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Renesas HAT2165H-EL-E

Part No.:
HAT2165H-EL-E
Manufacturer:
Renesas
Category:
FETs, MOSFETs
Package:
SC-100, SOT-669
Datasheet:
AetrixHAT2165H-EL-E.pdf
Description:
MOSFET N-CH 30V 55A LFPAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,209

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Product details

Overview

HAT2165H-EL-E from Renesas Electronics is a silicon N-channel power MOSFET designed for high-efficiency, high-current DC power switching in automotive and industrial applications. It delivers RDS(on) = 2.5 mΩ (typ.) at VGS = 10 V, supports 55 A continuous drain current, and operates with 7 V gate drive compatibility - enabling direct interface with low-voltage microcontrollers. Its LFPAK (PTZZ0005DA-A) package ensures high-density mounting and thermal performance up to 150°C channel temperature.

For engineers reviewing the HAT2165H-EL-E datasheet, HAT2165H-EL-E pinout, HAT2165H-EL-E application, or HAT2165H-EL-E equivalent, key selection considerations include its 30 V VDSS, 4.17°C/W channel-to-case thermal resistance, avalanche energy rating of 90 mJ, body-diode reverse recovery time of 40 ns, and gate charge profile optimized for fast switching in motor control and DC-DC converter topologies.

Technical Context

The HAT2165H-EL-E employs a trench-gate silicon process optimized for low conduction loss and fast switching dynamics. Its RDS(on) remains stable across VGS = 4.5 V to 10 V, supporting both logic-level and standard gate drive. The device integrates a robust body diode with VDF = 0.81 V (typ.) at 55 A and trr = 40 ns under diF/dt = 100 A/µs.

It is rated for repetitive avalanche operation (IAP = 30 A, EAR = 90 mJ), with thermal derating defined by θch-C = 4.17°C/W and maximum Tch = 150°C. The LFPAK package provides low-inductance source connections and enhanced thermal coupling to PCB copper, critical for high-current pulse handling.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS30 V - Maximum blocking voltage in high-side or low-side switch configurations without breakdown.
RDS(on) (VGS = 10 V)2.5 mΩ typ. - Enables <165 mW conduction loss at 55 A, reducing heatsink requirements in 12 V systems.
ID (continuous)55 A - Supports high-current loads such as BLDC motor phases or battery protection FETs without external parallel devices.
Qg33 nC - Optimized gate charge enables efficient 100 kHz+ switching in synchronous buck converters with moderate gate driver strength.
tr/tf65 ns / 9.5 ns - Fast edge rates minimize switching transition losses and EMI generation in hard-switched topologies.
θch-C4.17°C/W - Direct thermal path from channel to case allows effective heat transfer to PCB thermal pads or heatsinks.
EAR90 mJ - Rated avalanche energy supports inductive load interruption (e.g., solenoid de-energization) without failure.

Pinout & Package

Package: LFPAK (RENESAS code PTZZ0005DA-A), surface-mount, 5-terminal leadframe package with exposed drain pad for thermal and electrical performance. Dimensions: 4.9 × 3.95 × 1.3 mm (L × W × H), mass 0.080 g.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3SourceCommon source connection; low-inductance parallel terminals reduce source loop inductance in high-di/dt switching.
4GateControl terminal; accepts 4.5–20 V drive; low input capacitance (Ciss = 5180 pF) eases driver selection.
5DrainMain power output terminal; electrically and thermally connected to exposed copper pad on bottom of package.

Key Features

Feature Design Value
Low RDS(on) at 4.5 V gate driveRDS(on) = 3.4 mΩ (typ.) enables use with 5 V or 3.3 V MCUs without level-shifting.
High-current capability55 A continuous ID rating supports single-FET solutions in 12 V/24 V power distribution modules.
Fast switching with low Qgd/Qgs ratioQgd = 7.1 nC and Qgs = 15 nC ensure clean Miller plateau transition and reduced shoot-through risk.
Robust body diodeVDF = 0.81 V (typ.) and trr = 40 ns support freewheeling in synchronous rectification and H-bridge regeneration.
Avalanche-rated operationRated for 30 A repetitive avalanche current and 90 mJ energy - validated for inductive load switching without snubbers.

Applications

Automotive Body Control Module (BCM) Industrial DC Motor Drive

Use Scenario: High-side power switching for headlight, fog lamp, or HVAC blower control in 12 V vehicle electrical systems.

IC Role / Device Role / Timing Role: Primary power switch managing load current up to 55 A with PWM dimming or on/off sequencing.

Use Value: Low RDS(on) minimizes power loss and thermal rise during continuous operation; 30 V rating accommodates load-dump transients per ISO 7637-2.

Use Scenario: Half-bridge low-side switch in 24 V brushed DC motor controllers for factory automation actuators.

IC Role / Device Role / Timing Role: Synchronous freewheeling switch with fast turn-off (tf = 9.5 ns) to suppress back-EMF spikes.

Use Value: Integrated body diode with 40 ns trr reduces need for external Schottky catch diodes; LFPAK package improves thermal cycling reliability.

Server PSU OR-ing Circuit Energy Storage System (ESS) Battery Disconnect

Use Scenario: OR-ing FET in redundant 12 V server power supply outputs to prevent backfeed and enable hot-swap capability.

IC Role / Device Role / Timing Role: Bidirectional current-blocking switch controlled by dedicated OR-ing controller IC.

Use Value: Ultra-low RDS(on) cuts conduction loss below 100 mW at 30 A, improving overall PSU efficiency and reducing cooling demand.

Use Scenario: Main contactor replacement in 48 V lithium-ion battery packs for UPS or solar storage systems.

IC Role / Device Role / Timing Role: High-reliability isolation switch activated during fault conditions (overcurrent, overtemperature).

Use Value: Avalanche rating (90 mJ) safely clamps inductive energy during forced disconnection; 150°C Tch rating supports operation in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPB017N04LGATMA1 (Infineon)40 V VDSS, RDS(on) = 1.7 mΩ @ 10 V, PG-HSOF-8 package, higher Qg (44 nC)Better conduction loss but slower switching; requires stronger gate driver for same frequency.Preferred where lower RDS(on) dominates over switching speed, e.g., high-duty-cycle DC loads.
DMTH3007LPSQ-13 (Diodes Inc.)30 V VDSS, RDS(on) = 3.0 mΩ @ 10 V, PowerDI5060 package, lower thermal resistance (3.5°C/W)Similar voltage/current rating but smaller footprint; less avalanche ruggedness (EAR not specified).Suitable for space-constrained designs where avalanche stress is minimal and PCB thermal design is optimized.

Compared with IPB017N04LGATMA1 and DMTH3007LPSQ-13, the HAT2165H-EL-E offers balanced trade-offs: superior avalanche ruggedness (90 mJ), proven LFPAK reliability in automotive environments, and gate drive flexibility down to 4.5 V - making it especially suitable for safety-critical 12 V/24 V power switching where transient robustness and MCU compatibility are prioritized.

Availability

HAT2165H-EL-E is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor drives, server power OR-ing circuits, and energy storage system disconnects requiring stable component supply and long-term production continuity.

Supply support for HAT2165H-EL-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and infrastructure markets.

The HAT2165H-EL-E belongs to Renesas' high-current power MOSFET product line, engineered for robust, high-efficiency DC power switching in harsh environments - particularly targeting automotive-grade reliability and industrial system longevity.

FAQ

What is the maximum continuous drain current rating for the HAT2165H-EL-E?

The HAT2165H-EL-E is rated for 55 A continuous drain current (ID) at Tc = 25°C. This rating assumes proper PCB thermal design with adequate copper area under the exposed drain pad. Derating applies above 25°C case temperature - for example, at Tc = 75°C, the usable ID drops to approximately 35 A based on the power vs. temperature derating curve in the datasheet. Always verify thermal performance in the final layout using the specified θch-C = 4.17°C/W.

Does the HAT2165H-EL-E support 3.3 V or 5 V logic-level gate drive?

The HAT2165H-EL-E is specified for full enhancement at VGS = 4.5 V, with RDS(on) = 3.4 mΩ (typ.) under that condition - confirming reliable operation with 5 V microcontrollers. While it can be partially enhanced at 3.3 V, RDS(on) rises significantly beyond datasheet limits and is not guaranteed. For 3.3 V systems, a gate driver or level shifter is recommended to ensure consistent 4.5 V+ gate bias and avoid thermal runaway in high-current operation.

What is the avalanche energy rating of the HAT2165H-EL-E and how is it tested?

The HAT2165H-EL-E is rated for 90 mJ repetitive avalanche energy (EAR) at Tch = 25°C, with IAP = 30 A and test conditions per the official avalanche test circuit: VDD = 15 V, Rg ≥ 50 Ω, duty cycle < 0.1%. This rating validates safe operation during inductive load turn-off events - such as solenoid or relay de-energization - without requiring external snubber networks, provided the single-pulse energy does not exceed 90 mJ and thermal limits are observed.

How does the LFPAK package of the HAT2165H-EL-E improve thermal and electrical performance compared to SO-8?

The LFPAK package (PTZZ0005DA-A) used in the HAT2165H-EL-E features an exposed drain pad soldered directly to PCB copper, achieving θch-C = 4.17°C/W - ~30% lower than typical SO-8 packages. Electrically, its three paralleled source pins and short internal bond wires reduce source inductance, improving switching stability and reducing voltage overshoot. Unlike SO-8, LFPAK eliminates plastic encapsulation over the die's top surface, enhancing thermal dissipation and mechanical robustness in vibration-prone environments like automotive under-hood applications.

Is the HAT2165H-EL-E compliant with automotive AEC-Q101 qualification standards?

The HAT2165H-EL-E is manufactured by Renesas Electronics and intended for automotive applications, but the provided datasheet (Rev.6.00, Sep 2005) does not explicitly state AEC-Q101 qualification. Renesas typically documents AEC-Q101 status in separate qualification reports or product change notifications. For automotive production use, confirm current AEC-Q101 compliance directly with a Renesas sales office or authorized distributor - and request the latest PPAP documentation and stress test data before design-in.

HAT2165H-EL-E Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
SC-100, SOT-669
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
55A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
3.3mOhm @ 27.5A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
33 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
5180 pF @ 10 V
FET Feature:
-
Power Dissipation (Max):
30W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LFPAK

HAT2165H-EL-E FAQ

1.How can I place an order for HAT2165H-EL-E through Aetrix?

Please submit a Request for Quotation (RFQ) for HAT2165H-EL-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HAT2165H-EL-E reliable?

The price and inventory of HAT2165H-EL-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HAT2165H-EL-E is usually 5 days.

3.What payment methods are accepted for HAT2165H-EL-E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HAT2165H-EL-E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HAT2165H-EL-E?

HAT2165H-EL-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HAT2165H-EL-E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HAT2165H-EL-E?

For technical support, including HAT2165H-EL-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HAT2165H-EL-E requirements.

6.How does Aetrix verify that HAT2165H-EL-E is sourced from the original manufacturer or authorized distributors?

All HAT2165H-EL-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HAT2165H-EL-E meets industry standards.

7.What is the process for return or replacement of HAT2165H-EL-E?

All HAT2165H-EL-E units undergo pre-shipment inspection (PSI). If there is an issue with HAT2165H-EL-E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HAT2165H-EL-E part is unused and in its original packaging.

Return procedure for HAT2165H-EL-E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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