NXP Semiconductors IRFR220,118
- Part No.:
- IRFR220,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR220,118.pdf
- Description:
- MOSFET N-CH 200V 4.8A DPAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRFR220,118 from NXP Semiconductors (formerly Philips) is an N-channel enhancement-mode TrenchMOS™ power MOSFET in SOT428 (D-PAK) package, rated for 200 V VDS, 4.8 A continuous drain current at Tmb = 25 °C, and 0.7 Ω typical RDS(on) at VGS = 10 V and ID = 2.9 A. It serves as a high-efficiency switching element in medium-power DC-DC converters and offline SMPS primary-side switches.
For engineers reviewing the IRFR220,118 datasheet, IRFR220,118 pinout, IRFR220,118 application, or IRFR220,118 equivalent, key selection criteria include its 3 K/W junction-to-mounting-base thermal resistance, fast 5 ns turn-on delay, 17 ns rise time, and integrated source-drain diode with 85 ns reverse recovery time - all critical for high-frequency hard-switched topologies.
Technical Context
This device employs TrenchMOS™ technology to achieve low on-resistance and fast switching with minimal gate charge (10 nC typical total Qg). Its gate threshold voltage ranges from 2 V to 4 V at Tj = 25 °C, enabling reliable turn-on with standard 10 V gate drivers.
The mounting base (pin 2) is internally connected to the drain, forming a thermally optimized, electrically isolated heatsink interface. The SOT428 package supports surface-mount assembly while delivering 42 W total power dissipation at Tmb = 25 °C - contingent on PCB copper area and thermal vias.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V maximum - supports 170 V DC bus designs with 15% margin for voltage spikes in flyback/forward converters. |
| RDS(on) | 0.7 Ω typical at VGS = 10 V, ID = 2.9 A - enables <1.5 W conduction loss at 4 A, reducing thermal load in compact layouts. |
| Qg(tot) | 10 nC typical - allows efficient drive with low-current gate drivers (e.g., 100 mA peak) and reduces switching loss at 100–500 kHz. |
| tr/tf | 17 ns / 18 ns - supports clean edge transitions in hard-switched topologies without excessive EMI or shoot-through risk. |
| Rth(j-mb) | 3 K/W - requires ≥250 mm² of 2-oz copper on inner layer under mounting base to sustain 4.8 A continuous operation at ambient ≤50 °C. |
| VSD | 1.8 V max at IS = 4.8 A - defines forward drop of intrinsic body diode during synchronous rectification or freewheeling phases. |
| trr | 85 ns typical - limits reverse recovery energy in discontinuous conduction mode (DCM) operation, affecting efficiency and snubber sizing. |
Pinout & Package
SOT428 (D-PAK) package with three terminals: pins 1 (gate), 3 (source), and mounting base (drain). Pin 2 is not connected - internal drain connection is made exclusively through the metal mounting base (MB), which must be soldered to a thermally robust PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate (G) | Control terminal; accepts 0–20 V DC gate-source voltage; 100 nA leakage at ±20 V ensures low static power draw. |
| Pin 3 | Source (S) | Reference node for gate drive and current sensing; tied to system ground or low-side switch node in buck/boost topologies. |
| Mounting Base (MB) | Drain (D) | High-voltage power terminal and primary thermal path; electrically identical to drain; must be isolated from other layers except dedicated thermal vias. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ technology | Enables 0.7 Ω RDS(on) in SOT428 - 30% lower than planar MOSFETs of comparable voltage rating, improving conduction efficiency. |
| Surface-mount D-PAK package | Supports automated assembly and provides 42 W power handling - superior thermal performance vs. SO-8 or TO-252 variants without requiring through-hole mounting. |
| Low Qgd/Qgs ratio | Miller charge (Qgd) is 4.0–7.9 nC vs. gate-source charge (Qgs) of 1.5–3.0 nC - improves immunity to dv/dt-induced false turn-on in high-side configurations. |
| Integrated source-drain diode | Rated for 4.8 A DC forward current and 19 A peak - eliminates need for external freewheeling diode in low-frequency PWM applications like motor drives. |
| 150 °C maximum junction temperature | Allows operation in sealed industrial enclosures up to 70 °C ambient when mounted on ≥400 mm² 2-oz copper with 12 thermal vias (0.3 mm diameter). |
Applications
| AC-DC Adapter | Isolated DC-DC Converter |
|---|---|
Use Scenario: 36 W universal-input (90–264 V AC) flyback adapter powering consumer electronics. IC Role / Device Role / Timing Role: Primary-side switching transistor operating at 65 kHz with self-supplied gate drive via auxiliary winding. Use Value: 0.7 Ω RDS(on) and 10 nC Qg reduce combined conduction and switching losses to <1.2 W, enabling >85% efficiency without active cooling. |
Use Scenario: 48 V input to 12 V/3 A isolated forward converter in telecom power shelf. IC Role / Device Role / Timing Role: Main power switch synchronized to 200 kHz controller; body diode handles reset current during dead time. Use Value: 85 ns trr and 1.8 V VSD minimize reverse recovery loss and voltage overshoot, reducing snubber component count by 40%. |
| Industrial Motor Control | LED Driver Power Stage |
Use Scenario: 24 V DC brushless fan driver with PWM speed control in HVAC control panel. IC Role / Device Role / Timing Role: Low-side switch modulating motor phase current at 25 kHz; gate driven directly from microcontroller GPIO. Use Value: 2–4 V VGS(th) ensures full enhancement with 3.3 V logic-level drive, eliminating need for level-shifting circuitry. |
Use Scenario: Constant-current 36 V LED string driver using buck topology in streetlight fixture. IC Role / Device Role / Timing Role: High-side switch controlling inductor current; operates in continuous conduction mode at 150 kHz. Use Value: 3 K/W Rth(j-mb) enables direct thermal coupling to aluminum housing, maintaining Tj < 110 °C at 3.5 A without heatsink. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK60ZFP | 600 V VDS, 2.5 A ID, 3.3 Ω RDS(on), TO-220FP package | Higher voltage rating but lower current and higher on-resistance; requires through-hole mounting and larger heatsink. | Prefer when 600 V blocking is mandatory and board space permits larger footprint; not suitable for SMT-only production. |
| IRLML6344TRPBF | 20 V VDS, 4.3 A ID, 0.035 Ω RDS(on), SOT-23 package | Lower voltage, much lower RDS(on), but limited to ≤25 V systems; unsuitable for 100+ V DC bus applications. | Select only for low-voltage (<20 V), high-efficiency battery-powered loads where SOT-23 size is critical. |
Compared with STP3NK60ZFP and IRLML6344TRPBF, the IRFR220,118 uniquely balances 200 V capability, SMT compatibility, and sub-1 Ω on-resistance in a thermally optimized D-PAK - making it optimal for cost-sensitive, medium-power industrial and adapter designs where voltage margin and manufacturability are both essential.
Availability
IRFR220,118 is available at Aetrix Electronics and suitable for switched-mode power supplies, DC-DC converters, and industrial motor control circuits requiring stable component supply and long-term obsolescence management.
Supply support for IRFR220,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Philips' pioneering semiconductor division.
The IRFR220,118 belongs to NXP's legacy TrenchMOS™ power MOSFET family, engineered specifically for high-efficiency, medium-voltage switching in space-constrained industrial and consumer power supplies.
FAQ
What is the maximum continuous drain current for IRFR220,118 at 100 °C mounting base temperature?
The IRFR220,118 supports 3.0 A continuous drain current at Tmb = 100 °C and VGS = 10 V, as specified in Table 3 of the datasheet. This derating reflects thermal limitations of the SOT428 package; operation above this current requires forced air cooling or enhanced PCB copper to maintain Tj ≤ 150 °C. The IRFR220,118 must be mounted on ≥300 mm² of 2-oz copper with ≥8 thermal vias to achieve this rating reliably.
Does IRFR220,118 have a built-in body diode, and what are its key parameters?
Yes, the IRFR220,118 integrates a source-drain (body) diode rated for 4.8 A DC forward current and 19 A peak. Its forward voltage is 1.8 V maximum at IS = 4.8 A and VGS = 0 V, and reverse recovery time is 85 ns typical at IS = 4.8 A, dIS/dt = −100 A/µs, and VDS = 30 V. These values are confirmed in Table 5 of the datasheet and define the IRFR220,118's suitability for freewheeling and synchronous rectification roles.
Can IRFR220,118 be driven directly by a 3.3 V microcontroller GPIO pin?
No - the IRFR220,118 has a gate threshold voltage range of 2–4 V, but full enhancement (to achieve 0.7 Ω RDS(on)) requires VGS ≥ 10 V. Driving it with only 3.3 V results in high on-resistance (>5 Ω), excessive conduction loss, and potential thermal runaway. A dedicated gate driver or level shifter is required; the IRFR220,118 must see ≥10 V between gate and source to perform per specification.
What is the thermal resistance from junction to mounting base for IRFR220,118, and how is it measured?
The IRFR220,118 has a thermal resistance Rth(j-mb) of 3 K/W, measured under conditions of mounting on a metal-clad substrate per Figure 4 in the datasheet. This value assumes direct soldering of the mounting base to a large copper area with no insulating thermal pad. Adding a 0.1 mm silicone pad increases Rth(j-mb) by ~1.2 K/W, degrading the IRFR220,118's power handling by over 25% - so bare-metal PCB attachment is strongly recommended.
Is pin 2 of the IRFR220,118 functional, and what is its purpose in the SOT428 package?
No - pin 2 of the IRFR220,118 in the SOT428 (D-PAK) package is not connected and must not be soldered or used for electrical contact. The drain is connected solely to the mounting base (MB), which is electrically and thermally coupled to the internal die. As stated in the "Pinning information" section, "It is not possible to make connection to pin 2"; attempting to use it risks mechanical stress and thermal delamination of the IRFR220,118 package.
IRFR220,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 800mOhm @ 2.9A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 280 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 42W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
IRFR220,118 FAQ
1.How can I place an order for IRFR220,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR220,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR220,118 reliable?
The price and inventory of IRFR220,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR220,118 is usually 5 days.
3.What payment methods are accepted for IRFR220,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR220,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR220,118?
IRFR220,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR220,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR220,118?
For technical support, including IRFR220,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR220,118 requirements.
6.How does Aetrix verify that IRFR220,118 is sourced from the original manufacturer or authorized distributors?
All IRFR220,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR220,118 meets industry standards.
7.What is the process for return or replacement of IRFR220,118?
All IRFR220,118 units undergo pre-shipment inspection (PSI). If there is an issue with IRFR220,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR220,118 part is unused and in its original packaging.
Return procedure for IRFR220,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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