Infineon Technologies IPA60R600P7SXKSA1
- Part No.:
- IPA60R600P7SXKSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
IPA60R600P7SXKSA1.pdf
- Description:
- MOSFET N-CH 600V 6A TO220
- Quantity:
- Payment:

- Shipping:

Inventory:449
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPA60R600P7SXKSA1 from Infineon Technologies is a 600 V, 0.6 Ω RDS(on) superjunction MOSFET in PG-TO220 FP package with integrated body diode and ESD protection. It serves as a high-efficiency primary-side switching device in hard- and soft-switching topologies including PFC and LLC resonant converters for server PSUs and telecom rectifiers. Confirmed parameters: VDS = 650 V (max), Qg = 9 nC (typ), Eoss = 1.1 µJ @ 400 V, diF/dt = 900 A/µs, Tj = 150 °C.
For engineers reviewing the IPA60R600P7SXKSA1 datasheet, IPA60R600P7SXKSA1 pinout, IPA60R600P7SXKSA1 application, or IPA60R600P7SXKSA1 equivalent, key selection criteria include commutation ruggedness (900 A/µs), low ringing tendency in high-dV/dt environments (80 V/ns), ESD robustness (>2 kV HBM), and thermal resistance (RthJC = 5.98 °C/W) for compact power designs.
Technical Context
This CoolMOS™ P7 device implements a superjunction architecture optimized for high-voltage switching efficiency and system-level ease of use. Its gate plateau voltage is 5.2 V, and it delivers low dynamic losses via Co(er) = 14 pF and fast switching (td(off) = 37 ns, tf = 19 ns) under 400 V bus conditions with 10 Ω gate resistance.
The integrated body diode supports hard commutation with validated diF/dt capability up to 900 A/µs and reverse recovery charge Qrr = 0.71 µC at 400 V. The device is qualified per JEDEC standards and features an insulated package with 2500 Vrms isolation rating for enhanced safety in AC-DC front-end stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 650 V - Withstands transient overvoltage spikes in 400 V AC-input PFC stages without avalanche stress. |
| RDS(on) max | 600 mΩ @ Tj = 150 °C - Enables low conduction loss in continuous 6 A operation at elevated junction temperatures. |
| Qg typ | 9 nC - Reduces gate drive power and enables use with standard 1–2 A peak gate drivers in high-frequency LLC designs. |
| Eoss | 1.1 µJ @ 400 V - Low output energy reduces turn-on loss and eases ZVS implementation in resonant converters. |
| diF/dt | 900 A/µs - Supports reliable hard commutation in asymmetric half-bridge PFC without external snubbers. |
| RthJC | 5.98 °C/W - Allows direct heatsink mounting for thermal management in space-constrained 1U server PSUs. |
| VISO | 2500 Vrms - Meets reinforced insulation requirements for Class I AC-DC power supplies per IEC 62368-1. |
Pinout & Package
Package: PG-TO220 FP (FullPAK), through-hole, isolated case, drain-connected tab. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control terminal | Receives PWM signal; low input capacitance (Ciss = 363 pF) minimizes driver loading at 300–500 kHz. |
| Pin 2 (Drain) | High-side switch node | Exposed metal tab electrically connected to drain; requires insulating pad when mounted to heatsink. |
| Pin 3 (Source) | Reference return path | Serves as local ground reference for gate driver; low-inductance layout critical for dV/dt noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Commutation ruggedness | Validated 900 A/µs diF/dt capability ensures reliable body-diode turn-off in hard-switched PFC without oscillation or failure. |
| ESD robustness | HBM >2 kV eliminates need for external ESD protection during board handling and automated assembly. |
| Low ringing tendency | Optimized internal layout and gate charge profile suppress parasitic oscillation during fast dV/dt transitions (≤80 V/ns). |
| Thermal performance | 5.98 °C/W junction-to-case resistance enables 21 W dissipation at 25 °C case temperature for high-power density layouts. |
| Superjunction optimization | RDS(on) × A < 1 Ω·mm² enables smaller die size vs. prior P6 generation while maintaining 600 V rating and 150 °C Tj. |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
Use Scenario: Primary-side switch in active clamp forward or LLC resonant converter for 1U 1200 W server PSU. IC Role / Device Role / Timing Role: High-side switching element operating at 200–300 kHz with ZVS-assisted turn-on. Use Value: 1.1 µJ Eoss and 9 nC Qg reduce total switching loss by ≥18% versus P6-generation equivalents at 250 kHz. | Use Scenario: Boost PFC stage in -48 V telecom rectifier with universal AC input (90–264 VAC). IC Role / Device Role / Timing Role: Continuous conduction mode (CCM) switch handling 6 A RMS current with 900 A/µs diF/dt capability. Use Value: Body diode ruggedness eliminates need for external anti-parallel SiC Schottky, reducing BOM count and layout area. |
| LCD TV Power Board | UPS Inverter Stage |
Use Scenario: Main switch in half-bridge resonant converter powering LED backlight and main DC rails in 55″ LCD TV. IC Role / Device Role / Timing Role: Hard-switched PWM device operating at 50–100 kHz with 650 V VDS margin. Use Value: 600 mΩ RDS(on) at 150 °C maintains <1.2 W conduction loss at full load, enabling passive cooling. | Use Scenario: High-side switch in dual-active-bridge (DAB) isolated DC-DC stage of online UPS. IC Role / Device Role / Timing Role: Bidirectional switching element supporting synchronous rectification and reverse energy transfer. Use Value: 2500 Vrms isolation rating satisfies reinforced insulation requirements for battery-backed AC output circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPW60R099P7 | Lower RDS(on) (99 mΩ), higher Qg (33 nC), same 600 V rating and P7 platform | Better conduction loss but demands stronger gate driver; less suitable for high-frequency LLC where Qg dominates loss | Select when thermal budget is constrained and switching frequency ≤100 kHz |
| STP60N6F7 | 600 V, 60 mΩ, 38 nC, different superjunction process; no specified diF/dt or ESD rating | Lacks documented commutation ruggedness and ESD validation; not JEDEC-qualified for industrial life cycles | Consider only for cost-sensitive non-critical consumer applications with derated voltage margin |
Compared with IPW60R099P7 and STP60N6F7, IPA60R600P7SXKSA1 offers optimal balance of switching speed (9 nC Qg), ruggedness (900 A/µs), and qualification (JEDEC, 2500 Vrms), making it preferred for mission-critical 200–500 kHz telecom and server power stages.
Availability
IPA60R600P7SXKSA1 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and UPS inverters requiring stable component supply, long-term lifecycle support, and certified high-reliability MOSFETs.
Supply support for IPA60R600P7SXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions, with global manufacturing and R&D infrastructure.
The CoolMOS™ P7 product line targets high-efficiency, high-power-density AC-DC conversion systems-specifically engineered for PFC, LLC, and resonant topologies in datacenter, telecom, and industrial power supplies.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The maximum continuous drain current (ID) is 4 A at TC = 100 °C, as specified in Table 2 of the datasheet. This rating is thermally limited by the 150 °C maximum junction temperature and 5.98 °C/W junction-to-case thermal resistance. Operation above this current requires forced-air cooling or derating based on actual thermal design.
Does IPA60R600P7SXKSA1 require a gate resistor for stability?
Yes-a gate resistor (typically 10 Ω) is recommended to dampen ringing and control switching speed, especially in high-dV/dt applications. The datasheet specifies timing parameters (e.g., td(off), tf) using a 10 Ω resistor, and paralleling configurations explicitly advise ferrite beads or separate totem-pole drivers to prevent oscillation.
Is the body diode suitable for synchronous rectification?
No-the integrated body diode is optimized for hard commutation in PFC and freewheeling roles, not synchronous rectification. Its reverse recovery charge (Qrr = 0.71 µC) and trr (160 ns) are significantly higher than dedicated SR MOSFETs; using it as a synchronous rectifier would increase loss and EMI in low-voltage secondary-side stages.
Can IPA60R600P7SXKSA1 be used in parallel configurations?
Yes, but with strict layout and drive requirements: gate resistors must be individually placed close to each device, ferrite beads on gate lines are recommended, and separate totem-pole drivers are advised to ensure balanced turn-on/turn-off. The datasheet warns against direct paralleling without these measures due to potential current imbalance from parameter spread.
IPA60R600P7SXKSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™ P7
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 600mOhm @ 1.7A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 80µA
- Gate Charge (Qg) (Max) @ Vgs:
- 9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 363 pF @ 400 V
- FET Feature:
- -
- Power Dissipation (Max):
- 21W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- PG-TO220-FP
IPA60R600P7SXKSA1 FAQ
1.How can I place an order for IPA60R600P7SXKSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPA60R600P7SXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPA60R600P7SXKSA1 reliable?
The price and inventory of IPA60R600P7SXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPA60R600P7SXKSA1 is usually 5 days.
3.What payment methods are accepted for IPA60R600P7SXKSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPA60R600P7SXKSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPA60R600P7SXKSA1?
IPA60R600P7SXKSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPA60R600P7SXKSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPA60R600P7SXKSA1?
For technical support, including IPA60R600P7SXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPA60R600P7SXKSA1 requirements.
6.How does Aetrix verify that IPA60R600P7SXKSA1 is sourced from the original manufacturer or authorized distributors?
All IPA60R600P7SXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPA60R600P7SXKSA1 meets industry standards.
7.What is the process for return or replacement of IPA60R600P7SXKSA1?
All IPA60R600P7SXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPA60R600P7SXKSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPA60R600P7SXKSA1 part is unused and in its original packaging.
Return procedure for IPA60R600P7SXKSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPA60R600P7SXKSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

