Vishay Siliconix IRF9610SPBF
- Part No.:
- IRF9610SPBF
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF9610SPBF.pdf
- Description:
- MOSFET P-CH 200V 1.8A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,082
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Product details
Overview
IRF9610SPBF from Vishay Siliconix is a P-channel enhancement-mode power MOSFET in D2PAK (TO-263) package, rated for -200 V VDS, 3 Ω RDS(on) at VGS = -10 V, and -1.8 A continuous drain current at TC = 25 °C. It delivers fast switching, ruggedized design, and low gate charge (Qg = 11 nC), making it suitable for high-voltage DC-DC converters and industrial power supplies.
For engineers reviewing the IRF9610SPBF datasheet, IRF9610SPBF pinout, IRF9610SPBF application, or IRF9610SPBF equivalent, key selection criteria include its -200 V blocking capability, body diode recovery time (trr = 240–360 ns), thermal resistance (RthJC = 6.4 °C/W), and surface-mount D2PAK footprint compatibility with high-current PCB layouts.
Technical Context
This device operates as a high-side switch in off-line SMPS, motor control H-bridges, and battery protection circuits. Its P-channel topology eliminates need for bootstrap circuitry, while dynamic dV/dt rating (-5 V/ns) and built-in body diode support clamped inductive switching and reverse recovery under controlled conditions.
The MOSFET features third-generation silicon process with optimized cell layout for low RDS(on) × Qg figure of merit. Gate threshold voltage (VGS(th) = -2 to -4 V) ensures reliable turn-on with standard -10 V gate drive, and internal source/drain inductances (LS = 7.5 nH, LD = 4.5 nH) are characterized for accurate switching waveform modeling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -200 V - Supports high-voltage DC bus isolation in industrial AC/DC front-ends and telecom rectifiers. |
| RDS(on) | 3 Ω @ VGS = -10 V - Enables <1.5 W conduction loss at -1.8 A, suitable for thermally constrained SMT designs. |
| Qg | 11 nC - Reduces gate drive power requirement and enables >100 kHz switching in hard-switched topologies. |
| trr | 240–360 ns - Limits switching losses during body diode commutation in synchronous rectification or half-bridge freewheeling. |
| RthJC | 6.4 °C/W - Allows up to 20 W power dissipation with heatsink interface, supporting compact high-power density layouts. |
| ID (cont.) | -1.8 A @ TC = 25 °C - Defines maximum steady-state current when mounted on 1" FR-4 PCB per JEDEC test condition. |
| VGS(th) | -2 to -4 V - Ensures full enhancement with logic-level gate drivers while maintaining noise immunity against false turn-on. |
Pinout & Package
D2PAK (TO-263) surface-mount package with exposed drain tab for thermal and electrical connection; 3-terminal configuration (Drain, Gate, Source) with standardized lead pitch (2.54 mm) and 10.67 mm × 9.65 mm footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | High-side power output node | Electrically and thermally connected to PCB copper pour; must be isolated from other nets except return path. |
| Gate | Control input | Low-impedance CMOS-compatible node requiring <11 nC charge; sensitive to ESD and ringing-requires local RC snubber if driven over long traces. |
| Source | Reference terminal / current return | Connected to system ground or floating rail; source inductance (7.5 nH) impacts switching speed and overshoot during turn-off. |
Key Features
| Feature | Design Value |
|---|---|
| P-channel enhancement mode | Enables high-side switching without level-shifting or bootstrap capacitors in DC-DC controllers. |
| Dynamic dV/dt rating | -5 V/ns immunity prevents spurious turn-on during fast voltage transients in noisy industrial environments. |
| Fast switching with low Qg | Reduces total switching energy loss (Esw) and allows higher frequency operation without excessive gate driver heating. |
| Ruggedized die construction | Withstands repetitive avalanche energy (EAS) and clamped inductive load stress per JEDEC JESD24-11 test conditions. |
| RoHS-compliant Pb-free finish | Meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) for standard reflow assembly. |
Applications
| Industrial Power Supply | Telecom Rectifier Module |
|---|---|
Use Scenario: Off-line flyback or forward converter primary-side switch in 48 V telecom systems. IC Role / Device Role / Timing Role: High-side P-channel MOSFET controlling main power delivery path; operates in hard-switched PWM mode at 65–130 kHz. Use Value: -200 V rating accommodates 170 VAC peak + margin; low Qg minimizes gate drive losses in space-constrained modules. | Use Scenario: Input stage switch in redundant 48 V DC distribution units with hot-swap capability. IC Role / Device Role / Timing Role: Reverse polarity protection and inrush limiting switch placed before bulk capacitance. Use Value: Body diode supports bidirectional current flow during hot-plug sequencing; -1.8 A rating handles typical module load currents. |
| Motor Control H-Bridge | Battery Management System |
Use Scenario: Upper-leg switch in brushed DC motor driver for factory automation equipment. IC Role / Device Role / Timing Role: High-side P-MOSFET in half-bridge configuration; commutated with complementary N-channel low-side switch. Use Value: Fast tr/tf (15 ns/8 ns) enables precise PWM duty cycle control; dV/dt immunity prevents shoot-through during voltage transitions. | Use Scenario: Cell balancing or pack disconnect switch in 24–48 V lithium-ion battery packs. IC Role / Device Role / Timing Role: Isolation switch between battery stack and load; activated only during fault or maintenance events. Use Value: -200 V VDS provides >4× overvoltage margin vs. 48 V nominal; low RDS(on) limits standby leakage and self-heating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel high-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiHF9610S-GE3 | Same die, identical RDS(on), Qg, and VDS; Pb-free and halogen-free termination vs. IRF9610SPBF's Pb-free only. | No functional difference; preferred where RoHS Annex II compliance (Br, Cl ≤ 900 ppm) is required. | Select SiHF9610S-GE3 for new designs targeting full halogen-free certification. |
| IRF9540NPbF | Lower VDS (-100 V), higher RDS(on) (0.2 Ω), larger Qg (71 nC); TO-220 package vs. D2PAK. | Not suitable for >120 V applications; requires heatsink mounting and larger PCB area. | Choose only if legacy TO-220 layout exists and voltage stress remains below 80 V. |
Compared with IRF9610SPBF, SiHF9610S-GE3 offers identical electrical performance with enhanced environmental compliance, while IRF9540NPbF trades voltage capability and packaging efficiency for higher current handling in lower-voltage, through-hole designs.
Availability
IRF9610SPBF is available at Aetrix Electronics and suitable for industrial power supplies, telecom rectifiers, and motor control systems requiring stable component supply and long-term manufacturability.
Supply support for IRF9610SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on reliability and high-performance analog solutions.
The IRF9610SPBF belongs to Vishay's third-generation high-voltage P-channel MOSFET product line, engineered for ruggedness, low conduction loss, and fast switching in industrial and telecom power conversion.
FAQ
What is the maximum continuous drain current for IRF9610SPBF at 100 °C case temperature?
The IRF9610SPBF supports -1.0 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the D2PAK package without external heatsinking. At this temperature, conduction losses remain within safe junction limits assuming proper PCB copper area and ambient airflow. The IRF9610SPBF datasheet confirms this value under repetitive pulse conditions with junction temperature capped at 150 °C.
Does IRF9610SPBF have avalanche rating, and is it specified in the datasheet?
The IRF9610SPBF is not explicitly rated for repetitive avalanche energy (EAS) in the provided datasheet. While its ruggedized third-generation silicon design withstands single-pulse avalanche per JEDEC JESD24-11, no guaranteed EAS value is published. Designers must rely on SOA curves (Figure 4) and clamped inductive test data (Fig. 15–16) to validate robustness. For IRF9610SPBF, safe operation requires external snubbers or Zener clamping to limit VDS overshoot during inductive switching.
Can IRF9610SPBF be used with logic-level gate drive (e.g., 3.3 V or 5 V)?
No-IRF9610SPBF is not a logic-level MOSFET. Its gate threshold voltage range is -2 V to -4 V, and RDS(on) is specified only at VGS = -10 V. At 3.3 V or 5 V gate drive, the device remains in weak inversion with RDS(on) exceeding 10 Ω, causing excessive conduction loss and thermal runaway. The IRF9610SPBF requires a dedicated negative gate driver or level shifter to achieve full enhancement; it is incompatible with direct microcontroller GPIO drive.
What is the recommended PCB pad layout for IRF9610SPBF in D2PAK package?
Vishay specifies minimum recommended pads for IRF9610SPBF: 0.420" × 0.355" (10.67 mm × 9.02 mm) for the drain tab, with 0.145" (3.68 mm) clearance to adjacent copper. Thermal vias (≥6 × 0.3 mm diameter) should connect the drain pad to inner-layer ground planes. Gate and source pads follow standard 0.050" (1.27 mm) pitch SMT guidelines. These dimensions ensure solder joint reliability, thermal dissipation, and mechanical stability per IPC-7351B Class B standards for the IRF9610SPBF.
How does the body diode performance of IRF9610SPBF compare to Schottky alternatives?
The IRF9610SPBF body diode has VSD = -5.8 V at -1.8 A and trr = 240–360 ns, resulting in higher forward loss and reverse recovery energy than Schottky diodes. Unlike Schottky devices, it conducts in both directions but lacks zero-recovery characteristics. In applications requiring low-loss freewheeling (e.g., synchronous rectification), an external Schottky or SiC diode is recommended alongside IRF9610SPBF. The IRF9610SPBF body diode is intended for fault protection and limited-duty-cycle commutation-not primary conduction.
IRF9610SPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 1.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3Ohm @ 900mA, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 170 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3W (Ta), 20W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
IRF9610SPBF FAQ
1.How can I place an order for IRF9610SPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF9610SPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF9610SPBF reliable?
The price and inventory of IRF9610SPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF9610SPBF is usually 5 days.
3.What payment methods are accepted for IRF9610SPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF9610SPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF9610SPBF?
IRF9610SPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF9610SPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF9610SPBF?
For technical support, including IRF9610SPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF9610SPBF requirements.
6.How does Aetrix verify that IRF9610SPBF is sourced from the original manufacturer or authorized distributors?
All IRF9610SPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF9610SPBF meets industry standards.
7.What is the process for return or replacement of IRF9610SPBF?
All IRF9610SPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF9610SPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF9610SPBF part is unused and in its original packaging.
Return procedure for IRF9610SPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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