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Vishay Siliconix IRF9610

Part No.:
IRF9610
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIRF9610.pdf
Description:
MOSFET P-CH 200V 1.8A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,290

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Product details

Overview

IRF9610 from Vishay Siliconix is a P-channel enhancement-mode power MOSFET in TO-220AB package, rated for -200 V drain-source voltage, 3.0 Ω RDS(on) at VGS = -10 V, and -1.8 A continuous drain current at TC = 25 °C. It delivers fast switching, dynamic dV/dt immunity, and rugged avalanche capability for high-voltage DC-DC converters and industrial motor controls.

For engineers reviewing the IRF9610 datasheet, IRF9610 pinout, IRF9610 application, or IRF9610 equivalent, this page provides verified technical context, validated pin functions, real-world use cases in high-side switching and clamped inductive loads, and confirmed alternative parts with documented parameter differences.

Technical Context

The IRF9610 operates as a high-voltage P-channel switch with gate threshold voltage between -2.0 V and -4.0 V, enabling direct logic-level drive in low-side gate configurations when used with level-shifting circuitry. Its -200 V VDS rating and 5.0 V/ns dV/dt immunity support operation in 170 V DC bus systems with transient suppression.

Thermal design is constrained by RthJC = 6.4 °C/W and RthJA = 62 °C/W, requiring heatsinking for sustained >1.0 A operation above 100 °C case temperature. The integrated body diode exhibits 240–360 ns reverse recovery time and 1.7–2.6 μC Qrr, limiting use in high-frequency synchronous rectification without external snubbing.

Key Specifications

ParameterValue and Actual Design Meaning
VDS-200 V - supports 170 V DC bus designs with 15% margin for transients
RDS(on)3.0 Ω @ VGS = -10 V - limits conduction loss to ≤4.86 W at -1.8 A
ID (cont.)-1.8 A @ TC = 25 °C - derates linearly to -1.0 A at 100 °C case temperature
Qg11 nC - determines gate drive energy requirement for 100 kHz switching
tr/tf15 ns / 8.0 ns - enables <500 ns total switching transition in optimized layouts
VGS(th)-2.0 to -4.0 V - ensures reliable turn-on with -5 V gate drive, avoids partial enhancement
EAS5.0 mJ - specifies single-pulse avalanche energy handling without failure

Pinout & Package

IRF9610 uses the standard TO-220AB package with insulated tab, 3-pin through-hole configuration. Mounting requires thermal interface material and mechanical torque of 1.1 N·m (10 lbf·in) for optimal junction-to-sink thermal resistance of 0.50 °C/W.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path from source to loadConnected to high-voltage rail; electrically tied to metal tab - must be isolated from heatsink unless referenced to same potential
Gate (G)Control electrode for channel formationHigh-impedance input requiring ≤100 nA leakage control; sensitive to ESD - needs series gate resistor for ringing suppression
Source (S)Reference node for gate drive and current returnServes as common reference for VGS; carries full load current and body diode reverse recovery charge during turn-off

Key Features

FeatureDesign Value
P-channel topologyEnables high-side switching without bootstrap circuitry in low-frequency DC-DC applications
Dynamic dV/dt rating5.0 V/ns immunity prevents false turn-on during fast voltage transients on drain node
Fast switching23 ns total switching time (td(on) + tr + td(off) + tf) reduces switching losses below 200 kHz
Ease of parallelingPositive RDS(on) temperature coefficient ensures current sharing stability across multiple devices
Simple drive requirementsLow Qg (11 nC) and moderate VGS(th) allow direct microcontroller GPIO drive with series resistor

Applications

Industrial Power SupplyHigh-Voltage DC Motor Control

Use Scenario: High-side switch in 150 V input offline flyback converter with active clamp.

IC Role / Device Role / Timing Role: Main switching element controlling energy transfer during primary conduction phase; operates at 65 kHz with 45% duty cycle.

Use Value: -200 V VDS rating accommodates reflected output voltage plus leakage spike; 3.0 Ω RDS(on) keeps conduction loss under 10 W at full load.

Use Scenario: Directional control switch in brushed DC motor H-bridge using discrete P-channel high-side and N-channel low-side drivers.

IC Role / Device Role / Timing Role: High-side power switch enabling bidirectional current flow; commutated at ≤5 kHz with 100 µs dead time.

Use Value: -4.0 V max VGS(th) ensures full enhancement with -5 V gate drive; body diode Qrr = 2.6 μC minimizes shoot-through risk during polarity reversal.

Clamped Inductive Load DriverOvervoltage Protection Circuit

Use Scenario: Solenoid driver with active clamping in automotive HVAC actuator module.

IC Role / Device Role / Timing Role: Switching element absorbing inductive kickback via internal avalanche capability; pulsed at 10 Hz with 200 ms on-time.

Use Value: 5.0 mJ single-pulse avalanche energy rating handles 100 mJ stored inductance without degradation; 7.0 A IDM supports peak solenoid surge currents.

Use Scenario: Crowbar device in telecom power shelf protecting downstream 48 V distribution against input overvoltage events.

IC Role / Device Role / Timing Role: Fast-acting shunt switch triggered by comparator when input exceeds 60 V; activated within 100 ns.

Use Value: 5.0 V/ns dV/dt immunity prevents spurious triggering during line transients; -200 V VDS withstands 100 V surge test per GR-1089.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel high-voltage MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF9530VDS = -100 V, RDS(on) = 0.3 Ω @ -10 V, Qg = 60 nCLower voltage rating limits use to ≤80 V systems; higher gate charge increases drive complexitySelect when lower RDS(on) is critical and bus voltage stays below 80 V.
IXTP10P20VDS = -200 V, RDS(on) = 1.8 Ω @ -10 V, Qg = 16 nC, TO-220FP packageLower RDS(on) improves efficiency but higher Qg slows switching; smaller footprint reduces thermal massPrefer for space-constrained 200 V designs where 1.8 Ω conduction loss justifies added gate drive effort.

Compared with IRF9610, IRF9530 trades voltage headroom for lower on-resistance in sub-100 V systems, while IXTP10P20 offers improved conduction efficiency at the cost of higher gate drive demand and reduced thermal inertia - both require layout review due to non-identical pinouts and thermal profiles.

Availability

IRF9610 is available at Aetrix Electronics and suitable for industrial power supplies, high-voltage DC motor controllers, and clamped inductive load drivers requiring stable component supply and long-term obsolescence management.

Supply support for IRF9610 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, reliability, and thermal performance.

The IRF9610 belongs to Vishay's legacy high-voltage P-channel power MOSFET product line, engineered for industrial and automotive auxiliary power systems where robust avalanche capability and stable high-temperature operation are mandatory.

FAQ

What is the maximum continuous drain current for IRF9610 at 100 °C case temperature?

The IRF9610 supports -1.0 A continuous drain current at TC = 100 °C, per its linear derating curve starting from -1.8 A at 25 °C. This limit ensures junction temperature remains below 150 °C under typical heatsink conditions. Exceeding this current without additional cooling risks thermal runaway. Always verify actual TJ using RthJC = 6.4 °C/W and measured power dissipation in the final IRF9610 application layout.

Does IRF9610 have avalanche capability, and how is it specified?

Yes, IRF9610 is rated for repetitive avalanche operation with ILM = -7.0 A and single-pulse EAS = 5.0 mJ. These values are measured under controlled clamped inductive test conditions (Fig. 15 in datasheet). The device sustains avalanche without parametric shift when operated within these limits. For IRF9610 designs, ensure gate drive remains active during avalanche events to maintain channel control and avoid secondary breakdown.

Can IRF9610 be driven directly from a 3.3 V microcontroller GPIO?

No - IRF9610 has VGS(th) ranging from -2.0 V to -4.0 V, and requires ≥-10 V for full enhancement (RDS(on) = 3.0 Ω). A 3.3 V GPIO cannot provide sufficient negative gate bias. Driving IRF9610 directly would result in high RDS(on), excessive heating, and unreliable switching. Use a dedicated P-channel gate driver or level-shifter circuit to deliver -10 V to the IRF9610 gate in production designs.

What is the body diode reverse recovery charge (Qrr) of IRF9610, and why does it matter?

The IRF9610 body diode exhibits Qrr = 1.7–2.6 μC at TJ = 25 °C, measured with IF = -1.8 A and dI/dt = 100 A/μs. This charge must be removed during turn-on, causing temporary shoot-through current in bridge configurations. High Qrr increases switching loss and EMI - for IRF9610 in half-bridge use, implement dead-time control ≥100 ns and consider external Schottky catch diodes to bypass body diode conduction.

Is IRF9610 suitable for synchronous rectification in high-frequency SMPS?

No - IRF9610 is not optimized for synchronous rectification above 100 kHz due to its 240–360 ns body diode reverse recovery time and 2.6 μC Qrr. These parameters cause excessive switching loss and voltage overshoot in fast-switching topologies. While IRF9610 functions reliably in 65 kHz flyback or forward converters, modern synchronous rectifiers require <100 ns trr and <0.5 μC Qrr. Use dedicated low-Qrr MOSFETs like SiR872DP for such IRF9610 replacement scenarios.

IRF9610 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
200 V
Current - Continuous Drain (Id) @ 25°C:
1.8A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
3Ohm @ 900mA, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
11 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
170 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
20W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

IRF9610 FAQ

1.How can I place an order for IRF9610 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF9610 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF9610 reliable?

The price and inventory of IRF9610 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF9610 is usually 5 days.

3.What payment methods are accepted for IRF9610?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF9610 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF9610?

IRF9610 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF9610 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF9610?

For technical support, including IRF9610 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF9610 requirements.

6.How does Aetrix verify that IRF9610 is sourced from the original manufacturer or authorized distributors?

All IRF9610 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF9610 meets industry standards.

7.What is the process for return or replacement of IRF9610?

All IRF9610 units undergo pre-shipment inspection (PSI). If there is an issue with IRF9610, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF9610 part is unused and in its original packaging.

Return procedure for IRF9610:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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