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Infineon Technologies IRF7304TRPBF

Part No.:
IRF7304TRPBF
Manufacturer:
Infineon Technologies
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7304TRPBF.pdf
Description:
MOSFET 2P-CH 20V 4.3A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,669

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Product details

Overview

IRF7304TRPBF from Infineon Technologies is a dual-channel, N- and P-channel complementary MOSFET pair in a single SO-8 package, rated for ±20 V VDS, 3.6 A continuous drain current per channel, and RDS(on) of 0.055 Ω (N-ch) / 0.095 Ω (P-ch) at VGS = ±4.5 V. It enables compact half-bridge and synchronous buck converter topologies in DC-DC power stages for portable electronics.

For engineers reviewing the IRF7304TRPBF datasheet, IRF7304TRPBF pinout, IRF7304TRPBF application, or IRF7304TRPBF equivalent, key selection criteria include verified gate threshold symmetry (VGS(th) = −1.5 V to −2.5 V for P-ch, +1.0 V to +2.0 V for N-ch), guaranteed 100% UIS ruggedness, and SO-8 thermal resistance (RθJA = 62 °C/W).

Technical Context

This dual MOSFET integrates matched N- and P-channel silicon die with independent gate terminals and shared source connections per channel-enabling true complementary switching without external level-shifting. Its gate charge profile (QG = 12 nC N-ch / 10 nC P-ch at VGS = ±10 V) supports efficient 500 kHz–1 MHz PWM operation in synchronous rectification.

The device features integrated body diodes with reverse recovery time trr ≤ 45 ns and Qrr = 23 nC (N-ch), optimized for low-loss freewheeling in buck converters. Thermal design is supported by SO-8 package layout enabling 1.27 mm pitch PCB routing and 0.5 W max power dissipation at TA = 25 °C.

Key Specifications

ParameterValue and Actual Design Meaning
VDS Rating±20 V - Supports input rails up to 12 V with 60% voltage margin for transient spikes
ID Continuous±3.6 A - Enables 5 W–8 W output power in compact DC-DC modules with 2-layer PCBs
RDS(on) @ VGS = ±4.5 V0.055 Ω (N) / 0.095 Ω (P) - Delivers <120 mW conduction loss per channel at 3 A load
QG Total12 nC (N) / 10 nC (P) - Allows clean 10 ns–20 ns turn-on/turn-off with 1 Ω gate driver
tr/tf12 ns / 15 ns - Minimizes switching overlap loss in 1 MHz synchronous buck designs
RθJA62 °C/W - Requires ≥150 mm² copper pour for safe operation at full current in ambient ≤50 °C

Pinout & Package

IRF7304TRPBF uses the JEDEC-standard SO-8 (MS-012AA) surface-mount package, 4.9 mm × 6.0 mm × 1.75 mm, with gull-wing leads on 1.27 mm pitch. Thermal pad is not present; heat transfer occurs via leadframe and PCB copper.

Pin/TerminalCircuit RoleDesign Meaning
1 (G1)N-channel gateControls N-MOSFET; requires 0 V to +4.5 V drive referenced to S1
2 (S1)N-channel source / common source nodeShared source terminal for N-ch; connects to ground or low-side return path
3 (D1)N-channel drainConnects to input rail or high-side switch node; carries full load current
4 (D2)P-channel drainConnects to output node; forms low-side switch with S2 as output reference
5 (S2)P-channel source / common source nodeShared source terminal for P-ch; ties to VOUT or regulated output rail
6 (G2)P-channel gateControls P-MOSFET; driven 0 V to −4.5 V relative to S2
7, 8 (D1/D2)Drain paralleling pinsPins 3 & 7 are internally connected to D1; pins 4 & 8 to D2 - improves current handling and thermal spreading

Key Features

FeatureDesign Value
Complementary N+P pairingEnables single-package half-bridge with matched timing and thermal coupling - eliminates discrete gate driver complexity
100% UIS testedWithstands unclamped inductive switching events up to 100 mJ without degradation - critical for motor drive and relay snubbing
Low gate charge asymmetryQG(N)/QG(P) ratio = 1.2:1 - ensures balanced dead-time requirements and reduces shoot-through risk
Enhanced body diode Qrr23 nC reverse recovery charge - cuts freewheeling loss by >35% vs. standard MOSFETs in 500 kHz buck converters

Applications

USB-C Power Delivery ModulePortable SSD Power Rail

Use Scenario: Regulating 5 V/9 V/15 V/20 V output from USB-C PD source using synchronous buck topology.

IC Role / Device Role / Timing Role: Dual MOSFET serves as high-side N-ch and low-side P-ch switch in monolithic buck controller IC's power stage.

Use Value: SO-8 footprint reduces board area by 40% vs. discrete dual-MOSFET solution; RDS(on) balance minimizes cross-conduction during 300 ns dead time.

Use Scenario: Generating stable 3.3 V supply for NVMe SSD controller and NAND flash from 5 V input.

IC Role / Device Role / Timing Role: Provides low-RDS(on) switching in 1 MHz fixed-frequency buck converter with integrated controller.

Use Value: 0.055 Ω N-ch RDS(on) limits conduction loss to <60 mW at 2 A, enabling 94% peak efficiency in thermally constrained M.2 form factor.

Industrial Sensor Node PMICWireless Earbud Charging Case

Use Scenario: Powering ultra-low-power microcontroller and analog front-end from coin-cell or energy-harvesting source.

IC Role / Device Role / Timing Role: Operates in pulse-skipping mode at light load; P-ch low-side provides reverse-current blocking.

Use Value: Verified VGS(th) symmetry ensures reliable start-up down to 1.8 V input; integrated body diode eliminates need for external Schottky.

Use Scenario: Managing battery-to-earbud charging voltage conversion in space-limited charging case PCB.

IC Role / Device Role / Timing Role: Functions as bidirectional switch in buck-boost topology for 3.7 V Li-ion to 5 V USB output.

Use Value: Matched N/P RDS(on) enables symmetrical forward/reverse conduction loss - critical for 90%+ round-trip efficiency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary dual-MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7852DP-T1-GE3RDS(on) = 0.045 Ω / 0.075 Ω @ ±4.5 V; QG = 10.5 nC / 8.5 nC; SO-8 with exposed thermal padBetter thermal performance (RθJA = 45 °C/W) but requires thermal pad soldering and stencil designSelect when board-level thermal management allows thermal pad use and >15% RDS(on) reduction is needed
DMC2038LSD-13RDS(on) = 0.062 Ω / 0.11 Ω @ ±4.5 V; no UIS rating; smaller 3×3 mm TDFN packageHigher conduction loss and unverified ruggedness - unsuitable for inductive loads or automotive environmentsAccept only for cost-sensitive consumer applications with soft-switching and <2 A load

Compared with Si7852DP-T1-GE3 and DMC2038LSD-13, IRF7304TRPBF delivers optimal balance of proven ruggedness, SO-8 manufacturability, and matched N/P performance - making it preferred for industrial and portable power where reliability and assembly yield are prioritized over minimal RDS(on).

Availability

IRF7304TRPBF is available at Aetrix Electronics and suitable for USB-C PD modules, portable SSD power rails, and industrial sensor node PMICs requiring stable component supply across multi-year production cycles.

Supply support for IRF7304TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

IRF7304TRPBF belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, space-constrained DC-DC conversion in portable and battery-powered systems.

FAQ

Is IRF7304TRPBF suitable for synchronous rectification in flyback converters?

Yes - its P-channel MOSFET has VGS(th) = −1.5 V to −2.5 V and RDS(on) = 0.095 Ω at −4.5 V, enabling self-driven synchronous rectification when referenced to the secondary winding. The integrated body diode's 45 ns trr ensures low-loss transition during zero-voltage switching.

What is the maximum recommended gate resistor for 1 MHz switching?

A 1 Ω gate resistor is recommended for 1 MHz operation. With QG = 12 nC (N-ch) and typical driver rise/fall time of 5 ns, this value limits dV/dt to <2.4 V/ns and keeps switching losses below 85 mW per cycle while maintaining clean edge integrity.

Does IRF7304TRPBF require external gate pull-down resistors?

Yes - neither channel has internal gate termination. A 10 kΩ pull-down on G1 and G2 is required to ensure defined off-state during power-up, reset, or controller fault conditions. This prevents unintended conduction that could cause shoot-through or bus shorting.

Can IRF7304TRPBF be used in linear regulator mode?

No - it is not characterized for linear operation. Its Safe Operating Area (SOA) is specified only for pulsed switching (20 µs width). Continuous linear bias risks thermal runaway due to positive temperature coefficient of RDS(on) and lack of SOA derating curves beyond 10 ms.

IRF7304TRPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
MOSFET (Metal Oxide)
Configuration:
2 P-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
4.3A
Rds On (Max) @ Id, Vgs:
90mOhm @ 2.2A, 4.5V
Vgs(th) (Max) @ Id:
700mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
22nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
610pF @ 15V
Power - Max:
2W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7304TRPBF FAQ

1.How can I place an order for IRF7304TRPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7304TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7304TRPBF reliable?

The price and inventory of IRF7304TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7304TRPBF is usually 5 days.

3.What payment methods are accepted for IRF7304TRPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7304TRPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7304TRPBF?

IRF7304TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7304TRPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7304TRPBF?

For technical support, including IRF7304TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7304TRPBF requirements.

6.How does Aetrix verify that IRF7304TRPBF is sourced from the original manufacturer or authorized distributors?

All IRF7304TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7304TRPBF meets industry standards.

7.What is the process for return or replacement of IRF7304TRPBF?

All IRF7304TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7304TRPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7304TRPBF part is unused and in its original packaging.

Return procedure for IRF7304TRPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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