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Infineon Technologies IPB65R660CFDAATMA1

Part No.:
IPB65R660CFDAATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIPB65R660CFDAATMA1.pdf
Description:
MOSFET N-CH 650V 6A D2PAK
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,016

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Product details

Overview

IPB65R660CFDAATMA1 from Infineon Technologies is a 650 V, 0.66 Ω RDS(on) superjunction N-channel power MOSFET in PG-TO263-3 (D²PAK) package, featuring ultra-fast body diode (trr = 65 ns, Qrr = 0.2 µC), high commutation ruggedness (di/dt = 900 A/µs), and low gate charge (Qg = 20 nC). It is qualified to AEC-Q101 and designed for resonant switching in high-efficiency AC-DC adapters and server SMPS.

For engineers reviewing the IPB65R660CFDAATMA1 datasheet, IPB65R660CFDAATMA1 pinout, IPB65R660CFDAATMA1 application, or IPB65R660CFDAATMA1 equivalent, key selection criteria include body diode robustness in ZVS/ZCS topologies, Eoss (1.8 µJ @ 400 V), thermal resistance (RthJC = 2 K/W), and gate drive simplicity (VGS(th) = 3.5–4.5 V).

Technical Context

This CoolMOS™ CFDA device implements a superjunction cell structure optimized for high-voltage switching with minimized conduction and switching losses. Its low FOM (RDS(on) × Qg) enables high-frequency operation while maintaining low conduction loss at 6 A continuous drain current (TC = 100 °C).

The integrated ultra-fast body diode supports hard-commutated and resonant topologies without external anti-parallel diodes. Its 900 A/µs di/dt rating and 115 mJ single-pulse avalanche energy ensure reliable operation under dynamic overcurrent and inductive turn-off stress.

Key Specifications

ParameterValue and Actual Design Meaning
VDS650 V - Supports primary-side switching in universal-input 85–265 VAC offline converters up to 400 V DC bus.
RDS(on), max0.66 Ω @ Tj = 25 °C - Enables <1.5 W conduction loss at 3.2 A, suitable for medium-power SMPS (≤150 W).
Qg, typ20 nC - Reduces gate drive power and allows use of low-cost, low-current gate drivers (e.g., 1-A peak).
Eoss @ 400 V1.8 µJ - Low stored output capacitance energy minimizes switching loss in soft-switching LLC and PFC stages.
trr65 ns - Enables clean zero-current switching transitions in phase-shifted full-bridge and resonant converters.
di/dt (body diode)900 A/µs - Sustains fast reverse recovery without oscillation or voltage overshoot in high-dV/dt environments.
RthJC2 K/W - Allows direct heatsink mounting for thermally constrained designs; 62.5 W Ptot at TC = 25 °C.

Pinout & Package

IPB65R660CFDAATMA1 is housed in PG-TO263-3 (D²PAK) package with exposed drain pad for thermal enhancement. Pin 1 = Gate, Pin 2 = Drain (tab), Pin 3 = Source.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Gate)Control electrodeReceives 10 V logic-level drive; threshold voltage 3.5–4.5 V ensures compatibility with standard PWM controllers.
Pin 2 (Drain)High-side power terminalExposed metal tab electrically connected to drain; must be isolated from heatsink unless referenced to same potential.
Pin 3 (Source)Reference node / return pathServes as common reference for gate drive and current sensing; low-inductance layout critical for EMI control.

Key Features

FeatureDesign Value
Ultra-fast body diodetrr = 65 ns, Qrr = 0.2 µC - Eliminates need for external SiC/Schottky diode in LLC synchronous rectification.
High commutation ruggednessdi/dt = 900 A/µs, EAS = 115 mJ - Withstands abrupt current reversal in hard-switched PFC boost stages without failure.
Low gate charge & input capacitanceQg = 20 nC, Ciss = 543 pF - Reduces driver power dissipation and improves switching speed control fidelity.
AEC-Q101 qualificationQualified for automotive-grade reliability - Validated for temperature cycling, HTRB, and UIS per AEC standard.
Green packagingRoHS-compliant, Pb-free plating, halogen-free mold compound - Meets IPC/JEDEC J-STD-020 moisture sensitivity level 1.

Applications

Server Power SupplyIndustrial AC-DC Adapter

Use Scenario: Primary-side switch in 80+ Titanium-certified 1 kW server PSU using asymmetric half-bridge topology.

IC Role / Device Role / Timing Role: High-side switching element handling 400 V DC bus; operates at 100–300 kHz with ZVS-assisted turn-on.

Use Value: Ultra-low Eoss (1.8 µJ) reduces dead-time loss; robust body diode prevents shoot-through during transition.

Use Scenario: Main switch in 200 W industrial DIN-rail power supply with wide input range (85–305 VAC).

IC Role / Device Role / Timing Role: Active clamp flyback switch managing 650 V blocking and 17 A pulsed drain current.

Use Value: 900 A/µs di/dt rating ensures stable operation during line transients; RthJC = 2 K/W simplifies thermal design on compact PCB.

Telecom Rectifier ModuleEV Onboard Charger PFC Stage

Use Scenario: Boost PFC switch in -48 V telecom rectifier operating at 65 kHz with 96% efficiency target.

IC Role / Device Role / Timing Role: Fast-switching MOSFET controlling inductor current in continuous conduction mode (CCM).

Use Value: Low RDS(on) (0.66 Ω) minimizes conduction loss at 6 A RMS; Qg = 20 nC enables precise gate timing.

Use Scenario: Interleaved boost PFC stage in 6.6 kW OBC handling 240 VAC input and 450 V DC link.

IC Role / Device Role / Timing Role: High-reliability switching device subjected to repeated avalanche stress during grid surges.

Use Value: 115 mJ single-pulse avalanche energy provides margin against line-induced overvoltage events without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPP65R660CFDASame die, PG-TO220-3 package; RthJC = 2 K/W but higher RthJA (62 K/W); no exposed drain pad.Preferred for prototyping or low-volume through-hole assembly; less efficient thermal transfer than D²PAK.Select when board space permits TO-220 footprint and heatsinking uses clip-on solution.
IPW65R660CFDASame die, TO-247-3 package; identical RDS(on), Qg, and Eoss; RthJC = 1.5 K/W, higher Ptot (104 W).Used in high-power (>300 W) industrial inverters requiring maximum thermal headroom and mechanical robustness.Choose for production systems demanding highest power density and long-term thermal cycling reliability.

Compared with IPP65R660CFDA and IPW65R660CFDA, IPB65R660CFDAATMA1 offers optimal balance of surface-mount manufacturability, thermal performance (RthJC = 2 K/W), and PCB area efficiency-making it ideal for high-volume, space-constrained server and telecom power supplies.

Availability

IPB65R660CFDAATMA1 is available at Aetrix Electronics and suitable for server power supplies, industrial AC-DC adapters, telecom rectifier modules, and EV onboard charger PFC stages requiring stable component supply and AEC-Q101 compliance.

Supply support for IPB65R660CFDAATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive microcontrollers, and security ICs, with global R&D and manufacturing infrastructure.

The CoolMOS™ CFDA series targets high-efficiency, high-reliability switching applications in server, telecom, and industrial power conversion-emphasizing ultra-fast body diode performance and ruggedness in resonant topologies.

FAQ

What is the maximum continuous drain current for IPB65R660CFDAATMA1 at 100°C case temperature?

The maximum continuous drain current is 3.8 A at TC = 100 °C, limited by junction temperature (Tj ≤ 150 °C). This rating assumes proper heatsinking with RthJC = 2 K/W and accounts for RDS(on) increase to 1.544 Ω at elevated temperature. Derating curves in the datasheet confirm linear reduction from 6 A at 25 °C.

Does IPB65R660CFDAATMA1 require a negative gate voltage for reliable turn-off?

No. The device has a gate threshold voltage of 3.5–4.5 V and is fully controllable with 0–10 V or 0–12 V gate drive. Negative gate bias is not required for safe turn-off; however, a small negative offset (e.g., –2 V) may improve noise immunity in high-dV/dt environments without affecting reliability.

How does the body diode performance compare to standard silicon MOSFETs?

Its body diode achieves trr = 65 ns and Qrr = 0.2 µC-up to 5× faster and with 70% less recovered charge than conventional 650 V SJ-MOSFETs. This results in lower diode conduction loss, reduced EMI, and elimination of external snubbers in resonant converters.

Is IPB65R660CFDAATMA1 suitable for use in non-isolated buck converters?

Yes, but only in low-duty-cycle, high-input-voltage configurations (e.g., 400 V input → 12 V output) where VDS stress remains below 650 V. Its 650 V rating provides margin for voltage spikes, and low Qg supports high-frequency operation. However, its RDS(on) is optimized for medium-power SMPS-not ultra-low-voltage buck stages.

IPB65R660CFDAATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
CoolMOS™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
660mOhm @ 3.2A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 200µA
Gate Charge (Qg) (Max) @ Vgs:
20 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
543 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
62.5W (Tc)
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TO263-3

IPB65R660CFDAATMA1 FAQ

1.How can I place an order for IPB65R660CFDAATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IPB65R660CFDAATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IPB65R660CFDAATMA1 reliable?

The price and inventory of IPB65R660CFDAATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPB65R660CFDAATMA1 is usually 5 days.

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5.How can I obtain technical support or documentation for IPB65R660CFDAATMA1?

For technical support, including IPB65R660CFDAATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPB65R660CFDAATMA1 requirements.

6.How does Aetrix verify that IPB65R660CFDAATMA1 is sourced from the original manufacturer or authorized distributors?

All IPB65R660CFDAATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPB65R660CFDAATMA1 meets industry standards.

7.What is the process for return or replacement of IPB65R660CFDAATMA1?

All IPB65R660CFDAATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPB65R660CFDAATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IPB65R660CFDAATMA1 part is unused and in its original packaging.

Return procedure for IPB65R660CFDAATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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