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Renesas KGF12N05-400-SP
- Part No.:
- KGF12N05-400-SP
- Manufacturer:
- Renesas
- Category:
- FETs, MOSFETs
- Package:
- 6-SMD, No Lead
- Datasheet:
-
KGF12N05-400-SP.pdf
- Description:
- MOSFET N-CH 5.5V 12A 6WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,049
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Product details
Overview
KGF12N05-400-SP from Intersil is a 5.5V, 12A N-channel power MOSFET in a 6-bump WLCSP package with 1.9mΩ rDS(ON) at VGS = 4.5V, 5nC total gate charge, and -55°C to +150°C operating temperature range. It serves as a high-density, low-voltage switching element in point-of-load DC/DC converters and OR'ing diode circuits.
For engineers reviewing the KGF12N05-400-SP datasheet, KGF12N05-400-SP pinout, KGF12N05-400-SP application, or KGF12N05-400-SP equivalent, key selection criteria include ultra-low on-resistance × gate charge figure of merit, chip-scale thermal performance (θJP = 10°C/W), and compatibility with standard SMT reflow for space-constrained portable electronics designs.
Technical Context
The KGF12N05-400-SP uses a chip-scale WLCSP construction with integrated CMOS and wafer-level packaging, enabling multidirectional current flow and minimizing parasitic inductance. Its 1.9mΩ rDS(ON) at 4.5V drive and 5nC Qg support high-frequency synchronous rectification in sub-5V power rails.
It features a known-good-FET quality assurance process, specified avalanche rating (IAS = 10A), and built-in body diode with 0.65V forward voltage at 5A. Thermal resistance from junction-to-pad (θJP = 10°C/W) enables direct thermal coupling to PCB copper planes in compact DC/DC modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 5.5V minimum - defines maximum allowable drain-source blocking voltage in low-voltage power switches |
| rDS(ON) | 1.9mΩ typical at VGS = 4.5V - enables <25mW conduction loss at 12A, critical for PoL efficiency |
| Qg | 5.0nC typical at VGS = 3.5V - supports >1MHz switching with minimal gate drive power |
| ID (continuous) | 12A at TA = +25°C - rated for sustained current in thermally managed layouts |
| θJP | 10°C/W typical - allows direct thermal path to PCB pad, reducing junction temperature rise under load |
| VGS(th) | 0.52–0.80V - ensures reliable turn-on with 3.3V or lower logic-level gate drivers |
| Package | 6-bump WLCSP - 1.47mm × 1.47mm die size, 400µm thickness, RoHS-compliant, SMT-reflow compatible |
Pinout & Package
6-bump Wafer-Level Chip-Scale Package (WLCSP) with 1.47mm × 1.47mm footprint, 400µm die thickness, and NiAu-plated bumps. Designed for standard SMT assembly and direct thermal transfer to PCB copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Controls channel conduction; low 1.0Ω gate resistance minimizes ringing in high-dV/dt environments |
| 2, 3, 4, 5 | Source (S) | Four parallel source terminals reduce current density and package inductance; electrically common |
| 6 | Drain (D) | Main current output terminal; connects to high-side or low-side switch node depending on topology |
Key Features
| Feature | Design Value |
|---|---|
| Industry-leading FoM (rDS(ON) × Qg) | 9.5 mΩ·nC - enables higher efficiency than trench MOSFETs in 1–3MHz DC/DC converters |
| Known Good FET (KGF) QA process | 100% tested at wafer level - eliminates infant mortality and improves field reliability in portable systems |
| Low-profile WLCSP | 400µm total height - fits under stacked components in ultra-thin mobile devices and wearables |
| High-frequency switching capability | Specified Crss = 230–300pF and Qgd = 1.2nC - reduces Miller effect and enables clean turn-off in synchronous buck stages |
| Integrated body diode | VSD = 0.65V at 5A - supports efficient reverse recovery in OR'ing and bidirectional power paths |
Applications
| Point-of-Load DC/DC Converters | OR'ing Diode Circuits |
|---|---|
Use Scenario: High-efficiency 3.3V or 5V step-down conversion in FPGA or SoC power domains where board area is constrained. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in buck converter topology, replacing Schottky diodes. Use Value: 1.9mΩ rDS(ON) cuts conduction loss by >60% vs. discrete 30V MOSFETs, improving full-load efficiency by ~1.2%. |
Use Scenario: Redundant power supply rail combining in servers or telecom equipment with hot-swap capability. IC Role / Device Role / Timing Role: Active OR'ing switch replacing passive diodes to minimize forward voltage drop and heat generation. Use Value: 0.65V body diode VF and low rDS(ON) reduce power dissipation by >75% compared to 0.4A Schottky diodes at 5A load. |
| Portable Electronics Power Management | USB-C PD Power Path Control |
Use Scenario: Input power switching and battery charging path control in smartphones and tablets with tight thermal budgets. IC Role / Device Role / Timing Role: Load switch for USB input or battery isolation, driven directly by 3.3V GPIO. Use Value: 0.62V typical VGS(th) ensures robust turn-on with 3.3V logic, while 12A rating supports fast-charging currents up to 9V/3A. |
Use Scenario: Bidirectional power path management in USB-C PD sink applications requiring reverse current blocking. IC Role / Device Role / Timing Role: Reverse-current protected high-side switch in PD controller reference designs. Use Value: Multidirectional current flow capability and 5.5V V(BR)DSS align with USB-C 5V nominal and 5.5V tolerance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon BSC014N04LS6 | 40V V(BR)DSS, 1.4mΩ rDS(ON) at 4.5V, PQFN 2×2 package (larger footprint, higher profile) | Higher voltage rating suits 12V input rails; not suitable for 5.5V-critical systems due to over-spec | Select when system requires >5.5V margin or needs higher avalanche energy handling |
| Toshiba TPH1R405PL | 5V V(BR)DSS, 1.4mΩ rDS(ON) at 4.5V, 2×2mm SOP-8 package (lead-based, larger thermal resistance) | Lower breakdown voltage limits use in 5.5V max systems; higher θJA (50°C/W) requires more PCB copper | Choose only if leaded assembly is required or if existing 2×2mm layout cannot accommodate WLCSP |
Compared with BSC014N04LS6 and TPH1R405PL, the KGF12N05-400-SP delivers superior power density and thermal performance in 5.5V systems due to its chip-scale footprint, 10°C/W θJP, and optimized FoM-making it uniquely suited for space- and thermally constrained portable and USB-C applications.
Availability
KGF12N05-400-SP is available at Aetrix Electronics and suitable for point-of-load DC/DC converters, OR'ing diode circuits, and portable electronics power management requiring stable component supply and consistent WLCSP package delivery.
Supply support for KGF12N05-400-SP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Intersil Corporation is a leader in precision analog and power management ICs, acquired by Renesas Electronics in 2017. Its products target high-reliability industrial, infrastructure, and mobile computing markets.
The KGF12N05-400-SP belongs to Intersil's Known Good FET (KGF) series, designed specifically for ultra-compact, high-efficiency power switching in battery-powered and thermally constrained systems.
FAQ
What is the maximum continuous drain current rating for the KGF12N05-400-SP?
The KGF12N05-400-SP is rated for 12A continuous drain current at TA = +25°C when mounted on 1 inch square 2oz copper FR-4. Derating applies above +70°C ambient, with 1.6W maximum power dissipation at +70°C. The device's 10°C/W junction-to-pad thermal resistance enables higher current handling when thermally coupled to large PCB copper areas.
Does the KGF12N05-400-SP support 3.3V gate drive?
Yes, the KGF12N05-400-SP has a gate threshold voltage range of 0.52–0.80V and delivers 2.1mΩ rDS(ON) at VGS = 3.5V, making it fully compatible with 3.3V logic-level gate drivers. Its low VGS(th) ensures strong enhancement mode operation even with marginal gate drive margins, critical for portable system reliability.
What is the significance of the "-400" in KGF12N05-400-SP?
The "-400" in KGF12N05-400-SP specifies the die thickness: 400µm ± 15µm. This dimension is critical for mechanical robustness during SMT reflow and influences thermal performance-thinner dies improve thermal transfer but require careful handling; 400µm balances manufacturability and junction-to-pad thermal resistance (θJP = 10°C/W).
Can the KGF12N05-400-SP be used in bidirectional current applications?
Yes, the KGF12N05-400-SP supports multidirectional current flow per its datasheet description and is commonly deployed in OR'ing diode and USB-C PD power path applications. Its symmetric WLCSP layout and low rDS(ON) in both directions enable efficient conduction regardless of current polarity, provided VGS is properly controlled.
Is the KGF12N05-400-SP RoHS compliant and lead-free?
Yes, the KGF12N05-400-SP is RoHS compliant and features lead-free NiAu bump plating. Its WLCSP package meets JEDEC J-STD-020 moisture sensitivity level (MSL) 1 and is qualified for Pb-free reflow profiles per Intersil TB493, supporting standard SMT assembly without special handling.
KGF12N05-400-SP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 6-SMD, No Lead
- Packaging:
- Bulk
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 5.5 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 3.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 2.4mOhm @ 12A, 4.5V
- Vgs(th) (Max) @ Id:
- 800mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 6 nC @ 3.5 V
- Vgs (Max):
- ±5.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 940 pF @ 5.5 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WLCSP (1.47x1.47)
KGF12N05-400-SP FAQ
1.How can I place an order for KGF12N05-400-SP through Aetrix?
Please submit a Request for Quotation (RFQ) for KGF12N05-400-SP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for KGF12N05-400-SP reliable?
The price and inventory of KGF12N05-400-SP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for KGF12N05-400-SP is usually 5 days.
3.What payment methods are accepted for KGF12N05-400-SP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for KGF12N05-400-SP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for KGF12N05-400-SP?
KGF12N05-400-SP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your KGF12N05-400-SP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for KGF12N05-400-SP?
For technical support, including KGF12N05-400-SP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your KGF12N05-400-SP requirements.
6.How does Aetrix verify that KGF12N05-400-SP is sourced from the original manufacturer or authorized distributors?
All KGF12N05-400-SP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that KGF12N05-400-SP meets industry standards.
7.What is the process for return or replacement of KGF12N05-400-SP?
All KGF12N05-400-SP units undergo pre-shipment inspection (PSI). If there is an issue with KGF12N05-400-SP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The KGF12N05-400-SP part is unused and in its original packaging.
Return procedure for KGF12N05-400-SP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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