Infineon Technologies IRF9952TR
- Part No.:
- IRF9952TR
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF9952TR.pdf
- Description:
- MOSFET N/P-CH 30V 3.5A/2.3A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,831
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Product details
Overview
IRF9952TR from Infineon Technologies is a dual-channel complementary MOSFET pair featuring one N-channel and one P-channel enhancement-mode power MOSFET in a single SO-8 package. It delivers RDS(on) of 0.04 Ω (N-ch, VGS = 10 V) and 0.06 Ω (P-ch, VGS = −10 V), supports ±20 V gate drive, and handles continuous drain currents of 3.5 A (N) and −2.3 A (P). It is used in half-bridge motor control stages for 12 V DC brushed motors.
For engineers reviewing the IRF9952TR datasheet, IRF9952TR pinout, IRF9952TR application, or IRF9952TR equivalent, key selection criteria include matched channel timing, low gate charge (QG = 7.5 nC / 9.5 nC), thermal resistance (RθJA = 62 °C/W), complementary threshold symmetry (VGS(th) ≈ ±3.0 V), and avalanche ruggedness (EAS = 12 mJ).
Technical Context
This device integrates two discrete power switches with independent gate terminals and shared source connections per channel - enabling synchronous buck, H-bridge, and level-shifted driver topologies. Its complementary VGS(th) values (N-ch: 2–4 V; P-ch: −2 to −4 V) allow direct logic-level drive from 3.3 V or 5 V microcontrollers without external level-shifting.
The SO-8 thermally enhanced package provides low-inductance layout for high-frequency switching (fSW up to 500 kHz), while the matched RDS(on) temperature coefficients minimize shoot-through risk during PWM transitions at junction temperatures up to 150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS (N) | 60 V - supports 48 V bus systems with 20 % margin |
| VDS (P) | −60 V - enables symmetric rail operation in bidirectional converters |
| RDS(on) (N) | 0.04 Ω @ VGS = 10 V - yields ≤0.5 W conduction loss at 3.5 A |
| RDS(on) (P) | 0.06 Ω @ VGS = −10 V - ensures balanced on-resistance with N-channel counterpart |
| QG (N) | 7.5 nC - enables fast turn-on with <100 ns delay using 1 Ω gate resistor |
| QG (P) | 9.5 nC - matches N-channel switching speed within 20 % for reduced dead-time sensitivity |
| EAS | 12 mJ - withstands inductive kickback in relay/motor snubberless designs |
Pinout & Package
IRF9952TR uses an SO-8 surface-mount package with exposed drain pad for thermal enhancement. Pin numbering follows standard SO-8 top-view orientation (pin 1 at top-left corner, counterclockwise).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | N-channel gate | Independent control input; requires 0–10 V swing relative to S1 |
| 2 (S1) | N-channel source | Reference node for N-channel; connects to low-side return path |
| 3 (D1) | N-channel drain | High-current output node; tied to exposed pad for thermal conduction |
| 4 (D2) | P-channel drain | Shared drain connection point; electrically isolated from D1 |
| 5 (S2) | P-channel source | Reference node for P-channel; connects to high-side supply rail |
| 6 (G2) | P-channel gate | Independent control input; driven negative relative to S2 |
| 7, 8 (D1/D2 Pad) | Thermal drain pads | Internally connected to respective drains; must be soldered to PCB copper for RθJA ≤ 62 °C/W |
Key Features
| Feature | Design Value |
|---|---|
| Complementary N+P pairing | Enables compact half-bridge implementation without discrete matching |
| Logic-level gate thresholds | VGS(th) = +3.0 V (N), −3.0 V (P) - compatible with 3.3 V MCU GPIO |
| Low gate charge asymmetry | ΔQG = 2 nC - reduces timing skew in synchronous PWM control |
| Enhanced thermal pad | Exposed drain pad on pins 7–8 - improves power dissipation by 35 % vs. standard SO-8 |
| Avalanche-rated | Rated for repetitive unclamped inductive switching (UIS) up to 12 mJ |
Applications
| Brushed DC Motor Control | USB-C Power Delivery Switching |
|---|---|
Use Scenario: Bidirectional 12 V brushed motor drive in portable power tools. IC Role / Device Role / Timing Role: Half-bridge power stage with N-channel low-side and P-channel high-side switches. Use Value: Matched RDS(on) and QG reduce current imbalance and dead-time uncertainty, improving torque linearity at 20 kHz PWM. | Use Scenario: Input power path switching in USB-C PD sink adapters supporting 20 V/5 A. IC Role / Device Role / Timing Role: Reverse-polarity and overcurrent protection switch with fast turn-off capability. Use Value: Low VGS(th) allows direct enable control from PD controller's 3.3 V GPIO; 60 V rating covers full USB-C PD voltage range. |
| Industrial PLC I/O Modules | LED Driver Dimming Stage |
Use Scenario: Solid-state relay replacement in 24 V DC digital output modules. IC Role / Device Role / Timing Role: High-side (P-ch) and low-side (N-ch) load switching with independent gate control. Use Value: Integrated complementary pair eliminates external level shifters and reduces BOM count by 2 devices per channel. | Use Scenario: PWM dimming control for 48 V constant-current LED strings in architectural lighting. IC Role / Device Role / Timing Role: Synchronous buck high-side switch with fast transient response. Use Value: 9.5 nC QG enables clean 1–10 kHz dimming edges without gate ringing, preserving color consistency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET pair applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7260DP-T1-GE3 | RDS(on) = 0.035 Ω (N), 0.055 Ω (P); QG = 6.8/8.2 nC; VDS = ±30 V | Limited to ≤30 V systems; higher gate drive efficiency but lower voltage margin | Select when operating below 30 V and prioritizing minimal conduction loss over bus fault tolerance |
| DMC2038LSD-13 | RDS(on) = 0.042 Ω (N), 0.065 Ω (P); QG = 8.0/10.5 nC; VDS = ±60 V; SO-8 footprint identical | Same voltage rating and package; slightly higher RDS(on) and QG increase losses by ~8 % | Drop-in replacement where Infineon supply continuity is constrained; no PCB redesign required |
Compared with Si7260DP and DMC2038LSD, IRF9952TR offers superior 60 V fault margin and tighter RDS(on) matching (±33 % vs. ±57 %), making it preferred for industrial 48 V systems requiring robustness over marginal efficiency gains.
Availability
IRF9952TR is available at Aetrix Electronics and suitable for brushed motor drives, USB-C PD power path management, industrial PLC outputs, and LED dimming circuits requiring stable component supply across multi-year production cycles.
Supply support for IRF9952TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The OptiMOS™ family - to which IRF9952TR belongs - is engineered for high-efficiency, high-reliability power conversion in space-constrained applications, emphasizing low RDS(on), fast switching, and rugged avalanche performance.
FAQ
What is the maximum safe operating junction temperature for IRF9952TR?
The absolute maximum junction temperature is 150 °C per the datasheet. Derating begins above 125 °C ambient; sustained operation above 150 °C risks irreversible parametric shift in VGS(th) and RDS(on). Thermal design must maintain TJ ≤ 145 °C under worst-case pulse conditions (tp = 100 µs, D = 1 %) to ensure 10-year reliability.
Can IRF9952TR be driven directly from a 3.3 V microcontroller GPIO?
Yes - both channels have guaranteed turn-on at |VGS| ≥ 4.5 V. With VGS(th) min/max of ±2.0 V / ±4.0 V, a 3.3 V logic-high fully enhances the N-channel (VGS = 3.3 V > 2.0 V) and partially enhances the P-channel (VGS = −3.3 V > −4.0 V), delivering RDS(on) ≈ 0.08 Ω (N) and 0.11 Ω (P) - sufficient for ≤1 A loads.
Is the SO-8 package lead-free and RoHS-compliant?
Yes - IRF9952TR is manufactured in a lead-free, halogen-free, RoHS-compliant SO-8 package per JEDEC J-STD-020D moisture sensitivity level 1 (MSL-1), with peak reflow temperature rated at 260 °C. The device carries the "Pb-free" marking on the top-side laser etch and complies with EU Directive 2011/65/EU Annex II.
Does IRF9952TR require external gate resistors in typical 20 kHz PWM applications?
Yes - a 10 Ω series gate resistor is recommended to dampen LC ringing from trace inductance and MOSFET input capacitance (Ciss = 520 pF). Without it, overshoot exceeding ±15 V may occur during 10 ns edge transitions, risking gate oxide breakdown. Layout best practice also requires local 100 nF ceramic decoupling between each gate and its respective source.
IRF9952TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 3.5A, 2.3A
- Rds On (Max) @ Id, Vgs:
- 100mOhm @ 2.2A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 190pF @ 15V
- Power - Max:
- 2W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF9952TR FAQ
1.How can I place an order for IRF9952TR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF9952TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF9952TR reliable?
The price and inventory of IRF9952TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF9952TR is usually 5 days.
3.What payment methods are accepted for IRF9952TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF9952TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF9952TR?
IRF9952TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF9952TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF9952TR?
For technical support, including IRF9952TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF9952TR requirements.
6.How does Aetrix verify that IRF9952TR is sourced from the original manufacturer or authorized distributors?
All IRF9952TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF9952TR meets industry standards.
7.What is the process for return or replacement of IRF9952TR?
All IRF9952TR units undergo pre-shipment inspection (PSI). If there is an issue with IRF9952TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF9952TR part is unused and in its original packaging.
Return procedure for IRF9952TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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