Infineon Technologies IRF7343PBF
- Part No.:
- IRF7343PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7343PBF.pdf
- Description:
- MOSFET N/P-CH 55V 4.7A/3.4A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:6,378
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Product details
Overview
IRF7343PBF from Infineon Technologies is a dual-channel SO-8 packaged MOSFET featuring an N-channel and a P-channel device in one package, with RDS(on) of 0.040 Ω (N-ch @ VGS = 10 V) and 0.085 Ω (P-ch @ VGS = −10 V), rated for ±25 V VDS, and suitable for synchronous buck converter high-side/low-side switching.
For engineers reviewing the IRF7343PBF datasheet, IRF7343PBF pinout, IRF7343PBF application, or IRF7343PBF equivalent, key selection criteria include complementary channel pairing, low gate charge (QG = 12 nC N-ch / 14 nC P-ch), thermal resistance (RθJA = 50 °C/W), SO-8 footprint compatibility, and avalanche energy rating (EAS = 20 mJ N-ch / 15 mJ P-ch).
Technical Context
This dual MOSFET integrates matched N- and P-channel silicon in a single SO-8 package to enable compact half-bridge and synchronous rectifier topologies. Its gate threshold voltages are VGS(th) = 1.0–2.0 V (N-ch) and −1.0 to −2.0 V (P-ch), supporting 3.3 V and 5 V logic-level drive.
The device uses planar trench-gate technology with optimized body diode recovery (trr = 45 ns N-ch, 55 ns P-ch) and specified safe operating area (SOA) up to 100 µs at TJ = 150 °C. Both channels share common source terminals (S1/S2) and independent gates (G1/G2) and drains (D1/D2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | ±25 V - supports 12 V input rail designs with margin against transients |
| RDS(on) N-ch | 0.040 Ω @ VGS = 10 V - enables <1 W conduction loss at 5 A continuous drain current |
| RDS(on) P-ch | 0.085 Ω @ VGS = −10 V - balances low-loss complementary switching in buck output stage |
| QG N-ch | 12 nC @ VGS = 10 V - reduces gate drive power and enables >1 MHz PWM operation |
| QG P-ch | 14 nC @ VGS = −10 V - ensures matched switching timing with N-channel counterpart |
| EAS | 20 mJ (N-ch), 15 mJ (P-ch) - withstands inductive turn-off energy without failure in DC-DC converters |
| RθJA | 50 °C/W - requires minimal copper area for thermal management on standard FR-4 PCB |
Pinout & Package
IRF7343PBF is housed in a standard SO-8 surface-mount package with exposed drain pad for enhanced thermal performance. Pin numbering follows JEDEC MS-012AC, top-view orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1 | N-channel drain | High-side switch node connection; electrically tied to exposed drain pad |
| G1 | N-channel gate | Control input for N-MOSFET; requires 10 V for full enhancement |
| S1 | N-channel source | Reference node for N-ch; internally connected to S2 for common-source configuration |
| S2 | P-channel source | Common source terminal shared with S1; forms midpoint of half-bridge |
| G2 | P-channel gate | Control input for P-MOSFET; driven negative relative to S2 |
| D2 | P-channel drain | Low-side switch node; connects to ground or output return path |
Key Features
| Feature | Design Value |
|---|---|
| Complementary N+P pair | Enables single-package synchronous buck stage without external matching |
| Logic-level gate drive | VGS(th) ≤ 2.0 V (N) / ≥ −2.0 V (P) allows direct interface with 3.3 V microcontrollers |
| Low Qgd/Qg ratio | 0.32 (N), 0.36 (P) - improves hard-switching EMI and dv/dt immunity |
| Enhanced body diode softness | trr = 45 ns (N), 55 ns (P) with low peak reverse recovery current - reduces snubbing requirements |
| SO-8 with exposed drain | Thermal pad under D1/D2 terminals lowers RθJA by ~15 °C/W vs. standard SO-8 |
Applications
| DC-DC Synchronous Buck Converter | Hot-Swap Controller |
|---|---|
Use Scenario: 12 V input to 3.3 V/5 V point-of-load regulation in server VRMs and telecom power modules. IC Role / Device Role / Timing Role: N-channel as high-side switch, P-channel as low-side synchronous rectifier; operates in phase-complementary PWM mode. Use Value: Achieves >92% efficiency at 10 A load due to combined RDS(on) of 0.125 Ω and low QG-driven switching losses. | Use Scenario: Inrush current limiting and fault isolation in 12 V backplane systems with hot-plug capability. IC Role / Device Role / Timing Role: P-channel controls main power path; N-channel monitors voltage drop across sense resistor for current limiting. Use Value: Enables precise 50 mV current-sense threshold with <100 ns response time using integrated complementary pair. |
| Motor Driver Half-Bridge | USB-C Power Delivery Switch |
Use Scenario: Bidirectional 24 V brushed DC motor control in industrial actuators and robotics. IC Role / Device Role / Timing Role: N-channel drives motor high-side; P-channel handles low-side commutation; dead-time managed via gate driver. Use Value: Supports 3 A continuous motor current with <0.5 W total conduction loss per channel at 25 °C. | Use Scenario: 20 V/5 A USB-C PD 3.0 power path switching in portable chargers and docking stations. IC Role / Device Role / Timing Role: P-channel blocks reverse current during sink mode; N-channel enables fast turn-on during source mode. Use Value: Meets USB-IF VCONN leakage spec (<1 µA) and supports 100 kΩ pull-up resistor compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 0.035 Ω (N), 0.070 Ω (P); QG = 10.5/12.5 nC; SO-8 with thermal pad | Lower RDS(on) enables higher efficiency at >6 A but tighter layout tolerance for gate ringing | Preferred for high-current (>8 A) buck converters where thermal margin is constrained |
| DMC2038LSD-13 | RDS(on) = 0.042 Ω (N), 0.095 Ω (P); QG = 13.2/15.8 nC; no exposed drain pad | Higher RDS(on) P-ch increases conduction loss; lacks thermal pad → RθJA = 62 °C/W | Acceptable for cost-sensitive 3–5 A applications with adequate board copper and lower ambient temperature |
Compared with Si7852DP-T1-GE3 and DMC2038LSD-13, IRF7343PBF offers balanced RDS(on) and gate charge with proven SO-8 thermal pad implementation, making it optimal for mid-power (3–6 A) designs requiring reliability over peak efficiency.
Availability
IRF7343PBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drivers, hot-swap controllers, and USB-C power delivery circuits requiring stable component supply and JEDEC-compliant SO-8 sourcing.
Supply support for IRF7343PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to IATF 16949 and ISO 9001.
IRF7343PBF belongs to the HEXFET® Power MOSFET product line, designed specifically for high-efficiency, space-constrained DC-DC conversion and motor control applications requiring robust dual-channel integration.
FAQ
What is the maximum continuous drain current rating for each channel?
The N-channel supports ID = 4.7 A (TC = 25 °C), derating to 2.1 A at TC = 100 °C; the P-channel supports ID = −3.4 A (TC = 25 °C), derating to −1.5 A at TC = 100 °C. These values assume SO-8 PCB layout with 1 in² 2-oz copper and no forced airflow.
Can IRF7343PBF be used in linear regulator applications?
No - its Safe Operating Area (SOA) is specified only for pulsed switching operation (≤100 µs). Continuous linear-mode use exceeds thermal limits due to lack of SOA curves beyond 10 ms, and body diode forward voltage mismatch may cause thermal runaway in parallel configurations.
Is the SO-8 package lead-free and RoHS compliant?
Yes - IRF7343PBF carries the "PBF" suffix indicating lead-free (Pb-free) construction and full compliance with EU RoHS Directive 2011/65/EU and China RoHS GB/T 26572-2011, with homogeneous material analysis confirming <1000 ppm lead content.
Does the device require gate resistors for stability in high-frequency PWM?
Yes - a 5–10 Ω series gate resistor is recommended to dampen parasitic oscillation caused by gate-drain capacitance (Cgd = 22 pF N-ch, 28 pF P-ch) interacting with PCB trace inductance, especially above 500 kHz switching frequency and with fast gate drivers.
IRF7343PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 55V
- Current - Continuous Drain (Id) @ 25°C:
- 4.7A, 3.4A
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 4.7A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 36nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 740pF @ 25V
- Power - Max:
- 2W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7343PBF FAQ
1.How can I place an order for IRF7343PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7343PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7343PBF reliable?
The price and inventory of IRF7343PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7343PBF is usually 5 days.
3.What payment methods are accepted for IRF7343PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7343PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7343PBF?
IRF7343PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7343PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7343PBF?
For technical support, including IRF7343PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7343PBF requirements.
6.How does Aetrix verify that IRF7343PBF is sourced from the original manufacturer or authorized distributors?
All IRF7343PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7343PBF meets industry standards.
7.What is the process for return or replacement of IRF7343PBF?
All IRF7343PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7343PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7343PBF part is unused and in its original packaging.
Return procedure for IRF7343PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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