STMicroelectronics IRF630FP
- Part No.:
- IRF630FP
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
IRF630FP.pdf
- Description:
- MOSFET N-CH 200V 9A TO220FP
- Quantity:
- Payment:

- Shipping:

Inventory:4,020
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF630FP from STMicroelectronics is an N-channel enhancement-mode Power MOSFET in TO-220 package, rated for 200 V VDS, 0.40 Ω max RDS(on) at 10 V VGS, and 9 A continuous drain current at TC = 25 °C. It serves as a primary high-voltage switching element in isolated DC-DC converters, leveraging STripFET™ process for minimized gate charge (11.6 nC) and intrinsic capacitance.
For engineers reviewing the IRF630FP datasheet, IRF630FP pinout, IRF630FP application, or IRF630FP equivalent, key selection criteria include avalanche ruggedness (110 mJ), dv/dt capability (5.8 V/ns), thermal resistance (1.26 °C/W junction-to-case), and source-drain diode recovery performance (118.5 ns trr, 393 nC Qrr).
Technical Context
This MOSFET employs ST's STripFET™ process to achieve low input capacitance (Ciss = 370 pF) and reduced gate charge-critical for high-frequency, high-efficiency hard-switched topologies. Its safe operating area supports pulsed drain currents up to 36 A with robust unclamped inductive switching capability.
The device integrates a fast-recovery body diode (trr = 118.5 ns, Qrr = 393 nC) and exhibits stable threshold voltage (VGS(th) = 2–4 V) and on-resistance over temperature (RDS(on) normalized to 1.0 at 25 °C, ~2.2× at 150 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V - supports primary-side switching in 100–200 V bus applications like telecom PSUs and industrial SMPS |
| RDS(on) max | 0.40 Ω at VGS = 10 V, ID = 4.5 A - determines conduction loss and thermal rise under full-load conditions |
| ID cont. | 9 A at TC = 25 °C - defines maximum continuous current before derating due to thermal limits |
| Qg | 11.6 nC - directly impacts gate drive power and switching speed in high-frequency designs |
| EAS | 110 mJ - enables reliable operation under unclamped inductive load transients without failure |
| dv/dt ruggedness | 5.8 V/ns - ensures immunity to parasitic turn-on during high-slew-rate switching events |
| trr | 118.5 ns - reduces switching losses and EMI in synchronous rectification and flyback configurations |
Pinout & Package
IRF630FP uses a TO-220 type A package with insulated tab (D = Drain connected to metal tab). Pin assignment is standardized: Pin 1 = Gate (G), Pin 2 = Drain (D, electrically connected to tab), Pin 3 = Source (S).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Control terminal | Receives gate drive signal; requires ≥10 V for full enhancement; sensitive to ESD and ringing |
| D (Pin 2 / Tab) | High-side power path | Drain connects directly to metal tab-must be electrically isolated from heatsink unless referenced to same potential |
| S (Pin 3) | Reference node | Source ties to power ground or low-side return; forms common reference for gate drive and current sensing |
Key Features
| Feature | Design Value |
|---|---|
| STripFET™ process integration | Reduces Ciss to 370 pF and Qg to 11.6 nC-enabling >300 kHz switching in phase-shifted full-bridge converters |
| High dv/dt immunity | 5.8 V/ns rating prevents spurious turn-on in high-noise environments such as motor drives and PFC stages |
| Robust avalanche capability | 110 mJ single-pulse energy absorption allows operation without external snubbers in inductive switching circuits |
| Low RDS(on) temperature coefficient | RDS(on) increases only ~2.2× from 25 °C to 150 °C-supports stable current sharing in paralleled configurations |
Applications
| Telecom DC-DC Converters | Industrial SMPS |
|---|---|
Use Scenario: Primary-side switch in 48 V input, 300–500 W isolated forward or half-bridge converters powering base station subsystems. IC Role / Device Role / Timing Role: High-voltage power switch handling 200 V bus with 100–250 kHz PWM; body diode conducts during dead-time in synchronous rectified outputs. Use Value: Low Qg and Ciss reduce gate drive loss and improve efficiency above 92% at full load; avalanche rating eliminates need for clamping circuits. | Use Scenario: Main switching transistor in 3-phase rectified 380 V input industrial power supplies for PLCs and HMIs. IC Role / Device Role / Timing Role: Hard-switched primary switch operating at 60–120 kHz; withstands line surges and load dump transients via 200 V VDS and 110 mJ EAS. Use Value: 1.26 °C/W Rth(j-c) enables direct mounting to aluminum heatsinks without thermal interface pads in convection-cooled enclosures. |
| UPS Inverter Stages | LED Driver Power Stages |
Use Scenario: Output H-bridge switch in online double-conversion UPS inverters delivering 230 VAC from 360–400 VDC bus. IC Role / Device Role / Timing Role: Bidirectional switching element conducting both AC half-cycles; body diode provides freewheeling path during polarity reversal. Use Value: Fast trr (118.5 ns) and low Qrr (393 nC) minimize cross-conduction loss and thermal stress during zero-voltage switching transitions. | Use Scenario: High-side switch in constant-current LED drivers for street lighting using buck-boost topology with 150–200 V input. IC Role / Device Role / Timing Role: Regulated current source switch controlling LED string current; operates in linear region during dimming and fully saturated during full output. Use Value: Stable VGS(th) (2–4 V) and low RDS(on) tolerance ensure precise current regulation across ambient temperatures from −40 °C to +85 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP20NM20 | 200 V VDS, 0.22 Ω RDS(on), 20 A ID, TO-220 - lower on-resistance but higher Qg (29 nC) | Better conduction loss at high current; less suitable for >200 kHz due to gate charge | Select when thermal budget is tight and switching frequency ≤100 kHz |
| IRF640NPBF | 200 V VDS, 0.18 Ω RDS(on), 18 A ID, TO-220 - improved RDS(on) and current rating, same Qg (12 nC) | Higher current capacity and lower conduction loss; identical dv/dt and avalanche specs | Preferred for new designs requiring margin in ID or RDS(on) without changing layout or drive |
Compared with IRF630FP, STP20NM20 offers lower conduction loss but demands stronger gate drive; IRF640NPBF delivers superior current handling and efficiency while maintaining identical switching behavior and footprint compatibility.
Availability
IRF630FP is available at Aetrix Electronics and suitable for telecom DC-DC converters, industrial SMPS, and UPS inverter stages requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IRF630FP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
The IRF630FP belongs to ST's STripFET™ Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in isolated power conversion systems where low gate charge and avalanche robustness are critical.
FAQ
What is the maximum safe operating temperature for IRF630FP?
The IRF630FP has a maximum operating junction temperature of 175 °C and a storage temperature range of −65 to +175 °C. At TC = 100 °C, its continuous drain current is derated to 6.5 A. Thermal design must maintain TJ ≤ 175 °C under worst-case conduction and switching loss conditions, using the specified Rth(j-c) = 1.26 °C/W and appropriate heatsinking.
Does IRF630FP have a built-in body diode, and what are its characteristics?
Yes, IRF630FP integrates a monolithic N-channel body diode between source and drain. Its forward voltage is 1.5 V at ISD = 9 A and VGS = 0 V, with reverse recovery time trr = 118.5 ns and Qrr = 393 nC under specified test conditions (ISD = 9 A, di/dt = 100 A/µs, VDD = 50 V). This diode supports freewheeling in flyback and resonant topologies.
Can IRF630FP be used in parallel configurations?
Yes, IRF630FP supports paralleling due to its positive temperature coefficient of RDS(on)-on-resistance increases with junction temperature, promoting natural current sharing. Successful paralleling requires matched gate drive impedance, symmetrical PCB layout, and individual gate resistors to suppress oscillation. Derating total current by 15–20% is recommended for thermal margin.
Is IRF630FP RoHS-compliant and halogen-free?
Yes, IRF630FP is manufactured in STMicroelectronics' ECOPACK®-compliant TO-220 package, meeting RoHS Directive 2011/65/EU and halogen-free requirements per IEC 61249-2-21. The device carries the "E3" marking indicating lead-free termination and green packaging, with full compliance documentation available through ST's quality portal.
IRF630FP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MESH OVERLAY™ II
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 9A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 400mOhm @ 4.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 45 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 700 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 30W (Tc)
- Operating Temperature:
- -65°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220FP
IRF630FP FAQ
1.How can I place an order for IRF630FP through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF630FP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF630FP reliable?
The price and inventory of IRF630FP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF630FP is usually 5 days.
3.What payment methods are accepted for IRF630FP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF630FP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF630FP?
IRF630FP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF630FP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF630FP?
For technical support, including IRF630FP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF630FP requirements.
6.How does Aetrix verify that IRF630FP is sourced from the original manufacturer or authorized distributors?
All IRF630FP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF630FP meets industry standards.
7.What is the process for return or replacement of IRF630FP?
All IRF630FP units undergo pre-shipment inspection (PSI). If there is an issue with IRF630FP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF630FP part is unused and in its original packaging.
Return procedure for IRF630FP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF630FP Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

