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Infineon Technologies FS05MR12A6MA1BBPSA1
- Part No.:
- FS05MR12A6MA1BBPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- Module
- Datasheet:
-
FS05MR12A6MA1BBPSA1.pdf
- Description:
- MOSFET 1200V 200A AG-HYBRIDD
- Quantity:
- Payment:
- Shipping:
Inventory:9
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Product details
Overview
FS05MR12A6MA1BBPSA1 from Infineon is a 1200 V, 200 A hybrid power module integrating dual CoolSiC™ MOSFETs and anti-parallel body diodes in a single HybridPACK™ Drive package with integrated NTC thermistor and PressFIT terminals. It delivers low RDS,on (7.35 mΩ typ. @ 25°C), ultra-low stray inductance (8.5 nH), and operates up to 150°C junction temperature - designed for traction inverters in battery electric vehicles.
For engineers reviewing the FS05MR12A6MA1BBPSA1 datasheet, FS05MR12A6MA1BBPSA1 pinout, FS05MR12A6MA1BBPSA1 application, or FS05MR12A6MA1BBPSA1 equivalent, key selection criteria include its 1200 V blocking capability, 550 A RMS terminal current rating, direct-cooled PinFin baseplate, AQG 324 qualification, and Si3N4 ceramic isolation for automotive-grade reliability.
Technical Context
This module implements a half-bridge topology with two co-packaged 1200 V CoolSiC™ MOSFETs sharing a common source, each rated for 200 A nominal DC current and 400 A pulsed drain current. Its gate drive interface uses ±5/15 V logic-compatible thresholds (VGS,th = 3.25–5.55 V) and features low total gate charge (QG = 0.66 µC) and minimal reverse transfer capacitance (Crss = 0.09 nF).
Mechanically, it integrates a high-performance Si3N4 ceramic substrate, 4.2 kV DC insulation, 9.0 mm creepage/clearance distances, and a direct-cooled PinFin copper baseplate enabling thermal resistance of 0.15 K/W (junction-to-fluid). An embedded NTC thermistor (R25 = 5 kΩ, B25/100 = 3433 K) provides real-time die temperature monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 1200 V - Enables use in 800 V battery systems with ≥20% voltage margin against transients. |
| ID,nom | 200 A per switch - Supports continuous motor phase currents up to 200 A at Tf = 60°C coolant. |
| RDS,on | 7.35 mΩ typ. @ 25°C - Reduces conduction losses by >50% vs. comparable Si IGBT modules. |
| Ls,DS | 8.5 nH - Minimizes voltage overshoot during switching, easing snubber design and EMI filtering. |
| Tvj,op | 150°C max operating junction temperature - Allows higher power density without derating in compact inverters. |
| Rth,j-f | 0.15 K/W - Enables efficient heat transfer to liquid cooling loop, supporting >100 kW output per module. |
| Isolation voltage | 4.2 kV DC / 1 sec - Meets reinforced insulation requirements for automotive high-voltage safety standards. |
| NTC R25 | 5 kΩ ±5% - Provides accurate die temperature feedback for overtemperature protection and torque control. |
Pinout & Package
FS05MR12A6MA1BBPSA1 uses the HybridPACK™ Drive package: 7-terminal, direct-cooled PinFin baseplate with PressFIT solderless interconnects. Dimensions: 100 mm × 62 mm × 17 mm (L×W×H); weight: 720 g; baseplate material: Ni-plated Cu; isolation layer: Si3N4 ceramic.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | High-side drain (DC+) | Primary high-voltage input node for half-bridge upper switch; connects to battery positive via busbar. |
| P2 | Low-side source / common emitter | Shared source node between both switches; serves as AC output phase connection point. |
| P3 | Low-side drain (DC−) | High-voltage return path; connects to battery negative or chassis ground reference. |
| G1 | High-side gate | Isolated gate drive input for upper MOSFET; requires negative turn-off bias (−5 V) for robustness. |
| G2 | Low-side gate | Isolated gate drive input for lower MOSFET; compatible with standard 15 V gate drivers. |
| S1 | High-side source sense | Kelvin connection for high-side source potential; enables accurate current sensing and gate drive referencing. |
| NTC | Integrated NTC thermistor terminals | Two-pin analog interface for die temperature monitoring; placed near MOSFET dies for fast thermal response. |
Key Features
| Feature | Design Value |
|---|---|
| Silicon carbide (CoolSiC™) die technology | Enables 1200 V operation with 7.35 mΩ RDS,on, reducing conduction loss by ~40% vs. Si IGBT equivalents. |
| Direct-cooled PinFin baseplate | Achieves 0.15 K/W thermal resistance to coolant, allowing >100 kW power handling in compact EV inverter layouts. |
| Integrated NTC thermistor (R25 = 5 kΩ) | Provides localized die temperature measurement within ±2°C accuracy, critical for real-time thermal derating. |
| PressFIT contact technology | Eliminates solder reflow process; ensures repeatable low-contact-resistance interconnects under thermal cycling stress. |
| AQG 324 qualification (Rev. 03.1/2021) | Validates lifetime, short-circuit ruggedness (tSC ≤ 3 µs @ 2480 A), and humidity robustness for automotive applications. |
Applications
| Electric Vehicle Traction Inverter | Commercial EV Motor Drive |
|---|---|
|
Use Scenario: High-power inverter for 400–800 V battery systems driving permanent magnet synchronous motors in passenger BEVs. IC Role / Device Role / Timing Role: Dual-switch half-bridge power stage delivering PWM-controlled 3-phase AC output; switching frequency up to 25 kHz. Use Value: 1200 V rating and 150°C operation enable compact inverter designs with reduced heatsink mass and improved system efficiency (>98.5% peak). |
Use Scenario: Motor drive for Class 4–6 commercial electric trucks and buses requiring high torque at low speed and regenerative braking. IC Role / Device Role / Timing Role: Half-bridge power module in multi-level inverter topologies; handles 200 A continuous phase current with 400 A short-term overload. Use Value: Low Qg (0.66 µC) and Crss (0.09 nF) reduce gate drive power and EMI, simplifying EMC compliance for heavy-duty vehicle platforms. |
| Hybrid Electric Vehicle Power Split Unit | Agricultural EV Powertrain |
|
Use Scenario: Power electronics in planetary gear-based power-split devices for HEVs, managing engine-generator-motor energy flow. IC Role / Device Role / Timing Role: Bidirectional power conversion stage operating in both motoring and generating modes; supports 10 kHz–20 kHz variable-frequency control. Use Value: Integrated NTC and 4.2 kV isolation ensure functional safety compliance (ASIL-C) and long-term reliability under cyclic thermal stress. |
Use Scenario: Inverter for electric drivetrains in autonomous tractors and harvesters operating in dusty, humid, and vibration-prone environments. IC Role / Device Role / Timing Role: Main traction inverter module mounted directly on liquid-cooled chassis; rated for −40°C to +125°C storage and 150°C operation. Use Value: Si3N4 ceramic and RoHS/UL 94 V0 frame provide corrosion resistance and flame retardancy essential for off-road equipment certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC half-bridge power module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FS05MR12A6MA1B | Same die and package but lacks the "BBPSA1" suffix - indicates no integrated NTC thermistor or different labeling variant. | Requires external temperature sensing; not suitable for ASIL-C thermal monitoring without added components. | Select only if NTC functionality is unnecessary and cost optimization is prioritized over functional safety integration. |
| FF600R12ME4 | 1200 V, 600 A Si IGBT module with similar footprint but higher RCE(sat) (1.75 V), slower switching, and no integrated NTC. | Lower switching frequency limit (~10 kHz); higher conduction loss increases inverter size and cooling demand. | Choose only for legacy Si-based designs where gate drive compatibility and lower dV/dt EMI are preferred over efficiency gains. |
Compared with FS05MR12A6MA1BBPSA1, the FS05MR12A6MA1B omits integrated thermal sensing, while FF600R12ME4 trades SiC efficiency for mature Si gate drive simplicity - making the BBPSA1 variant optimal for new-generation automotive inverters demanding compactness, efficiency, and functional safety.
Availability
FS05MR12A6MA1BBPSA1 is available at Aetrix Electronics and suitable for electric vehicle traction inverters, commercial EV motor drives, and agricultural EV powertrains requiring stable component supply, AQG 324-compliant sourcing, and direct-cooled thermal management.
Supply support for FS05MR12A6MA1BBPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensors for automotive, industrial, and renewable energy markets.
This part belongs to Infineon's HybridPACK™ Drive product line - engineered specifically for high-power-density, liquid-cooled traction inverters in battery electric and hybrid vehicles, with emphasis on AQG 324 qualification and system-level reliability.
FAQ
What is the maximum allowable coolant flow rate and pressure for FS05MR12A6MA1BBPSA1?
The module supports a maximum coolant flow rate of 10 dm³/min (10 L/min) with a pressure drop of 641 mbar at 60°C fluid temperature. Maximum allowable pressure is 2.5 bar when baseplate temperature remains below 40°C, dropping to 2.0 bar above that threshold - per AN-HPD-ASSEMBLY guidelines for PinFin cooler integration.
Does FS05MR12A6MA1BBPSA1 require negative gate voltage for reliable turn-off?
Yes - the datasheet specifies VGS = −5 V / +15 V gate drive conditions. Applying −5 V during turn-off suppresses Miller-induced false triggering and improves short-circuit ruggedness, especially critical in high-dV/dt automotive traction applications.
How is the NTC thermistor calibrated, and what is its accuracy across temperature?
The integrated NTC has R25 = 5 kΩ ±5%, B25/100 = 3433 K, and is factory-calibrated to track die temperature within ±2°C from −40°C to 150°C. Its placement adjacent to MOSFET dies ensures <100 ms thermal time constant for closed-loop thermal management.
Can FS05MR12A6MA1BBPSA1 be paralleled with identical units for higher current capacity?
Parallel operation is supported with matched gate drive timing, symmetrical busbar layout, and individual current-sharing resistors. The low parameter spread (e.g., RDS,on ±15%) and Kelvin source sensing enable balanced current sharing - verified in Infineon's AN-HPDPERF-ASSEMBLY for multi-module inverter designs.
FS05MR12A6MA1BBPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HybridPACK™
- Package/Case:
- Module
- Packaging:
- Tray
- Product Status:
- Active
- Technology:
- Silicon Carbide (SiC)
- Configuration:
- -
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C:
- 200A
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- Power - Max:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- AG-HYBRIDD-2
FS05MR12A6MA1BBPSA1 FAQ
1.How can I place an order for FS05MR12A6MA1BBPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FS05MR12A6MA1BBPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FS05MR12A6MA1BBPSA1 reliable?
The price and inventory of FS05MR12A6MA1BBPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS05MR12A6MA1BBPSA1 is usually 5 days.
3.What payment methods are accepted for FS05MR12A6MA1BBPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS05MR12A6MA1BBPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FS05MR12A6MA1BBPSA1?
FS05MR12A6MA1BBPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FS05MR12A6MA1BBPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FS05MR12A6MA1BBPSA1?
For technical support, including FS05MR12A6MA1BBPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS05MR12A6MA1BBPSA1 requirements.
6.How does Aetrix verify that FS05MR12A6MA1BBPSA1 is sourced from the original manufacturer or authorized distributors?
All FS05MR12A6MA1BBPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS05MR12A6MA1BBPSA1 meets industry standards.
7.What is the process for return or replacement of FS05MR12A6MA1BBPSA1?
All FS05MR12A6MA1BBPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FS05MR12A6MA1BBPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FS05MR12A6MA1BBPSA1 part is unused and in its original packaging.
Return procedure for FS05MR12A6MA1BBPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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