NXP Semiconductors IRF640,127
- Part No.:
- IRF640,127
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
IRF640,127.pdf
- Description:
- MOSFET N-CH 200V 16A TO220AB
- Quantity:
- Payment:

- Shipping:

Inventory:9,601
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Product details
Overview
IRF640,127 from NXP Semiconductors (formerly Philips) is an N-channel enhancement-mode TrenchMOS power transistor in TO-220AB (SOT78) package, rated for 200 V VDSS, 16 A continuous drain current at 25 °C, and RDS(ON) ≤ 180 mΩ at VGS = 10 V. It serves as a high-efficiency switching element in offline SMPS, CRT monitor power supplies, and DC-DC converters.
For engineers reviewing the IRF640,127 datasheet, IRF640,127 pinout, IRF640,127 application, or IRF640,127 equivalent, key selection criteria include avalanche energy rating (580 mJ), thermal resistance junction-to-mounting-base (1.1 K/W), gate charge (63 nC), and body diode reverse recovery characteristics (trr = 130 ns, Qrr = 0.8 µC).
Technical Context
The IRF640,127 employs trench-gate MOSFET architecture to achieve low on-resistance and fast switching with minimal Miller charge (Qgd = 35 nC). Its safe operating area supports unclamped inductive switching up to 64 A pulsed drain current and 580 mJ non-repetitive avalanche energy under defined conditions (IAS = 6.2 A, tp = 720 µs).
Thermal design is enabled by direct metal tab mounting-drain-connected tab provides low Rth j-mb = 1.1 K/W-and internal parasitic inductances are characterized (Ld = 3.5–4.5 nH, Ls = 7.5 nH), supporting accurate layout modeling for high-frequency hard-switching topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 200 V - Maximum blocking voltage before avalanche; suitable for 110/220 VAC offline inputs with margin. |
| ID (continuous) | 16 A at Tmb = 25 °C - Continuous conduction capability with heatsink; derates to 11 A at 100 °C mounting base. |
| RDS(ON) | ≤ 180 mΩ at VGS = 10 V, Tj = 25 °C - Low conduction loss; increases to 522 mΩ at 175 °C junction temperature. |
| EAS | 580 mJ - Non-repetitive avalanche energy rating enables robustness in inductive load switching without external snubbers. |
| Qg(tot) | 63 nC - Total gate charge determines drive strength requirement; Qgs = 12 nC, Qgd = 35 nC define turn-on/off timing control. |
| trr / Qrr | 130 ns / 0.8 µC - Body diode reverse recovery performance critical for synchronous rectification and ZVS/ZCS design. |
| Rth j-mb | 1.1 K/W - Thermal resistance from junction to mounting base enables precise heatsink sizing for 136 W PD dissipation. |
Pinout & Package
IRF640,127 is housed in the SOT78 (TO-220AB) package with a drain-connected metal tab for thermal and electrical connection. Pin 2 is internally connected to the mounting base and must be electrically isolated from other circuit nodes unless used as the primary drain return path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Lead) | Gate | High-impedance control terminal requiring <100 nA leakage protection; sensitive to ESD. |
| 2 (Tab + Lead) | Drain | Primary high-voltage power terminal; electrically and thermally coupled to mounting base. |
| 3 (Lead) | Source | Reference node for gate drive; carries full load current and body diode return path. |
Key Features
| Feature | Design Value |
|---|---|
| Trench MOSFET architecture | Enables lower RDS(ON) and higher cell density vs planar MOSFETs, improving power density in compact SMPS designs. |
| Drain-connected tab | Provides lowest possible thermal path (Rth j-mb = 1.1 K/W) and eliminates need for insulated mounting hardware in many applications. |
| Body diode with trr = 130 ns | Supports freewheeling in buck, flyback, and half-bridge topologies without external diode in cost-sensitive designs. |
| Avalanche-rated operation | Guarantees single-pulse ruggedness up to 580 mJ, enabling reliable operation in inductive switching without overdesign. |
| Low gate threshold (VGS(TO) = 2–4 V) | Ensures turn-on compatibility with standard 5 V and 10 V logic-level drivers without level-shifting circuitry. |
Applications
| Switched-Mode Power Supply | DC-DC Converter |
|---|---|
Use Scenario: Primary-side switch in 50–200 W offline flyback or forward converter powering consumer electronics. IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer via PWM duty cycle; operates at 20–100 kHz. Use Value: 200 V VDSS and 580 mJ EAS ensure reliability across universal AC input ranges and transient overloads. | Use Scenario: High-side switch in isolated or non-isolated 12 V–48 V input DC-DC modules for industrial PLCs and telecom systems. IC Role / Device Role / Timing Role: Main power FET in synchronous buck or half-bridge topology; handles 10–16 A continuous load current. Use Value: RDS(ON) ≤ 180 mΩ minimizes conduction loss at 100 kHz switching, while Qg = 63 nC enables efficient gate driving with standard MOSFET drivers. |
| Motor Control Circuit | General Purpose Switching |
Use Scenario: Low-frequency (<20 kHz) H-bridge leg in 24–48 V brushed DC motor drives for HVAC actuators and power tools. IC Role / Device Role / Timing Role: Bidirectional current-handling switch; body diode conducts reverse current during PWM off-time. Use Value: ISM = 64 A pulsed rating and trr = 130 ns body diode support high-current commutation without shoot-through risk. | Use Scenario: Solid-state relay replacement in programmable logic controller (PLC) output modules switching resistive or inductive loads. IC Role / Device Role / Timing Role: Voltage-controlled power switch replacing electromechanical relays; driven directly from microcontroller GPIO. Use Value: VGS(TO) = 2–4 V ensures reliable turn-on with 3.3 V or 5 V logic; drain-connected tab simplifies heatsinking in DIN-rail mounted enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP20NM60FD | 600 V VDSS, 20 A ID, RDS(ON) = 280 mΩ, SuperMESH™ technology, faster tr/tf. | Higher voltage rating suits 400 V DC bus applications; higher RDS(ON) increases conduction loss at 200 V-class designs. | Select when 600 V blocking is required; not drop-in due to different SOA and gate charge profile. |
| IRFP460 | 500 V VDSS, 20 A ID, RDS(ON) = 270 mΩ, planar construction, higher Qg = 140 nC. | Wider voltage margin but slower switching and higher drive loss; less rugged avalanche (EAS = 390 mJ). | Choose for legacy 500 V designs where gate drive strength exceeds IRF640,127 requirements; requires PCB layout review. |
Compared with STP20NM60FD and IRFP460, the IRF640,127 offers optimal balance of 200 V rating, low RDS(ON), and proven avalanche ruggedness for cost-sensitive 110/220 VAC offline power stages-making it preferred for flyback and forward converters where voltage margin and thermal efficiency are tightly constrained.
Availability
IRF640,127 is available at Aetrix Electronics and suitable for switched-mode power supplies, DC-DC converters, motor control circuits, and general-purpose switching applications requiring stable component supply and long-term industrial availability.
Supply support for IRF640,127 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in high-reliability analog, power, and interface solutions for industrial and automotive markets.
The IRF640,127 belongs to NXP's legacy TrenchMOS power transistor family, designed specifically for high-efficiency, high-ruggedness switching in offline AC-DC and isolated DC-DC power conversion systems.
FAQ
What is the maximum continuous drain current rating for IRF640,127 at 100 °C mounting base temperature?
The IRF640,127 supports 11 A continuous drain current (ID) at Tmb = 100 °C with VGS = 10 V, per its limiting values table. This derating reflects thermal constraints of the TO-220AB package and must be verified against actual heatsink performance and ambient conditions in the final design. The IRF640,127 datasheet specifies this value explicitly under "LIMITING VALUES".
Does IRF640,127 have a built-in body diode, and what are its key parameters?
Yes, the IRF640,127 integrates a source-drain body diode with typical forward voltage VSD = 1.0 V at IF = 18 A and VGS = 0 V, reverse recovery time trr = 130 ns, and reverse recovery charge Qrr = 0.8 µC. These parameters are measured under standardized conditions (IF = 18 A, –dIF/dt = 100 A/µs, VR = 25 V) and are critical for freewheeling behavior in hard-switched topologies. The IRF640,127 body diode is intrinsic to its vertical MOSFET structure.
What is the gate threshold voltage range for IRF640,127, and how does it vary with temperature?
The IRF640,127 has a gate threshold voltage VGS(TO) of 2–4 V at Tj = 25 °C, decreasing to 1 V at Tj = 175 °C and increasing to 6 V at Tj = –55 °C. This wide operational range ensures reliable turn-on with 5 V logic-level drivers across industrial temperature extremes. The IRF640,127 datasheet confirms these values in the "ELECTRICAL CHARACTERISTICS" section.
Can IRF640,127 be used in avalanche mode, and what are the safe operating limits?
Yes, the IRF640,127 is rated for non-repetitive avalanche operation with EAS = 580 mJ and IAS = 16 A under specified conditions (unclamped inductive load, IAS = 6.2 A, tp = 720 µs, Tj = 25 °C). Operation beyond these limits risks permanent damage. The IRF640,127 avalanche data is validated per IEC 134 and documented in the "AVALANCHE ENERGY LIMITING VALUES" table.
What is the thermal resistance from junction to mounting base for IRF640,127, and how is it measured?
The IRF640,127 has a maximum thermal resistance Rth j-mb of 1.1 K/W from junction to mounting base, measured with the device mounted to a large copper heatsink using recommended torque and thermal interface material. This value enables accurate junction temperature estimation (Tj = Tmb + PD × Rth j-mb) and is specified in the "THERMAL RESISTANCES" section of the IRF640,127 datasheet.
IRF640,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 180mOhm @ 8A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 63 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1850 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
IRF640,127 FAQ
1.How can I place an order for IRF640,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF640,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF640,127 reliable?
The price and inventory of IRF640,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF640,127 is usually 5 days.
3.What payment methods are accepted for IRF640,127?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF640,127 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF640,127?
IRF640,127 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF640,127 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF640,127?
For technical support, including IRF640,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF640,127 requirements.
6.How does Aetrix verify that IRF640,127 is sourced from the original manufacturer or authorized distributors?
All IRF640,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF640,127 meets industry standards.
7.What is the process for return or replacement of IRF640,127?
All IRF640,127 units undergo pre-shipment inspection (PSI). If there is an issue with IRF640,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF640,127 part is unused and in its original packaging.
Return procedure for IRF640,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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