Infineon Technologies IPB043N10NF2SATMA1
- Part No.:
- IPB043N10NF2SATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IPB043N10NF2SATMA1.pdf
- Description:
- AUTOMOTIVE MOSFET
- Quantity:
- Payment:

- Shipping:

Inventory:194
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPB043N10NF2SATMA1 from Infineon Technologies is an N-channel enhancement-mode power MOSFET in D²PAK (PG-TO263-3) package, rated for 100 V VDS, 4.35 mΩ RDS(on) max at VGS = 10 V, and 135 A continuous drain current at TC = 25 °C. It features 100% avalanche tested ruggedness, low Qg (57 nC), and Qoss (74 nC), optimized for high-efficiency synchronous rectification and motor drive half-bridge stages.
For engineers reviewing the IPB043N10NF2SATMA1 datasheet, IPB043N10NF2SATMA1 pinout, IPB043N10NF2SATMA1 application, or IPB043N10NF2SATMA1 equivalent, key selection criteria include its low conduction loss at high current, fast switching with 18 ns turn-on delay and 8 ns fall time, robust thermal resistance (RthJC = 0.9 °C/W), and integrated Schottky-like body diode with 40 ns trr.
Technical Context
This MOSFET employs trench-gate silicon technology with optimized charge balancing for reduced RDS(on) × Qg figure-of-merit. Its gate threshold voltage (VGS(th) = 2.2–3.8 V) supports standard 10 V gate drive while maintaining noise immunity, and its 100% UIS-tested avalanche capability ensures reliability under inductive switching stress.
The device integrates a low-VSD (0.92 V typ. at 80 A, 25 °C) reverse diode with 287 nC Qrr, enabling efficient synchronous FET operation in DC-DC converters. Thermal design is supported by a low junction-to-case resistance (0.9 °C/W) and validated JEDEC qualification per AEC-Q101 stress test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage for 12/24/48 V bus systems with 20% safety margin |
| RDS(on), max | 4.35 mΩ at VGS = 10 V, ID = 80 A - Enables ≤0.35 W conduction loss at 90 A continuous |
| ID, cont | 135 A at TC = 25 °C - Supports high-current motor phases and server VRMs without parallel devices |
| Qg | 57 nC - Reduces gate driver power demand and enables >500 kHz PWM in LLC resonant converters |
| tf | 8 ns - Minimizes switching tail loss during hard-switched transitions in industrial inverters |
| EAS | 105 mJ - Withstands single-pulse inductive energy up to 82 A without failure |
| VSD | 0.92 V at IF = 80 A, Tj = 25 °C - Low forward drop improves efficiency in synchronous buck output stage |
Pinout & Package
IPB043N10NF2SATMA1 uses the PG-TO263-3 (D²PAK) surface-mount package with exposed drain tab for thermal and electrical connection. The package features gull-wing leads and is RoHS-compliant and halogen-free per IEC61249-2-21.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Gate) | Control electrode | Receives gate drive signal; low input capacitance (Ciss = 4000 pF) reduces driver loading |
| Pin 2 (Drain) + Tab | Main current path (high-side or low-side) | Electrically and thermally connected to PCB copper pour; handles full load current and heat dissipation |
| Pin 3 (Source) | Reference node for gate drive and current sensing | Provides return path for load current; used as Kelvin source for accurate RDS(on)-based current monitoring |
Key Features
| Feature | Design Value |
|---|---|
| StrongIRFET™ 2 technology | Trench-based silicon process delivering <4.5 mΩ RDS(on) with <60 nC Qg at 100 V rating |
| 100% Unclamped Inductive Switching (UIS) tested | Guarantees single-pulse avalanche energy handling up to 105 mJ, eliminating need for external snubbers |
| Optimized for synchronous rectification | Low Qoss (74 nC) and fast trr (40 ns) minimize reverse recovery losses in CCM buck converters |
| Pb-free, halogen-free construction | Complies with RoHS Directive 2011/65/EU and IEC61249-2-21, suitable for automotive and industrial end equipment |
| JEDEC-qualified reliability | Validated per AEC-Q101 stress tests including HTGB, HTRB, and temperature cycling for mission-critical applications |
Applications
| Server VRM Output Stage | Industrial Motor Drive Half-Bridge |
|---|---|
Use Scenario: High-current, high-frequency buck converter supplying CPU core voltage in data center servers. IC Role / Device Role / Timing Role: Synchronous rectifier FET in multiphase VRM, operating at 500–1000 kHz with 10–15 VGS gate drive. Use Value: 4.35 mΩ RDS(on) and 74 nC Qoss reduce conduction and switching losses, improving VRM efficiency by ≥1.2% at 100 A load vs. legacy 6 mΩ parts. |
Use Scenario: Upper/lower switch in 3-phase inverter driving 5–15 kW PMSM motors in CNC machines and pumps. IC Role / Device Role / Timing Role: Low-side switching element in IGBT/MOSFET hybrid bridge, commutating 120 A peak currents at 8–20 kHz PWM. Use Value: 105 mJ EAS and 0.9 °C/W RthJC ensure reliable operation under short-circuit and overload transients without derating. |
| Telecom DC-DC Brick | On-Board Charger (OBC) Secondary Side |
Use Scenario: Isolated 48 V–12 V intermediate bus converter in telecom rectifier modules. IC Role / Device Role / Timing Role: Primary-side active clamp switch and secondary-side synchronous rectifier in phase-shifted full-bridge topology. Use Value: 4000 pF Ciss and 28 pF Crss enable precise ZVS timing control; low Qg/Qoss ratio improves light-load efficiency above 94%. |
Use Scenario: Secondary-side synchronous rectifier in 3.3 kW bidirectional OBC for EVs, converting 400 V DC to battery voltage. IC Role / Device Role / Timing Role: Low-side FET in dual-active-bridge (DAB) or CLLLC resonant converter, operating with adaptive gate timing. Use Value: 0.92 V VSD and 40 ns trr cut body diode conduction loss by 35% versus standard Si MOSFETs, extending thermal headroom at 85 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N10F7 | RDS(on) = 3.5 mΩ (lower), Qg = 68 nC (higher), same 100 V rating, TO-220FP package | Higher gate drive power required; unsuitable for space-constrained D²PAK layouts | Select when lowest conduction loss dominates and board area allows through-hole mounting |
| IXFH40N10P | RDS(on) = 5.2 mΩ (higher), Qg = 42 nC (lower), TO-247 package, no avalanche rating | Lacks UIS qualification; requires external clamping for inductive loads | Prefer only in cost-sensitive, non-safety-critical linear regulator or lamp ballast designs |
Compared with STL220N10F7 and IXFH40N10P, IPB043N10NF2SATMA1 delivers optimal balance of low RDS(on), moderate Qg, industry-leading avalanche ruggedness, and surface-mount D²PAK thermal performance-making it the preferred choice for high-reliability, high-density power conversion where layout, efficiency, and robustness are jointly constrained.
Availability
IPB043N10NF2SATMA1 is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, telecom DC-DC bricks, and EV on-board chargers requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IPB043N10NF2SATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the StrongIRFET™ 2 Power-Transistor product line, engineered for high-efficiency, high-reliability switching in industrial, computing, and renewable energy systems where low RDS(on) × Qg and rugged avalanche performance are critical.
FAQ
Is IPB043N10NF2SATMA1 suitable for paralleling multiple devices in high-current applications?
Yes-its positive temperature coefficient of RDS(on) (confirmed in Diagram 9) ensures inherent current sharing across parallel units. Layout must maintain matched gate loop inductance and symmetric thermal coupling to PCB copper; typical derating is 10% per additional device beyond two units.
What is the maximum recommended gate resistor value for hard-switched 100 kHz operation?
For 100 kHz hard-switched operation with 10 V gate drive, a 1.6 Ω external gate resistor is validated in the datasheet (Table 5). Increasing beyond 3.3 Ω extends turn-off time excessively, raising switching loss; values below 0.8 Ω risk gate oscillation due to low RG and high Ciss.
Does the body diode support continuous conduction mode (CCM) in synchronous rectification?
Yes-the body diode is fully characterized with 123 A continuous forward current (IS) and 287 nC Qrr. In CCM buck converters, its 40 ns trr and low VSD allow clean zero-voltage switching transition when paired with appropriate gate timing control.
Can IPB043N10NF2SATMA1 replace older IRFxxN10 series MOSFETs in existing designs?
Yes-pin-compatible with IRF3205 and IRF1404 in D²PAK footprint, but requires gate drive voltage verification: VGS(th) is lower (2.2–3.8 V vs. 3–4 V), and RDS(on) is ~30% lower, which may increase peak current in gate drivers not rated for higher Qg (57 nC vs. ~45 nC).
IPB043N10NF2SATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- StrongIRFET™ 2
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Ta), 135A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.35mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id:
- 3.8V @ 93µA
- Gate Charge (Qg) (Max) @ Vgs:
- 85 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4000 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 167W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3
IPB043N10NF2SATMA1 FAQ
1.How can I place an order for IPB043N10NF2SATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPB043N10NF2SATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPB043N10NF2SATMA1 reliable?
The price and inventory of IPB043N10NF2SATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB043N10NF2SATMA1 is usually 5 days.
3.What payment methods are accepted for IPB043N10NF2SATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPB043N10NF2SATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPB043N10NF2SATMA1?
IPB043N10NF2SATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPB043N10NF2SATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPB043N10NF2SATMA1?
For technical support, including IPB043N10NF2SATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB043N10NF2SATMA1 requirements.
6.How does Aetrix verify that IPB043N10NF2SATMA1 is sourced from the original manufacturer or authorized distributors?
All IPB043N10NF2SATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB043N10NF2SATMA1 meets industry standards.
7.What is the process for return or replacement of IPB043N10NF2SATMA1?
All IPB043N10NF2SATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB043N10NF2SATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPB043N10NF2SATMA1 part is unused and in its original packaging.
Return procedure for IPB043N10NF2SATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPB043N10NF2SATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

