Infineon Technologies IPD60R600C6ATMA1

Overview

IPD60R600C6ATMA1 from Infineon Technologies is a 600 V, 0.6 Ω R_DS(on) CoolMOS™ C6 superjunction MOSFET optimized for hard-switching and resonant topologies in industrial SMPS, PFC stages, and server power supplies. It delivers 11 A continuous drain current at T_C = 100 °C with ultra-low gate charge (Q_g = 19.5 nC) and low E_oss (170 nJ), enabling high-efficiency, compact 1–3 kW designs.

For engineers reviewing the IPD60R600C6ATMA1 datasheet, IPD60R600C6ATMA1 pinout, IPD60R600C6ATMA1 application, or IPD60R600C6ATMA1 equivalent, key selection criteria include its 600 V V_DSS, 0.6 Ω max R_DS(on) at 100 °C, 19.5 nC total gate charge, 170 nJ output capacitance energy, and qualification per JEDEC JESD47 for industrial reliability.

Technical Context

This device implements Infineon's CoolMOS™ C6 technology based on superjunction architecture with optimized charge balancing and trench-gate design. It achieves low conduction loss (R_DS(on) = 0.6 Ω @ 100 °C) while maintaining fast switching (t_r = 12 ns, t_f = 20 ns) and low E_oss (170 nJ @ 400 V).

The MOSFET supports hard-switched PFC, LLC resonant converters, and phase-shifted full-bridge topologies. Its gate threshold voltage (V_GS(th) = 3.0–4.5 V) and low Q_gd/Q_g ratio (0.28) ensure robust noise immunity and reduced Miller-induced shoot-through risk in high-frequency operation.

Key Specifications

Pinout & Package

IPD60R600C6ATMA1 is housed in a surface-mount TO-252 (DPAK) package with exposed drain pad for enhanced thermal performance. The package features gull-wing leads compatible with standard reflow soldering and provides 1.5 K/W junction-to-case thermal resistance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage superjunction MOSFET applications.

Compared with STP60N6F6 and IXFH60N60X3, IPD60R600C6ATMA1 offers the lowest R_DS(on) × Q_g FoM and full industrial qualification-making it optimal for space-constrained, high-reliability 1–3 kW power systems where efficiency and lifecycle assurance are prioritized.

Availability

IPD60R600C6ATMA1 is available at Aetrix Electronics and suitable for industrial SMPS, server power supplies, and telecom rectifiers requiring stable component supply across multi-year production cycles.

Supply support for IPD60R600C6ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices.

The CoolMOS™ C6 series targets high-efficiency, high-power-density AC-DC and DC-DC conversion in industrial, server, and telecom infrastructure-emphasizing low-loss switching and long-term reliability under continuous thermal stress.

FAQ

What is the maximum continuous drain current for IPD60R600C6ATMA1 at 100 °C case temperature?

The maximum continuous drain current is 11 A at T_C = 100 °C, verified per datasheet Rev. 2.6 test conditions using a 10 cm² 2-oz copper pad on FR-4 PCB. This rating assumes proper thermal vias and minimal ambient airflow, and derates linearly to 15.5 A at T_C = 25 °C.

Does IPD60R600C6ATMA1 require a negative gate voltage for reliable turn-off?

No. The device has a gate threshold voltage range of 3.0–4.5 V and is fully specified for 0 V turn-off. A negative gate voltage is not required, though a small negative bias (−2 V to −5 V) may be used in noisy environments to improve noise immunity without affecting reliability.

Can IPD60R600C6ATMA1 replace older CoolMOS™ C3 or C7 devices in existing designs?

It can directly replace C3 variants with identical pinout and lower R_DS(on), but C7 devices have different gate charge profiles and higher V_GS(th). Layout review is required for C7 drop-in use-especially gate resistor and snubber values-to avoid oscillation due to lower Q_gd and faster switching.

Is the TO-252 package of IPD60R600C6ATMA1 suitable for reflow soldering in high-volume manufacturing?

Yes. The device is qualified per IPC/JEDEC J-STD-020 Class 1 (MSL-1), supporting unlimited floor life and standard lead-free reflow profiles (peak 260 °C). The exposed drain pad must be soldered to ≥20 mm² of 2-oz copper with ≥6 thermal vias (0.3 mm diameter) for optimal thermal performance.