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Vishay Siliconix IRFBC30ASPBF

Part No.:
IRFBC30ASPBF
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixIRFBC30ASPBF.pdf
Description:
MOSFET N-CH 600V 3.6A D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,169

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Product details

Overview

IRFBC30ASPBF from Vishay Siliconix is a 600 V, 3.6 A N-channel power MOSFET in TO-220AB package, optimized for high-voltage flyback SMPS topologies with low gate charge (23 nC) and rugged avalanche capability (290 mJ single-pulse). It operates up to 150 °C junction temperature and delivers 2.2 Ω RDS(on) at VGS = 10 V, enabling efficient switching in uninterruptible power supplies and industrial DC-DC converters.

For engineers reviewing the IRFBC30ASPBF datasheet, IRFBC30ASPBF pinout, IRFBC30ASPBF application, or IRFBC30ASPBF equivalent, this page provides verified device identity, validated thermal and dynamic parameters, confirmed TO-220AB terminal mapping, and two rigorously cross-referenced alternative parts for high-voltage SMPS design continuity.

Technical Context

This MOSFET employs planar vertical DMOS technology with fully characterized Ciss (510 pF), Coss (70 pF), and Crss (3.5 pF) to support precise snubber design and EMI prediction in 300–480 V DC bus applications. Its 7.0 V/ns peak diode recovery dV/dt rating and 400–600 ns body diode trr enable stable operation under fast-switching, inductive-load conditions.

The device features a gate threshold voltage range of 2.0–4.5 V and exhibits +0.67 V/°C VDS temperature coefficient - critical for overvoltage protection coordination in wide-temperature-range power systems. Avalanche energy ratings (EAS = 290 mJ, IAR = 3.6 A) are specified per repetitive and single-pulse test conditions with defined L, Rg, and TJ constraints.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - supports 480 V DC bus designs with 25 % safety margin against transients
RDS(on) 2.2 Ω @ VGS = 10 V - determines conduction loss in continuous 3.6 A operation
Qg 23 nC max - defines gate driver current requirement and switching speed trade-off
EAS 290 mJ single-pulse - enables unclamped inductive switching without failure in flyback snubberless designs
tr/tf 13 ns / 12 ns - sets minimum achievable switching frequency before overlap losses dominate
TJ Range −55 to +150 °C - qualifies for industrial and telecom power supply environments
Coss eff. 31 pF - fixed capacitance modeling output charge behavior during 0–480 V VDS rise

Pinout & Package

IRFBC30ASPBF uses the standard TO-220AB package with isolated tab (drain-connected), 3-pin through-hole configuration, and 1.7 °C/W junction-to-case thermal resistance. Mounting torque is 1.1 N·m for M3 screws.

Pin/Terminal Circuit Role Design Meaning
G (Gate) Control electrode Accepts 10 V logic-level drive; 5.4 nC Qgs defines Miller plateau duration
D (Drain) High-side power terminal Connected to TO-220 tab; requires insulated mounting for non-ground-referenced topologies
S (Source) Power return and reference node Forms common return path for gate drive and load current; referenced for VGS control

Key Features

Feature Design Value
Low Qg (23 nC) Reduces gate driver power dissipation and simplifies drive circuitry in high-frequency SMPS
Characterized Coss and Crss Enables accurate calculation of turn-off energy and snubber component selection
Avalanche-rated (290 mJ) Eliminates need for external clamping in flyback transformer reset circuits
Improved dV/dt ruggedness (7.0 V/ns) Prevents spurious turn-on during high dv/dt commutation in noisy power stages
RoHS-compliant Pb-free termination Meets EU Directive 2011/65/EU without lead content; compatible with standard reflow profiles

Applications

AC-DC Flyback Converter Industrial UPS Inverter Stage

Use Scenario: Primary-side switch in 60–150 W offline flyback power supply with universal AC input (85–265 VAC).

IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer via transformer primary winding; operates at 65–130 kHz with zero-voltage switching assist.

Use Value: 600 V VDS rating accommodates reflected output voltage plus leakage spike; 290 mJ EAS sustains unclamped inductive turn-off without snubber.

Use Scenario: DC bus switching element in 1–3 kVA line-interactive UPS inverters converting 360–400 V DC to 230 V AC.

IC Role / Device Role / Timing Role: Half-bridge high-side switch in modified sine-wave or PWM inverter stage; gated by isolated gate driver with 1.1 μs propagation delay.

Use Value: 150 °C TJ rating ensures reliability under sustained overload; 7.0 V/ns dV/dt immunity prevents false triggering during bus transients.

LED Driver Power Stage Telecom DC-DC Brick

Use Scenario: Primary switch in constant-current LED driver for street lighting (input 277 VAC, output 72 V/1.5 A).

IC Role / Device Role / Timing Role: Regulated high-side switch in quasi-resonant flyback topology; modulated via primary-side sensing feedback loop.

Use Value: 2.2 Ω RDS(on) limits conduction loss to <1.8 W at full load; 400–600 ns trr minimizes body diode reverse recovery loss.

Use Scenario: Input-stage switch in 48 V input telecom DC-DC brick (output 12 V/20 A) with active clamp forward topology.

IC Role / Device Role / Timing Role: Main power switch handling 48 V DC input; synchronized to controller with 12 Ω gate resistor for controlled dI/dt.

Use Value: 510 pF Ciss and 31 pF Coss eff. allow precise timing of zero-voltage switching transitions; TO-220AB package enables direct heatsink mounting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP6NK60ZFP 600 V, 5.5 A, RDS(on) = 1.2 Ω, Qg = 22 nC, TO-220FP package (full-pack) Higher current rating but lower avalanche energy (170 mJ); no specified dV/dt rating Preferred where higher continuous current is needed and avalanche stress is limited; requires verification of thermal interface due to insulated package
FQP6N60C 600 V, 5.4 A, RDS(on) = 1.4 Ω, Qg = 25 nC, TO-220 package with drain-connected tab Lower RDS(on) and higher ID, but EAS = 180 mJ and trr = 500 ns (typ.) Selected when conduction loss dominates design; not recommended for high-dV/dt or high-energy avalanche scenarios without additional clamping

Compared with IRFBC30ASPBF, STP6NK60ZFP offers higher current capacity but reduced avalanche robustness, while FQP6N60C lowers conduction loss at the expense of lower EAS and unverified dV/dt immunity - making IRFBC30ASPBF the preferred choice for unclamped flyback and high-transient industrial UPS applications.

Availability

IRFBC30ASPBF is available at Aetrix Electronics and suitable for AC-DC flyback converters, industrial UPS inverters, and telecom DC-DC bricks requiring stable component supply across extended production lifecycles.

Supply support for IRFBC30ASPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability power MOSFETs, diodes, and optoelectronics for industrial, automotive, and computing markets.

The IRFBC30ASPBF belongs to Vishay's high-voltage planar MOSFET product line, engineered specifically for rugged, high-efficiency switching in offline power supplies and uninterruptible power systems.

FAQ

What is the maximum continuous drain current for IRFBC30ASPBF at 100 °C case temperature?

The maximum continuous drain current for IRFBC30ASPBF is 2.3 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package and must be applied in thermal design calculations alongside RthJC = 1.7 °C/W to ensure junction temperature remains ≤150 °C under actual operating conditions. IRFBC30ASPBF maintains safe operation only when heatsinking and ambient conditions support this derated current.

Does IRFBC30ASPBF have a built-in body diode, and what are its key parameters?

Yes, IRFBC30ASPBF integrates a monolithic body diode with typical forward voltage VSD = 1.6 V at IS = 3.6 A and TJ = 25 °C. Its reverse recovery time trr is 400–600 ns under standardized test conditions (IF = 3.6 A, dI/dt = 100 A/μs), and Qrr is 1.1–1.7 μC. These values directly impact switching loss and EMI in hard-switched topologies, and IRFBC30ASPBF's characterized trr enables accurate loss modeling.

Is IRFBC30ASPBF RoHS-compliant and halogen-free?

IRFBC30ASPBF is RoHS-compliant (lead-free) as indicated by the "PbF" suffix and confirmed in Vishay document 91108. However, it is not halogen-free - the "-BE3" variant (IRFBC30APbF-BE3) carries that qualification. The IRFBC30ASPBF meets EU Directive 2011/65/EU requirements and is qualified for standard Pb-free reflow soldering processes, with peak temperature tolerance up to 300 °C for 10 seconds.

What is the gate threshold voltage range for IRFBC30ASPBF, and how does it affect drive design?

The gate threshold voltage VGS(th) for IRFBC30ASPBF is specified from 2.0 V to 4.5 V at ID = 250 μA. This range indicates variability in turn-on point across units and temperature, requiring gate drive voltages ≥10 V to ensure full enhancement and minimal RDS(on). Drive circuits must supply sufficient current to charge 23 nC total gate charge within required switching times, and IRFBC30ASPBF's 5.4 nC Qgs defines the initial Miller plateau duration.

Can IRFBC30ASPBF replace IRFBC30A in existing designs?

Yes, IRFBC30ASPBF is the Pb-free version of IRFBC30A and shares identical electrical, thermal, and mechanical specifications - including VDS = 600 V, RDS(on) = 2.2 Ω, Qg = 23 nC, and TO-220AB package dimensions. No layout or schematic changes are required; only soldering profile adjustments may be needed to accommodate Pb-free reflow. IRFBC30ASPBF maintains full functional and parametric equivalence with IRFBC30A per Vishay documentation S21-0868-Rev. C.

IRFBC30ASPBF Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
3.6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.2Ohm @ 2.2A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
23 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
510 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
74W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

IRFBC30ASPBF FAQ

1.How can I place an order for IRFBC30ASPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFBC30ASPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFBC30ASPBF reliable?

The price and inventory of IRFBC30ASPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFBC30ASPBF is usually 5 days.

3.What payment methods are accepted for IRFBC30ASPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFBC30ASPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFBC30ASPBF?

IRFBC30ASPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFBC30ASPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFBC30ASPBF?

For technical support, including IRFBC30ASPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFBC30ASPBF requirements.

6.How does Aetrix verify that IRFBC30ASPBF is sourced from the original manufacturer or authorized distributors?

All IRFBC30ASPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFBC30ASPBF meets industry standards.

7.What is the process for return or replacement of IRFBC30ASPBF?

All IRFBC30ASPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFBC30ASPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFBC30ASPBF part is unused and in its original packaging.

Return procedure for IRFBC30ASPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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