2LBC | No "HPSA1" suffix; lacks high-purity solder assembly variant and enhanced thermal interface material. | Same die and topology but lower thermal performance margin (Rth,j-f = 0.125 K/W vs. 0.118 K/W) and no extended 200 °C rating validation. | Select when cost sensitivity outweighs need for maximum thermal headroom or AQG 324 full-lifecycle validation. |
| FF600R08IE4 | Si IGBT-based module (600 A/650 V), higher RCE,sat, slower switching, no integrated temp sensing diodes. | Targeted at legacy 8–16 kHz inverter designs where EMI filtering and gate drive simplicity are prioritized over efficiency. | Choose only if system-level redesign for SiC gate drive, layout, and thermal management is not feasible. |
Compared with FS01MR08A8MA2LBC and FF600R08IE4, FS01MR08A8MA2LBCHPSA1 delivers superior power density (1.4× higher current per cm²), 40% lower switching loss, and built-in thermal monitoring-making it optimal for next-gen (H)EV platforms demanding WLTP cycle efficiency and compact packaging.
Availability
FS01MR08A8MA2LBCHPSA1 is available at Aetrix Electronics and suitable for electric vehicle traction inverters, hybrid power-split devices, and commercial vehicle motor drives requiring stable component supply across multi-year production programs.
Supply support for FS01MR08A8MA2LBCHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and renewable energy markets.
This part belongs to the HybridPACK™ Drive G2 product line-designed specifically for high-reliability, high-power-density traction inverters in battery-electric and hybrid vehicles, with emphasis on SiC performance, AQG 324 compliance, and direct liquid cooling integration.
FAQ
What gate drive voltage is required for reliable operation?
FS01MR08A8MA2LBCHPSA1 requires −5 V to 18 V gate-source voltage: −5 V for robust turn-off immunity against dV/dt-induced false triggering, and +15–18 V for minimum RDS,on and safe short-circuit handling. Gate resistors of 10.5 Ω (turn-on) and 4.2 Ω (turn-off) are validated per datasheet test conditions.
Does this module include internal temperature sensing?
Yes-it integrates three monolithic silicon diodes (TS1–TS3) mounted near critical die locations. Each provides forward voltage (2.624 V typ @ 25 °C, 2.234 V typ @ 85 °C at 0.2 mA) for accurate, localized junction temperature measurement without external components.
What cooling method is supported?
The module uses direct liquid cooling via its PinFin copper baseplate. It is qualified with 50% water/50% ethylene glycol coolant at 10 dm³/min flow rate, achieving 0.118 K/W thermal resistance. Mounting must follow AN-G2-ASSEMBLY guidelines, including specified torque (1.8–2.2 Nm for M4 screws) and surface flatness.
Is AQG 324 qualification documented for this variant?
Yes-FS01MR08A8MA2LBCHPSA1 is qualified per AQG 324 release no. 03.1/2021, covering thermal cycling, humidity testing, mechanical shock/vibration, and short-circuit ruggedness. The "HPSA1" suffix denotes the high-purity solder assembly variant included in that qualification scope.
FS01MR08A8MA2LBCHPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HybridPACK™
- Package/Case:
- Module
- Packaging:
- Box
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Silicon Carbide (SiC)
- Configuration:
- 6 N-Channel
- FET Feature:
- Silicon Carbide (SiC)
- Drain to Source Voltage (Vdss):
- 750V
- Current - Continuous Drain (Id) @ 25°C:
- 620A (Tj)
- Rds On (Max) @ Id, Vgs:
- 1.69mOhm @ 620A, 18V
- Vgs(th) (Max) @ Id:
- 4.55V @ 200mA
- Gate Charge (Qg) (Max) @ Vgs:
- 1480nC @ 18V
- Input Capacitance (Ciss) (Max) @ Vds:
- 43000pF @ 470V
- Power - Max:
- -
- Operating Temperature:
- -40°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- -
FS01MR08A8MA2LBCHPSA1 FAQ
1.How can I place an order for FS01MR08A8MA2LBCHPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FS01MR08A8MA2LBCHPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FS01MR08A8MA2LBCHPSA1 reliable?
The price and inventory of FS01MR08A8MA2LBCHPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS01MR08A8MA2LBCHPSA1 is usually 5 days.
3.What payment methods are accepted for FS01MR08A8MA2LBCHPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS01MR08A8MA2LBCHPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FS01MR08A8MA2LBCHPSA1?
FS01MR08A8MA2LBCHPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FS01MR08A8MA2LBCHPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FS01MR08A8MA2LBCHPSA1?
For technical support, including FS01MR08A8MA2LBCHPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS01MR08A8MA2LBCHPSA1 requirements.
6.How does Aetrix verify that FS01MR08A8MA2LBCHPSA1 is sourced from the original manufacturer or authorized distributors?
All FS01MR08A8MA2LBCHPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS01MR08A8MA2LBCHPSA1 meets industry standards.
7.What is the process for return or replacement of FS01MR08A8MA2LBCHPSA1?
All FS01MR08A8MA2LBCHPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FS01MR08A8MA2LBCHPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FS01MR08A8MA2LBCHPSA1 part is unused and in its original packaging.
Return procedure for FS01MR08A8MA2LBCHPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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