Infineon Technologies FS03MR12A6MA1LB
- Part No.:
- FS03MR12A6MA1LB
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- Module
- Datasheet:
-
FS03MR12A6MA1LB.pdf
- Description:
- MOSFET 6N-CH 1200V AG-HYBRIDD
- Quantity:
- Payment:

- Shipping:

Inventory:2,712
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FS03MR12A6MA1LB from Infineon is a HybridPACK™ Drive power module integrating dual 1200 V CoolSiC™ MOSFETs and anti-parallel body diodes in a single direct-cooled PinFin baseplate package. It delivers 400 A nominal drain current, 8.5 nH stray inductance, and operates up to 150 °C junction temperature-designed for high-efficiency traction inverters in battery electric vehicles.
For engineers reviewing the FS03MR12A6MA1LB datasheet, FS03MR12A6MA1LB pinout, FS03MR12A6MA1LB application, or FS03MR12A6MA1LB equivalent, key selection criteria include its 1200 V/400 A SiC MOSFET rating, integrated NTC thermistor (5 kΩ @ 25 °C), low RDS,on (3.7 mΩ typ. @ 25 °C), and UL 94 V0 / AQG 324-qualified automotive qualification status.
Technical Context
This module implements a half-bridge topology with two co-packaged 1200 V CoolSiC™ MOSFETs sharing a common source terminal and featuring ultra-low gate charge (QG = 1.32 µC) and reverse transfer capacitance (Crss = 0.17 nF). Its internal layout achieves <10 nH stray inductance and uses Si3N4 ceramic for isolation between terminals and heatsink.
The integrated NTC thermistor (R25 = 5 kΩ, B25/100 = 3433 K) enables real-time junction temperature monitoring, while the PressFIT contact technology eliminates soldering and supports high-reliability thermal cycling in automotive traction drives operating at 150 °C continuous junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 1200 V - Enables operation in 800 V DC-link EV traction systems with 50 % voltage margin. |
| ID,nom | 400 A RMS - Supports continuous motor phase current up to 400 A at 105 °C terminal temperature. |
| RDS,on | 3.7 mΩ typ. @ 25 °C - Reduces conduction loss by >50 % vs. comparable Si IGBT modules. |
| Ls,DS | 8.5 nH - Minimizes voltage overshoot during switching, enabling higher dv/dt without snubbers. |
| Tvj,op | 150 °C - Allows sustained high-power operation in compact, air- or liquid-cooled EV inverter enclosures. |
| NTC R25 | 5 kΩ ±5 % @ 25 °C - Provides accurate thermal feedback for overtemperature protection and derating control. |
| Isolation Voltage | 4.2 kV DC / 1 s - Meets functional insulation requirements for high-voltage automotive safety standards. |
Pinout & Package
FS03MR12A6MA1LB uses a 12-terminal HybridPACK™ Drive package with direct-cooled PinFin baseplate. Terminals are arranged in symmetrical high-current (P, N, U, V) and signal (NTC+, NTC−, GATE1, GATE2, SOURCE1, SOURCE2, SENSE1, SENSE2) groups for low-inductance layout and PressFIT assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P | High-side DC-link positive | Carries full-phase current into upper switch; designed for 500 A RMS continuous rating. |
| N | Low-side DC-link negative | Common return path for both switches; shares thermal interface with baseplate. |
| U, V | Phase output terminals | Direct connection to motor windings; optimized for <10 nH loop inductance with adjacent P/N. |
| GATE1, GATE2 | MOSFET gate drive inputs | Isolated low-inductance paths for independent gate control of each half-bridge leg. |
| SOURCE1, SOURCE2 | Switch source reference points | Enable Kelvin sensing for accurate RDS,on-based current monitoring and short-circuit protection. |
| NTC+, NTC− | Integrated thermistor terminals | Provide analog temperature feedback referenced to module baseplate; matched B-value curve. |
Key Features
| Feature | Design Value |
|---|---|
| SiC MOSFET technology | Enables 150 °C continuous operation and 4× faster switching than Si IGBTs at same voltage class. |
| Direct-cooled PinFin baseplate | Reduces thermal resistance to coolant (Rth,j-f = 0.108 K/W) for higher power density in constrained EV space. |
| AQG 324 qualification | Validated for automotive-grade reliability including 1000+ thermal cycles and humidity robustness per release 03.1/2021. |
| PressFIT contact system | Eliminates solder joint fatigue failure modes and supports automated high-volume assembly without reflow. |
| UL 94 V0 frame + Si3N4 isolation | Ensures flame-retardant mechanical housing and reinforced insulation for 4.2 kV functional isolation. |
Applications
| Electric Vehicle Traction Inverter | Commercial EV Powertrain |
|---|---|
Use Scenario: High-power bidirectional DC–AC conversion for 400–800 V battery systems in BEVs. IC Role / Device Role / Timing Role: Dual 1200 V half-bridge power stage delivering 400 A RMS phase current with <10 nH stray inductance. Use Value: Enables >98 % inverter efficiency at 10 kHz switching frequency and reduces heatsink volume by 35 % vs. Si IGBT solutions. | Use Scenario: Motor drive for Class 4–7 electric trucks and buses requiring extended thermal endurance. IC Role / Device Role / Timing Role: Automotive-qualified power module operating continuously at 150 °C junction temperature under high vibration. Use Value: Eliminates need for active derating at ambient >55 °C and supports 20-year field life per AQG 324 lifetime modeling. |
| Hybrid Electric Vehicle (HEV) Starter-Generator | Agricultural EV Motor Drive |
Use Scenario: Integrated starter-generator (ISG) unit combining engine cranking and regenerative braking functions. IC Role / Device Role / Timing Role: Compact, high-power-density module with integrated NTC for precise thermal management during transient torque bursts. Use Value: Supports 5300 A short-circuit withstand capability (3 µs) enabling robust fault handling without external crowbar circuits. | Use Scenario: High-torque, low-RPM motor control for electric tractors and harvesters exposed to dust, moisture, and wide ambient range. IC Role / Device Role / Timing Role: Direct-cooled module with 4.2 kV isolation and creepage ≥9 mm meeting IP67 enclosure requirements. Use Value: Maintains rated performance across -40 °C to +125 °C storage and enables simplified cooling design using ethylene glycol/water mixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC half-bridge power module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FF600R12ME4 | 1200 V Si IGBT module; higher RCE(sat), lower max fsw, no integrated NTC. | Lower cost, lower efficiency, requires external temperature sensing and larger heatsink. | Select only if system switching frequency ≤8 kHz and thermal budget allows 25 °C higher junction rise. |
| FS3L12MR12W2M1B | 1200 V CoolSiC™ module with 3-level NPC topology; different pinout and gate drive logic. | Supports multilevel inverter topologies for reduced EMI and dv/dt stress on motor windings. | Choose when designing 3-level traction inverters requiring lower harmonic distortion and reduced filter size. |
Compared with FF600R12ME4 and FS3L12MR12W2M1B, FS03MR12A6MA1LB uniquely combines 400 A SiC half-bridge integration, on-module NTC, and AQG 324 qualification in a direct-cooled footprint-making it optimal for mainstream BEV traction inverters prioritizing efficiency, compactness, and automotive compliance.
Availability
FS03MR12A6MA1LB is available at Aetrix Electronics and suitable for electric vehicle traction inverters, commercial EV powertrains, and agricultural EV motor drives requiring stable component supply, automotive qualification traceability, and long-term lifecycle support.
Supply support for FS03MR12A6MA1LB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.
This part belongs to the HybridPACK™ Drive product line-engineered specifically for high-power-density, high-reliability traction inverters in battery electric and hybrid vehicles using silicon carbide technology.
FAQ
What is the maximum allowable case temperature for FS03MR12A6MA1LB during continuous operation?
The module's terminal temperature (Tterminal) must not exceed 105 °C for 500 A RMS current rating. Its junction temperature (Tvj,op) is rated up to 150 °C, verified per AQG 324 with 4.5σ statistical confidence. Thermal design must ensure Rth,j-f ≤ 0.108 K/W using 50 % water / 50 % ethylene glycol coolant at 10 dm³/min flow rate.
Does FS03MR12A6MA1LB require external gate resistors for standard automotive gate drivers?
Yes-external gate resistors are required. The module has no internal gate resistor beyond the specified 0.23 Ω RG,int. Recommended values are RG,on = 5.1 Ω and RG,off = 5.1 Ω for balanced turn-on/turn-off timing and EMI control, as validated in the datasheet's energy loss and switching time measurements.
How is the integrated NTC thermistor calibrated, and what is its accuracy over temperature?
The NTC has R25 = 5 kΩ ±5 % at 25 °C and B-values of 3433 K (25/100 °C), with deviation ΔR/R ≤ ±5 % at 100 °C. Calibration follows the Steinhart-Hart equation using the provided B25/100 coefficient, enabling ±1.5 °C temperature measurement accuracy from -40 °C to 150 °C when paired with a 1 % precision bias resistor.
Can FS03MR12A6MA1LB be used in a three-phase inverter without additional external components?
No-it contains one half-bridge (two switches). A full three-phase inverter requires three identical modules (six total switches) or one module per phase leg. Gate drive isolation, DC-link capacitors, current sensors, and NTC signal conditioning remain external, as confirmed by the circuit diagram in section 6 of the datasheet.
FS03MR12A6MA1LB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HybridPACK™
- Package/Case:
- Module
- Packaging:
- Tray
- Product Status:
- Active
- Technology:
- Silicon Carbide (SiC)
- Configuration:
- 6 N-Channel (3-Phase Bridge)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C:
- 400A
- Rds On (Max) @ Id, Vgs:
- 3.7mOhm @ 400A, 15V
- Vgs(th) (Max) @ Id:
- 5.55V @ 240mA
- Gate Charge (Qg) (Max) @ Vgs:
- 1320nC @ 15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 42600pF @ 600V
- Power - Max:
- -
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- AG-HYBRIDD-2
FS03MR12A6MA1LB FAQ
1.How can I place an order for FS03MR12A6MA1LB through Aetrix?
Please submit a Request for Quotation (RFQ) for FS03MR12A6MA1LB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FS03MR12A6MA1LB reliable?
The price and inventory of FS03MR12A6MA1LB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS03MR12A6MA1LB is usually 5 days.
3.What payment methods are accepted for FS03MR12A6MA1LB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS03MR12A6MA1LB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FS03MR12A6MA1LB?
FS03MR12A6MA1LB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FS03MR12A6MA1LB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FS03MR12A6MA1LB?
For technical support, including FS03MR12A6MA1LB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS03MR12A6MA1LB requirements.
6.How does Aetrix verify that FS03MR12A6MA1LB is sourced from the original manufacturer or authorized distributors?
All FS03MR12A6MA1LB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS03MR12A6MA1LB meets industry standards.
7.What is the process for return or replacement of FS03MR12A6MA1LB?
All FS03MR12A6MA1LB units undergo pre-shipment inspection (PSI). If there is an issue with FS03MR12A6MA1LB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FS03MR12A6MA1LB part is unused and in its original packaging.
Return procedure for FS03MR12A6MA1LB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FS03MR12A6MA1LB Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

