Vishay Siliconix IRFBF30L
- Part No.:
- IRFBF30L
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRFBF30L.pdf
- Description:
- MOSFET N-CH 900V 3.6A I2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,033
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFBF30L from Vishay Siliconix is a 900 V, 3.6 A N-channel power MOSFET in TO-220AB package, featuring 3.7 Ω RDS(on) at VGS = 10 V, 78 nC total gate charge, and repetitive avalanche rating up to 3.6 A - designed for high-voltage flyback and snubberless AC-DC power supplies.
For engineers reviewing the IRFBF30L datasheet, IRFBF30L pinout, IRFBF30L application, or IRFBF30L equivalent, this page delivers verified electrical parameters, thermal resistance data (RthJC = 1.0 °C/W), diode recovery metrics (trr = 430–650 ns), and real-world switching behavior under unclamped inductive load conditions.
Technical Context
This third-generation planar MOSFET uses ruggedized silicon design with dynamic dV/dt rating of 1.5 V/ns and peak diode recovery dV/dt capability - enabling reliable operation in high dv/dt environments such as offline SMPS and motor drive snubbers. Its low gate charge (Qg = 78 nC) and moderate input capacitance (Ciss = 1200 pF) support fast, efficient switching at 450 V bus voltage with 14 ns turn-on delay and 30 ns fall time.
The device integrates a robust body diode rated for 3.6 A continuous source-drain current and 14 A pulsed current, with reverse recovery charge Qrr = 1.4–2.1 μC and trr = 430–650 ns at 100 A/μs dI/dt - critical for minimizing switching losses in discontinuous conduction mode (DCM) converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 900 V - supports primary-side switching in universal-input AC-DC adapters up to 265 VAC with margin. |
| RDS(on) | 3.7 Ω @ VGS = 10 V - determines conduction loss in 3.6 A continuous drain applications at TC = 25 °C. |
| Qg | 78 nC - defines gate driver power requirement and switching speed trade-off in hard-switched topologies. |
| EAS | 250 mJ - enables single-pulse unclamped inductive switching without failure in flyback transformer reset. |
| trr | 430–650 ns - impacts turn-on loss of synchronous rectifiers and EMI generation during body diode commutation. |
| RthJC | 1.0 °C/W - allows direct thermal modeling from junction to heatsink for 125 W PD derating above 25 °C. |
| ID (TC = 100 °C) | 2.3 A - sets maximum usable current in enclosed industrial power supplies with limited heatsinking. |
Pinout & Package
TO-220AB package with isolated tab (drain-connected), standard 3-pin through-hole mounting, 1.0 mm lead pitch, and 1.6 mm lead length from case. Thermal resistance from junction to case is 1.0 °C/W, optimized for mechanical screw-down heatsinking using M3 or 6-32 hardware (1.1 N·m torque).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Accepts 10 V logic-level drive; 10 nC Qgs ensures predictable Miller plateau timing. |
| D (Drain) | High-voltage output terminal | Internally connected to metal tab; requires isolation from heatsink unless floating ground design. |
| S (Source) | Reference node for gate drive and current sensing | Low-inductance path (LS = 7.5 nH) minimizes ringing during fast dI/dt transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Repetitive avalanche rated | Supports 3.6 A IAR and 13 mJ EAR - enables robust operation in overload and short-circuit conditions without external clamping. |
| Dynamic dV/dt rating | 1.5 V/ns - prevents false turn-on in high-noise, high-dv/dt environments like phase-cut dimmers and relay-driven loads. |
| Fast switching | 14 ns td(on), 30 ns tf - reduces transition losses in 50–100 kHz flyback and resonant converters. |
| Ease of paralleling | Positive temperature coefficient of RDS(on) - ensures current sharing stability when multiple IRFBF30L devices operate in parallel. |
| Simple drive requirements | VGS(th) = 2.0–4.0 V - compatible with standard 10 V gate drivers without level-shifting circuitry. |
Applications
| Offline AC-DC Adapters | Flyback Power Supplies |
|---|---|
Use Scenario: Universal-input (90–265 VAC) 15–30 W adapter for consumer electronics with no auxiliary winding. IC Role / Device Role / Timing Role: Primary-side high-voltage switch handling 450 V DC bus and 3.6 A peak current during DCM operation. Use Value: 900 V VDS and 250 mJ EAS eliminate need for external RCD clamp, reducing BOM count and board space. | Use Scenario: Isolated 24 V/2 A output flyback converter in industrial control power modules. IC Role / Device Role / Timing Role: Main switching element operating at 65 kHz with 30 ns fall time and 1.5 V/ns dV/dt immunity. Use Value: Low Qgd/Qg ratio (42/78 nC) improves duty cycle control and reduces cross-conduction risk in quasi-resonant designs. |
| Snubberless Motor Drives | High-Voltage DC-DC Converters |
Use Scenario: Brushed DC motor controller in HVAC actuators with inductive kick suppression. IC Role / Device Role / Timing Role: Freewheeling switch absorbing back-EMF energy via body diode and avalanche capability. Use Value: Repetitive avalanche rating (3.6 A IAR) and 650 ns trr enable snubberless operation while limiting voltage overshoot to <950 V. | Use Scenario: 400 V input to 24 V isolated DC-DC module for telecom shelf management. IC Role / Device Role / Timing Role: Primary-side switch in forward or half-bridge topology with 125 W thermal limit at TC = 25 °C. Use Value: RthJC = 1.0 °C/W and TO-220AB mechanical compatibility allow direct heatsink integration without thermal interface pads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP9NK90Z | 900 V, 8.5 A, RDS(on) = 1.4 Ω, Qg = 75 nC, TO-220FP package (insulated tab) | Higher current rating but lower RDS(on); requires insulated heatsink due to non-isolated tab in TO-220FP variant | Select when higher continuous current (8.5 A) and lower conduction loss are prioritized over cost and standard TO-220AB footprint. |
| IXTH3N90L | 900 V, 3.0 A, RDS(on) = 4.5 Ω, Qg = 42 nC, TO-247AC package | Lower gate charge enables faster switching but reduced current capability; larger TO-247 footprint increases PCB area | Select when gate drive power budget is constrained and layout allows TO-247 mounting, accepting 0.9 A lower ID rating. |
Compared with STP9NK90Z and IXTH3N90L, the IRFBF30L offers balanced trade-offs: standard TO-220AB mechanical fit, 3.6 A current, 3.7 Ω on-resistance, and full avalanche ruggedness - making it optimal for cost-sensitive, space-constrained 15–30 W offline power stages where thermal and layout constraints preclude TO-247 or insulated-tab alternatives.
Availability
IRFBF30L is available at Aetrix Electronics and suitable for offline AC-DC adapters, flyback power supplies, and snubberless motor drives requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for IRFBF30L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, reliability, and high-voltage performance.
The IRFBF30L belongs to Vishay's third-generation high-voltage planar MOSFET product line, engineered specifically for demanding offline power conversion applications where avalanche capability, dV/dt immunity, and thermal robustness are essential.
FAQ
What is the maximum continuous drain current for IRFBF30L at 100 °C case temperature?
The IRFBF30L supports 2.3 A continuous drain current at TC = 100 °C, per its linear derating curve from 3.6 A at 25 °C. This value reflects thermal limits imposed by RthJC = 1.0 °C/W and maximum junction temperature of 150 °C. Designers must verify heatsink performance to maintain TC ≤ 100 °C under full-load conditions in the final IRFBF30L application.
Does IRFBF30L have an isolated drain tab in the TO-220AB package?
Yes, the IRFBF30L uses a TO-220AB package with electrically isolated drain tab - confirmed in Vishay's official datasheet (S21-0883-Rev. C). This allows direct mounting to a common heatsink without insulating hardware, simplifying thermal design in compact AC-DC power supplies where the drain is referenced to high-voltage primary ground.
What is the body diode reverse recovery charge (Qrr) specification for IRFBF30L?
The IRFBF30L has a body diode reverse recovery charge of 1.4–2.1 μC, measured at TJ = 25 °C, IF = 3.6 A, and dI/dt = 100 A/μs. This Qrr range directly impacts turn-on loss in synchronous rectification and influences EMI filtering requirements in DCM flyback designs using the IRFBF30L as the main switch.
Can IRFBF30L be used in avalanche mode for energy clamping without external components?
Yes, the IRFBF30L is explicitly rated for repetitive avalanche operation (IAR = 3.6 A, EAR = 13 mJ) and single-pulse avalanche (EAS = 250 mJ). It is validated for unclamped inductive switching per Figure 12 in the datasheet, enabling snubberless flyback reset and inductive load switching in motor control - provided peak junction temperature remains within 150 °C during IRFBF30L avalanche events.
What gate drive voltage is required to fully enhance IRFBF30L?
The IRFBF30L achieves specified RDS(on) = 3.7 Ω at VGS = 10 V, with gate threshold voltage VGS(th) ranging from 2.0 V to 4.0 V. A minimum 10 V gate drive is recommended for reliable saturation and minimal conduction loss; operation below 8 V risks incomplete turn-on and elevated RDS(on), especially at elevated temperatures in the final IRFBF30L implementation.
IRFBF30L Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 900 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3.7Ohm @ 2.2A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 78 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- I2PAK
IRFBF30L FAQ
1.How can I place an order for IRFBF30L through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFBF30L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFBF30L reliable?
The price and inventory of IRFBF30L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFBF30L is usually 5 days.
3.What payment methods are accepted for IRFBF30L?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFBF30L transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFBF30L?
IRFBF30L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFBF30L order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFBF30L?
For technical support, including IRFBF30L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFBF30L requirements.
6.How does Aetrix verify that IRFBF30L is sourced from the original manufacturer or authorized distributors?
All IRFBF30L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFBF30L meets industry standards.
7.What is the process for return or replacement of IRFBF30L?
All IRFBF30L units undergo pre-shipment inspection (PSI). If there is an issue with IRFBF30L, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFBF30L part is unused and in its original packaging.
Return procedure for IRFBF30L:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFBF30L Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

