Diodes Incorporated MMBF170-7

Overview

MMBF170-7 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in SOT23 package, rated for 60 V V_DSS, 5.0 Ω R_DS(ON) @ 10 V V_GS, and 200 mA continuous drain current at +25°C. It delivers low gate threshold voltage (0.8–3.0 V), fast switching (t_D(on)/t_D(off) ≤ 10 ns), and low input capacitance (C_iss = 22–40 pF), enabling efficient power management in space-constrained motor control circuits.

For engineers reviewing the MMBF170-7 datasheet, MMBF170-7 pinout, MMBF170-7 application, or MMBF170-7 equivalent, key selection criteria include verified R_DS(ON) at 4.5 V (5.3 Ω), thermal resistance (R_θJA = 417 °C/W), JEDEC-qualified reliability, RoHS/Green compliance, and SOT23 terminal layout compatibility with high-density PCB designs.

Technical Context

This discrete MOSFET operates as a low-voltage, low-current switching element with enhancement-mode gate control. Its 0.8–3.0 V V_GS(th) enables direct drive from 3.3 V and 5 V logic, while its 22–40 pF C_iss and ≤10 ns turn-on/turn-off delays support clean digital switching up to several MHz in DC-DC and load-switching topologies.

The device uses silicon planar DMOS technology on FR-4 PCBs with specified 1.0 × 0.75 inch pad layout. Thermal performance is defined at T_A = +25°C with 300 mW P_D derating at 1.80 mW/°C above ambient, and junction temperature range spans −55°C to +150°C - suitable for industrial and automotive-qualified derivative (MMBF170Q) environments.

Key Specifications

Pinout & Package

Package: SOT23 - surface-mount, 3-terminal plastic package with 0.008 g mass, UL 94V-0 rating, and matte tin-plated Alloy 42 leadframe. Moisture sensitivity level is J-STD-020 Level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.

Compared with DMN2004LK-7 and 2N7002K-7, MMBF170-7 offers the best balance of JEDEC reliability, low gate threshold, and proven thermal stability in SOT23 - making it preferred for long-lifecycle industrial and medical applications where consistency matters more than peak current.

Availability

MMBF170-7 is available at Aetrix Electronics and suitable for motor control interfaces, power rail switching, LED bias control, and sensor interface protection requiring stable component supply across production lifecycles.

Supply support for MMBF170-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The MMBF170-7 belongs to Diodes' general-purpose MOSFET product line, engineered for high-efficiency, low-power switching in compact, thermally constrained applications such as portable instrumentation and battery-operated controls.

FAQ

What is the maximum continuous drain current for MMBF170-7 at +70°C ambient?

At T_A = +70°C, the maximum continuous drain current is derated from 200 mA to approximately 145 mA. This is calculated using the 300 mW P_D rating at +25°C and 1.80 mW/°C derating: P_D(70°C) = 300 − (70−25)×1.80 = 219 mW. With R_DS(ON) ≈ 5.3 Ω at 4.5 V, I_D = √(P_D/R_DS(ON)) ≈ √(0.219/5.3) ≈ 0.145 A.

Can MMBF170-7 be used in a high-side switch configuration?

No - MMBF170-7 is a single N-channel MOSFET with no integrated charge pump or bootstrap capability. High-side switching would require gate voltage exceeding the source potential, which this device cannot self-generate. It is designed exclusively for low-side switching where source connects to ground and gate is referenced to that node.

Does MMBF170-7 meet automotive AEC-Q200 requirements?

MMBF170-7 itself is qualified to JEDEC standards referenced in AEC-Q, but the automotive-qualified version is the separately documented MMBF170Q. The -7 suffix denotes standard commercial-grade packaging (SOT23, tape-and-reel), while MMBF170Q includes additional stress testing, lot traceability, and PPAP documentation required for automotive applications.

What is the recommended PCB pad layout for thermal performance?

Diodes specifies a 1.0 × 0.75 × 0.062 inch copper pad layout for optimal thermal dissipation. This layout achieves the published R_θJA = 417 °C/W. Deviations - especially reduced copper area or lack of thermal vias - will increase junction temperature and reduce safe operating current. Full dimensions and Gerber recommendations are available at diodes.com/package-outlines.html.