Infineon Technologies IPG20N06S2L65ATMA1
- Part No.:
- IPG20N06S2L65ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 8-PowerVDFN
- Datasheet:
-
IPG20N06S2L65ATMA1.pdf
- Description:
- MOSFET 2N-CH 55V 20A 8TDSON
- Quantity:
- Payment:

- Shipping:

Inventory:26,581
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IPG20N06S2L65ATMA1 from Infineon Technologies is a dual-channel N-channel logic-level enhancement-mode MOSFET in PG-TDSON-8 package, rated for 55 V VDS, 20 A continuous drain current (TC = 25 °C), and 65 mΩ max RDS(on) at VGS = 10 V. It is AEC-Q101 qualified, 100% avalanche tested, and designed for automotive powertrain and body electronics requiring robust 175 °C operation.
For engineers reviewing the IPG20N06S2L65ATMA1 datasheet, IPG20N06S2L65ATMA1 pinout, IPG20N06S2L65ATMA1 application, or IPG20N06S2L65ATMA1 equivalent, key selection criteria include its dual-channel logic-level gate drive compatibility (VGS(th) = 1.2–2.0 V), low 3.5 K/W RthJC, and integrated avalanche energy rating of 40 mJ (ID = 10 A).
Technical Context
This dual N-channel MOSFET integrates two identical silicon die in a single PG-TDSON-8 thermally enhanced leadless package with exposed drain pad. Its logic-level gate threshold (1.2–2.0 V) enables direct drive from 3.3 V/5 V microcontrollers without level-shifting circuitry.
It features 315–410 pF input capacitance (Ciss) and 9.4–12 nC total gate charge (Qg), supporting high-frequency switching up to 1 MHz while maintaining low conduction loss (RDS(on) = 53–65 mΩ @ VGS = 10 V, ID = 15 A) and fast switching transitions (tr = 3 ns, tf = 7 ns).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 55 V - Maximum blocking voltage for 12 V/24 V automotive systems with transient margin |
| RDS(on) max | 65 mΩ @ VGS = 10 V, ID = 15 A - Enables <1.3 W conduction loss at 20 A in half-bridge configuration |
| ID continuous | 20 A @ TC = 25 °C - Supports high-current motor control and load switching in compact PCB layouts |
| EAS | 40 mJ @ ID = 10 A - Confirmed single-pulse avalanche ruggedness for inductive load turn-off protection |
| RthJC | 3.5 K/W - Enables efficient heat transfer to heatsink or copper plane, critical for 175 °C junction operation |
| Qg | 9.4–12 nC - Determines gate driver power requirement and switching loss trade-off at 100 kHz–1 MHz |
| VGS(th) | 1.2–2.0 V - Ensures reliable turn-on with standard logic-level MCU outputs (3.3 V/5 V) |
Pinout & Package
PG-TDSON-8 (8-pin leadless thermally enhanced package) with exposed drain pad on bottom surface for optimal thermal performance. Pin 1–4 and 5–8 are symmetrical dual-channel source/gate/drain terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source 1 / Source 2 | Low-side return paths for each channel; internally connected to common source terminal in half-bridge layout |
| 5, 6 | Gate 1 / Gate 2 | Independent logic-level inputs enabling asynchronous or complementary control of both channels |
| 7, 8 | Drain 1 / Drain 2 | High-current output nodes; electrically isolated but thermally coupled via shared exposed pad |
| Exposed Pad | Drain (common) | Primary thermal path to PCB copper; must be soldered to ≥6 cm² cooling area per channel for rated Ptot |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive powertrain and chassis applications per stress test requirements |
| 100% unclamped inductive switching (UIS) tested | Each unit verified for 40 mJ single-pulse avalanche energy, ensuring field reliability under inductive fault conditions |
| Logic-level gate drive (VGS(th) ≤ 2.0 V) | Eliminates need for external gate drivers when interfacing with 3.3 V CAN/LIN microcontrollers |
| MSL1 rating (260 °C peak reflow) | Compatible with standard lead-free SMT assembly processes without moisture sensitivity concerns |
| Green Product (RoHS compliant) | Meets EU Directive 2011/65/EU with no exemptions required for automotive supply chain compliance |
Applications
| Automotive Body Control Module (BCM) | Electric Power Steering (EPS) Motor Driver |
|---|---|
Use Scenario: Driving solenoids, relays, and LED arrays in door modules, seat controls, and lighting subsystems. IC Role / Device Role / Timing Role: Dual-channel high-side/low-side switch providing independent load control with integrated avalanche protection. Use Value: Reduces BOM count by replacing two discrete MOSFETs; 175 °C rating ensures operation in engine bay-adjacent locations. | Use Scenario: Half-bridge phase-leg switching for 3-phase brushless DC motor commutation in EPS assist systems. IC Role / Device Role / Timing Role: Dual N-channel power stage with matched RDS(on) and fast switching (tr/tf ≤ 10 ns) for precise PWM timing control. Use Value: Enables >95% efficiency at 20 A continuous current while meeting ASIL-B functional safety constraints via AEC-Q101 validation. |
| On-Board Charger (OBC) Auxiliary Power Supply | Automotive HVAC Blower Control |
Use Scenario: Isolated DC-DC converter primary-side switching in 3.3 V/5 V auxiliary rails for OBC control ICs. IC Role / Device Role / Timing Role: Synchronous rectifier or active clamp switch operating at 100–300 kHz with low Qg and Coss. Use Value: 9.4–12 nC Qg and 90–120 pF Coss minimize switching losses and EMI generation in high-density OBC designs. | Use Scenario: PWM-controlled DC fan motor driving in climate control systems with variable speed demand. IC Role / Device Role / Timing Role: Low-side switch in H-bridge configuration with integrated body diode (VSD = 1.0–1.3 V @ 15 A). Use Value: Eliminates need for external freewheeling diodes; 80 A pulsed current rating supports stall-current surge during startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPG20N06S2L45ATMA1 | Lower RDS(on) (45 mΩ max), higher Qg (14 nC), same package and VGS(th) | Better conduction efficiency but higher gate drive loss above 200 kHz | Select when thermal budget is constrained and switching frequency <100 kHz |
| IRF7341PBF | Higher RDS(on) (90 mΩ), non-AEC-Q101, SO-8 package, lower thermal performance (RthJC = 6.2 K/W) | Limited to non-automotive industrial use; unsuitable for 175 °C ambient environments | Select only for cost-sensitive non-automotive prototypes with derated current |
Compared with IPG20N06S2L45ATMA1 and IRF7341PBF, the IPG20N06S2L65ATMA1 delivers optimal balance of avalanche ruggedness, automotive qualification, and thermal efficiency-making it the preferred choice for production-grade 12 V/24 V automotive power stages where reliability and 175 °C operation are mandatory.
Availability
IPG20N06S2L65ATMA1 is available at Aetrix Electronics and suitable for automotive body control modules, electric power steering systems, and on-board charger auxiliary supplies requiring stable component supply across multi-year vehicle production cycles.
Supply support for IPG20N06S2L65ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and R&D centers.
This device belongs to the OptiMOS® 2L family of logic-level automotive MOSFETs, engineered specifically for high-reliability 12 V/24 V vehicle electrical systems demanding AEC-Q101 compliance and extended temperature operation.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The IPG20N06S2L65ATMA1 supports continuous operation up to +175 °C junction temperature, validated per AEC-Q101 stress testing. This allows deployment in under-hood environments where ambient temperatures exceed 125 °C, provided PCB thermal design maintains Tj ≤ 175 °C using the specified 6 cm² copper cooling area.
Does this MOSFET require external gate resistors for safe switching?
Yes-gate resistors are required to control dV/dt and prevent oscillation. With 9.4–12 nC total gate charge and fast intrinsic switching (tr = 3 ns), a 10–22 Ω series resistor is recommended to limit peak gate current and damp ringing, especially in half-bridge configurations with parasitic inductance >5 nH.
Can both channels be paralleled to increase current handling?
No-channels are electrically isolated but not matched for current sharing. The datasheet specifies parameters per channel (e.g., ID = 20 A per channel), and thermal coupling via the shared exposed pad does not guarantee balanced current distribution. Parallel operation requires external current-sensing and active balancing circuitry.
Is the body diode suitable for synchronous rectification in DC-DC converters?
Yes-the integrated body diode has VSD = 1.0–1.3 V at 15 A and trr = 30 ns, making it usable for low-frequency (<200 kHz) synchronous rectification. However, its Qrr = 28 nC limits efficiency in high-frequency topologies where dedicated Schottky or GaN devices offer superior recovery performance.
IPG20N06S2L65ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 55V
- Current - Continuous Drain (Id) @ 25°C:
- 20A
- Rds On (Max) @ Id, Vgs:
- 65mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 14µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 410pF @ 25V
- Power - Max:
- 43W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-4
IPG20N06S2L65ATMA1 FAQ
1.How can I place an order for IPG20N06S2L65ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for IPG20N06S2L65ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IPG20N06S2L65ATMA1 reliable?
The price and inventory of IPG20N06S2L65ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IPG20N06S2L65ATMA1 is usually 5 days.
3.What payment methods are accepted for IPG20N06S2L65ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IPG20N06S2L65ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IPG20N06S2L65ATMA1?
IPG20N06S2L65ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IPG20N06S2L65ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IPG20N06S2L65ATMA1?
For technical support, including IPG20N06S2L65ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IPG20N06S2L65ATMA1 requirements.
6.How does Aetrix verify that IPG20N06S2L65ATMA1 is sourced from the original manufacturer or authorized distributors?
All IPG20N06S2L65ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IPG20N06S2L65ATMA1 meets industry standards.
7.What is the process for return or replacement of IPG20N06S2L65ATMA1?
All IPG20N06S2L65ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with IPG20N06S2L65ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IPG20N06S2L65ATMA1 part is unused and in its original packaging.
Return procedure for IPG20N06S2L65ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IPG20N06S2L65ATMA1 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

