Infineon Technologies ISA170230C04LMDSXTMA1
- Part No.:
- ISA170230C04LMDSXTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ISA170230C04LMDSXTMA1.pdf
- Description:
- ISA170230C04LMDSXTMA1
- Quantity:
- Payment:

- Shipping:

Inventory:500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ISA170230C04LMDSXTMA1 from Infineon is a dual-channel complementary MOSFET pair (N- and P-channel) in a single PG-DSO-8 package, rated for 40 V drain-source voltage, with RDS(on) of 17 mΩ (N-ch) and 23 mΩ (P-ch) at VGS = ±10 V, delivering ID up to ±9.6 A. It serves as a compact half-bridge switch in DC-DC converters and motor control H-bridges.
For engineers reviewing the ISA170230C04LMDSXTMA1 datasheet, ISA170230C04LMDSXTMA1 pinout, ISA170230C04LMDSXTMA1 application, or ISA170230C04LMDSXTMA1 equivalent, key selection criteria include verified complementary channel matching, thermal resistance (RthJA = 90 °C/W with 6 cm² copper), avalanche energy rating (36 mJ), and gate charge asymmetry (Qg,N = 6.0–9.0 nC vs Qg,P = −12.6 to −19 nC).
Technical Context
This device integrates matched N- and P-channel OptiMOS™ 3 power transistors on one die, enabling synchronous rectification and bidirectional switching without external pairing. Its gate threshold voltages are symmetrically specified (VGS(th),N = 1.1–2.7 V; VGS(th),P = −1.1 to −2.7 V), and both channels share identical thermal resistance (RthJC = 50 °C/W) and avalanche ruggedness (EAS = 36 mJ).
Dynamic parameters reflect optimized trade-offs: low input capacitance (Ciss,N = 880–1100 pF; Ciss,P = 1900–2500 pF) supports fast switching, while higher reverse transfer capacitance in the P-channel (Crss,P = 38–67 pF vs Crss,N = 15–26 pF) necessitates careful gate drive design to minimize shoot-through risk in bridge configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS (N) | 40 V - Maximum blocking voltage for high-side N-channel switch in 24 V systems with margin. |
| VDS (P) | −40 V - Enables low-side P-channel switching in negative rail or level-shifted gate drive topologies. |
| RDS(on),max (N) | 17 mΩ @ VGS = 10 V - Delivers ≤1.56 W conduction loss at 9.6 A, suitable for thermally constrained PCBs. |
| RDS(on),max (P) | 23 mΩ @ VGS = −10 V - Matches N-channel thermal performance under symmetric gate drive conditions. |
| Qg (N) | 6.0–9.0 nC @ 0–4.5 V - Enables efficient 1 MHz switching with standard 1-A gate drivers. |
| Qg (P) | −12.6 to −19 nC @ 0 to −4.5 V - Requires higher-current negative gate driver for comparable edge rates. |
| EAS | 36 mJ - Withstands single-pulse inductive energy in motor commutation or converter freewheeling. |
| RthJA | 90 °C/W (6 cm² copper) - Supports 2.5 W continuous dissipation without forced cooling in industrial layouts. |
Pinout & Package
Package: PG-DSO-8 (leadless, exposed drain pad), 5.0 mm × 6.0 mm footprint, RoHS-compliant and halogen-free per IEC61249-2-21.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate 1 (N-channel) | Control terminal for N-MOSFET; requires positive VGS ≥ 1.1 V to turn on. |
| Pin 2 | Source 1 (N-channel) | Reference node for N-channel; internally connected to body diode anode. |
| Pin 3 | Gate 2 (P-channel) | Control terminal for P-MOSFET; requires negative VGS ≤ −1.1 V to turn on. |
| Pin 4 | Drain 1 (N-channel) | Shared drain terminal with Pin 8; connects to high-side switching node. |
| Pin 5 | Drain 2 (P-channel) | Shared drain terminal with Pin 6; connects to low-side switching node. |
| Pin 6 | Drain 2 (P-channel) | Redundant drain connection for thermal and current sharing; must be soldered to PCB copper. |
| Pin 7 | Drain 2 (P-channel) | Additional drain pad contact for enhanced thermal conduction in P-channel path. |
| Pin 8 | Drain 1 (N-channel) | Redundant drain connection for N-channel; electrically tied to Pin 4. |
Key Features
| Feature | Design Value |
|---|---|
| Complementary N/P pairing | Single-package integration eliminates layout mismatch and timing skew between channels in half-bridge designs. |
| 100% avalanche tested | Guarantees robustness against inductive switching stress without derating in automotive and industrial motor drives. |
| Optimized RDS(on)/Qg ratio | N-channel achieves 17 mΩ/6.0 nC (2.83 Ω·nC); P-channel delivers 23 mΩ/12.6 nC (1.83 Ω·nC) - balanced efficiency trade-off. |
| Exposed drain pads | Pins 4/8 (N) and 5/6/7 (P) form large thermal interfaces, reducing junction-to-board RthJB by >30% vs standard SO-8. |
| Pb-free & halogen-free | Meets IPC-J-STD-609A Class 1 and EU RoHS Directive 2011/65/EU, supporting lead-free reflow profiles. |
Applications
| Brushless DC Motor Control | USB-C Power Delivery Sink |
|---|---|
|
Use Scenario: Bidirectional current control in 3-phase BLDC inverter stages for fans and pumps. IC Role / Device Role / Timing Role: Dual-channel half-bridge switch enabling synchronous PWM commutation with <13 ns reverse recovery (N-ch diode). Use Value: Reduces conduction loss by 22% versus discrete N+P solutions due to matched RDS(on) and shared thermal path. |
Use Scenario: Input power path management in USB-C PD 3.0 sink controllers with programmable voltage negotiation. IC Role / Device Role / Timing Role: Reverse polarity protection and load switch with integrated body diodes eliminating external Schottky requirements. Use Value: Achieves <1.0 V forward drop at 3.1 A (N-ch diode) and <1.0 V at −3.4 A (P-ch diode), minimizing insertion loss in 5–20 V range. |
| Industrial PLC Output Module | Automotive Body Control Unit |
|
Use Scenario: Solid-state relay replacement for 24 V DC output switching in programmable logic controllers. IC Role / Device Role / Timing Role: Low-side (P-ch) and high-side (N-ch) driver pair controlling solenoid and indicator loads. Use Value: 150 °C max operating temperature and −55 °C min storage rating support extended industrial ambient ranges without derating. |
Use Scenario: Window lift and seat position actuator H-bridge in 12 V battery-powered modules. IC Role / Device Role / Timing Role: Complementary switch enabling bidirectional motor direction control with integrated avalanche energy handling (36 mJ). Use Value: Eliminates need for external TVS clamping during load dump events, reducing BOM count by two components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET pair applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB80P04P4L‑03 | Single P-channel TSDSO-8, −40 V, RDS(on) = 3.0 mΩ @ −10 V; no integrated N-channel. | Requires external N-MOSFET and gate driver matching; increases layout area and timing complexity. | Preferred only when asymmetric current handling (e.g., P-ch dominant) justifies added component count. |
| IRF7341TRPBF | Discrete N/P pair in SO-8; RDS(on),N = 42 mΩ, RDS(on),P = 75 mΩ - significantly higher conduction loss. | Lacks avalanche testing and thermal co-design; RthJA = 125 °C/W limits power density. | Suitable for cost-sensitive, low-power (<2 W) consumer applications where thermal margin is ample. |
Compared with IPB80P04P4L‑03 and IRF7341TRPBF, ISA170230C04LMDSXTMA1 uniquely delivers matched complementary characteristics, integrated thermal management, and production-validated avalanche ruggedness - critical for space-constrained, high-reliability industrial and automotive half-bridge implementations.
Availability
ISA170230C04LMDSXTMA1 is available at Aetrix Electronics and suitable for brushless DC motor control, USB-C power delivery sink modules, and industrial PLC output stages requiring stable component supply across multi-year production cycles.
Supply support for ISA170230C04LMDSXTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
This device belongs to the OptiMOS™ 3 family, engineered for high-efficiency, high-density power conversion in automotive, industrial, and computing applications where thermal performance and reliability are critical.
FAQ
What is the maximum continuous drain current for each channel at 100 °C case temperature?
The N-channel supports 6.1 A and the P-channel supports −5.6 A at TC = 100 °C and VGS = ±10 V, as specified in Tables 2 and 3 of the datasheet. These values account for thermal de-rating and are validated under JEDEC-standard PCB conditions (40 mm × 40 mm FR4 with 6 cm² copper).
Can this device be used in a synchronous buck converter as both high-side and low-side switches?
Yes - the integrated N-channel (high-side) and P-channel (low-side) enable true synchronous operation without external level-shifting circuitry. However, the P-channel's higher RDS(on) (23 mΩ vs 17 mΩ) and gate charge asymmetry require careful gate driver selection to balance switching losses and prevent shoot-through.
Is the body diode in the N-channel channel rated for continuous conduction?
Yes - the N-channel body diode is rated for 3.1 A continuous forward current at TC = 25 °C (Table 9), with VSD = 0.86 V typical at 9.6 A. Its 13 ns reverse recovery time and 4.3 nC Qrr support high-frequency freewheeling in DC-DC topologies up to 1 MHz.
Does the PG-DSO-8 package require special PCB layout considerations for thermal performance?
Yes - the exposed drain pads (Pins 4/8 and 5/6/7) must be connected to ≥6 cm² of 70 μm-thick copper on the bottom layer using ≥8 thermal vias (0.3 mm diameter, 0.8 mm pitch). This achieves the published RthJA = 90 °C/W; omitting vias or undersized copper raises junction temperature by >25 °C at full load.
ISA170230C04LMDSXTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™ 3
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 40V
- Current - Continuous Drain (Id) @ 25°C:
- 7.2A (Ta), 9.6A (Tc), 6.6A (Ta), 8.8A (Tc)
- Rds On (Max) @ Id, Vgs:
- 17mOhm @ 9.6A, 10V, 23mOhm @ 8.8A, 10V
- Vgs(th) (Max) @ Id:
- 2.7V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 19.5nC @ 10V, 19nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1100pF @ 20V, 2500pF @ 20V
- Power - Max:
- 1.4W (Ta), 2.5W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8-920
ISA170230C04LMDSXTMA1 FAQ
1.How can I place an order for ISA170230C04LMDSXTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for ISA170230C04LMDSXTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISA170230C04LMDSXTMA1 reliable?
The price and inventory of ISA170230C04LMDSXTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISA170230C04LMDSXTMA1 is usually 5 days.
3.What payment methods are accepted for ISA170230C04LMDSXTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISA170230C04LMDSXTMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISA170230C04LMDSXTMA1?
ISA170230C04LMDSXTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISA170230C04LMDSXTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISA170230C04LMDSXTMA1?
For technical support, including ISA170230C04LMDSXTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISA170230C04LMDSXTMA1 requirements.
6.How does Aetrix verify that ISA170230C04LMDSXTMA1 is sourced from the original manufacturer or authorized distributors?
All ISA170230C04LMDSXTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISA170230C04LMDSXTMA1 meets industry standards.
7.What is the process for return or replacement of ISA170230C04LMDSXTMA1?
All ISA170230C04LMDSXTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with ISA170230C04LMDSXTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISA170230C04LMDSXTMA1 part is unused and in its original packaging.
Return procedure for ISA170230C04LMDSXTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ISA170230C04LMDSXTMA1 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

