Microchip Technology MCP87050T-U/MF
- Part No.:
- MCP87050T-U/MF
- Manufacturer:
- Microchip Technology
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
MCP87050T-U/MF.pdf
- Description:
- MOSFET N-CH 25V 100A 8PDFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,896
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Product details
Overview
MCP87050T-U/MF from Microchip Technology is an N-channel power MOSFET designed for high-efficiency synchronous buck converters in server and networking point-of-load (POL) applications. It features 4.2 mΩ RDS(ON) at VGS = 10 V, 12.5 nC total gate charge, and 1.1 Ω series gate resistance in an 8-lead PDFN 5 mm × 6 mm package.
For engineers reviewing the MCP87050T-U/MF datasheet, MCP87050T-U/MF pinout, MCP87050T-U/MF application, or MCP87050T-U/MF equivalent, key selection criteria include low conduction loss at 20 A, fast switching with 5 ns turn-on delay, short dead-time capability, and thermal performance validated to 150°C junction temperature.
Technical Context
The MCP87050T-U/MF uses advanced silicon processing to achieve a low figure of merit (RDS(ON) × QG) optimized for 12 V input POL converters. Its low QGD (4.7 nC) and fast tr/tf (18 ns/5 ns) support high-frequency operation up to 1 MHz while minimizing switching losses.
Designed for synchronous rectification, it integrates an intrinsic body diode with 0.8 V forward voltage and 16 ns reverse recovery time. The exposed drain thermal pad enables low RθJC (1.9 °C/W), supporting continuous 100 A drain current at TC = 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | +25 V - Supports 12 V nominal input rails with margin for transient spikes |
| RDS(ON) | 4.2 mΩ max @ VGS = 10 V, ID = 20 A - Enables <1 W conduction loss at 20 A |
| QG | 12.5 nC typ - Reduces gate drive power and enables efficient 1 MHz PWM control |
| QGD | 4.7 nC typ - Minimizes Miller-induced switching delay and shoot-through risk |
| td(on)/tf | 5 ns / 5 ns - Allows tight dead-time control in synchronous buck topologies |
| RθJC | 1.9 °C/W - Permits high-power dissipation with direct heatsinking via exposed drain pad |
| TJ Range | –55°C to +150°C - Qualified for extended-temperature industrial and automotive under-hood use |
Pinout & Package
The MCP87050T-U/MF is housed in an 8-lead Plastic Dual Flat, No-Lead (PDFN) package measuring 5 mm × 6 mm × 1.0 mm, with an exposed thermal pad connected to the drain terminals for enhanced thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source | Low-inductance source connection for high-side or low-side switch placement; tied to PCB ground plane |
| 4 | Gate | Control input requiring <13 nC charge; low RG (1.1 Ω) minimizes ringing and EMI |
| 5, 6, 7, 8 + Exposed Pad | Drain | High-current power path and primary thermal interface; pad must be soldered to large copper area for RθJC = 1.9 °C/W |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) × QG Figure of Merit | Enables >95% efficiency in 12 V → 1 V POL converters at 20 A, reducing both conduction and switching losses |
| Fast Turn-On/Turn-Off Timing | 5 ns td(on) and 5 ns tf allow dead times below 20 ns, critical for high-frequency synchronous buck stability |
| Low QGD/QG Ratio | 38% ratio (4.7/12.5 nC) suppresses Miller plateau effects and improves gate drive robustness |
| Enhanced Body Diode Performance | 16 ns trr and 20 nC QRR reduce reverse-recovery losses during synchronous rectification transitions |
| RoHS-Compliant PDFN Package | Lead-free 5×6 mm footprint with JEDEC-standard thermal pad layout simplifies PCB thermal design and reflow compatibility |
Applications
| Server Point-of-Load Converter | Networking ASIC Power Supply |
|---|---|
Use Scenario: Regulating 12 V intermediate bus down to 0.8–1.2 V for CPU/GPU cores in rack-mounted servers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase buck converter, switching at 500 kHz–1 MHz. Use Value: 4.2 mΩ RDS(ON) and 5 ns fall time minimize conduction loss and dead-time penalty, enabling >94% full-load efficiency. | Use Scenario: Powering 7 nm/5 nm FPGA and switch ASICs in 400G line cards with strict thermal envelope limits. IC Role / Device Role / Timing Role: High-current power stage MOSFET in compact, high-density POL modules with forced-air cooling. Use Value: 1.9 °C/W RθJC and 150°C TJ rating sustain 80 A continuous current without derating in 70°C ambient environments. |
| Automotive ADAS Domain Controller | Industrial PLC I/O Module |
Use Scenario: Providing 3.3 V/5 V auxiliary rails for radar processors and camera ISPs in AEC-Q101-qualified domain controllers. IC Role / Device Role / Timing Role: Primary switch in isolated flyback or non-isolated buck converter operating across –40°C to +125°C ambient. Use Value: –55°C to +150°C TJ range and 25 V BVDSS ensure reliable startup and operation during cold cranking and engine-off hot soak. | Use Scenario: Delivering 24 V → 5 V/3.3 V power to microcontroller, CAN transceiver, and analog front-end circuits in DIN-rail mounted PLCs. IC Role / Device Role / Timing Role: Main switch in ruggedized buck regulator with wide-input transient tolerance and long-term reliability requirements. Use Value: 162 mJ EAS avalanche energy rating supports unclamped inductive switching during fault events, improving system-level robustness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon BSC014N04LS6 | 4.2 mΩ RDS(ON) @ 10 V but higher QG (22 nC); same 5×6 mm PQFN package | Higher gate drive loss limits practical frequency to ≤600 kHz vs. MCP87050T-U/MF's 1 MHz capability | Select when board layout prioritizes package compatibility over switching efficiency at >800 kHz |
| Vishay SiR626DP | 4.8 mΩ RDS(ON) @ 10 V, lower QGD (3.8 nC), but only rated to 125°C TJ | Limited high-temperature operation reduces usable current in thermally constrained enclosures | Select for cost-sensitive industrial designs where 125°C max junction suffices and QGD is critical |
Compared with BSC014N04LS6 and SiR626DP, the MCP87050T-U/MF delivers superior high-frequency efficiency due to its 12.5 nC QG and 150°C TJ rating, making it optimal for space-constrained, thermally aggressive POL applications demanding >94% efficiency at 1 MHz.
Availability
MCP87050T-U/MF is available at Aetrix Electronics and suitable for server point-of-load converters, networking ASIC power supplies, and automotive ADAS domain controllers requiring stable component supply across extended temperature ranges and high-volume production cycles.
Supply support for MCP87050T-U/MF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a U.S.-based semiconductor company specializing in microcontrollers, analog devices, and power management ICs, with ISO/TS-16949 certified manufacturing facilities.
The MCP87050T-U/MF belongs to Microchip's high-performance power MOSFET product line, engineered specifically for high-efficiency, high-density DC-DC conversion in datacenter, telecom, and automotive electronics.
FAQ
What is the maximum continuous drain current rating for the MCP87050T-U/MF?
The MCP87050T-U/MF is rated for 100 A continuous drain current at TC = +25°C, as specified in its Absolute Maximum Ratings table. This rating assumes proper PCB thermal design with the exposed drain pad soldered to a minimum 1" × 1" 2 oz. copper area. Derating is required above 25°C case temperature per the SOA curve on page 5 of DS22308B.
Does the MCP87050T-U/MF support gate drive voltages below 4.5 V?
Yes, the MCP87050T-U/MF has a gate threshold voltage (VGS(TH)) of 1.0–1.6 V, enabling partial enhancement at low gate voltages. However, its RDS(ON) specification is guaranteed only at VGS = 4.5 V (6.0 mΩ max) and VGS = 10 V (5.0 mΩ max); operation below 4.5 V increases conduction loss significantly and is not recommended for high-current applications.
How does the thermal resistance RθJC of the MCP87050T-U/MF compare to RθJX?
The MCP87050T-U/MF has RθJC = 1.9 °C/W (junction-to-case, measured per JEDEC 51-14) and RθJX = 56 °C/W (junction-to-board, measured on a 4-layer FR4 PCB). RθJC reflects direct thermal transfer to a heatsink or cold plate, while RθJX models conduction through the PCB - the 29× difference highlights the critical importance of using the exposed drain pad for effective thermal management.
Is the MCP87050T-U/MF qualified for automotive applications?
The MCP87050T-U/MF is not AEC-Q101 qualified, though its –55°C to +150°C operating junction temperature range and 25 V BVDSS rating meet many automotive subsystem requirements. For production automotive use, Microchip recommends AEC-Q101-qualified alternatives such as the AEC-Q101-compliant variants in the same family; always verify qualification status via Microchip's official automotive product documentation before deployment.
What is the avalanche energy rating of the MCP87050T-U/MF and how is it tested?
The MCP87050T-U/MF has an unclamped inductive switching (UIS) avalanche energy rating of 50 mJ (typical) and 162 mJ (tested condition), measured per JEDEC standard with ID = 18 A, L = 1 mH, and RG = 25 Ω. This rating validates robustness against transient overvoltage events during switching, such as those caused by parasitic inductance in high-current PCB traces or load dumps.
MCP87050T-U/MF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 1.6V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 4.5 V
- Vgs (Max):
- +10V, -8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1040 pF @ 12.5 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-PDFN (5x6)
MCP87050T-U/MF FAQ
1.How can I place an order for MCP87050T-U/MF through Aetrix?
Please submit a Request for Quotation (RFQ) for MCP87050T-U/MF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCP87050T-U/MF reliable?
The price and inventory of MCP87050T-U/MF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCP87050T-U/MF is usually 5 days.
3.What payment methods are accepted for MCP87050T-U/MF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCP87050T-U/MF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCP87050T-U/MF?
MCP87050T-U/MF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCP87050T-U/MF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCP87050T-U/MF?
For technical support, including MCP87050T-U/MF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCP87050T-U/MF requirements.
6.How does Aetrix verify that MCP87050T-U/MF is sourced from the original manufacturer or authorized distributors?
All MCP87050T-U/MF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCP87050T-U/MF meets industry standards.
7.What is the process for return or replacement of MCP87050T-U/MF?
All MCP87050T-U/MF units undergo pre-shipment inspection (PSI). If there is an issue with MCP87050T-U/MF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCP87050T-U/MF part is unused and in its original packaging.
Return procedure for MCP87050T-U/MF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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