Nexperia USA Inc. NSF080120L4A0Q
- Part No.:
- NSF080120L4A0Q
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-247-4
- Datasheet:
-
NSF080120L4A0Q.pdf
- Description:
- NSF080120L4A0/SOT8071/TO247-4L
- Quantity:
- Payment:

- Shipping:

Inventory:446
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
NSF080120L4A0 from Nexperia is a 1200 V, 80 mΩ N-channel silicon carbide (SiC) MOSFET in a TO-247-4L package with Kelvin source terminal, designed for high-voltage, high-efficiency power conversion stages in industrial systems. It delivers 25 A continuous drain current at Tc = 100 °C, exhibits 80 mΩ RDS(on) at VGS = 15 V and Tj = 25 °C, and features fast switching (td(off) = 14 ns, Eoff = 41 µJ) and robust body diode recovery (trr = 6 ns). It is deployed in photovoltaic inverters where high blocking voltage and low conduction loss are critical.
For engineers reviewing the NSF080120L4A0 datasheet, NSF080120L4A0 pinout, NSF080120L4A0 application, or NSF080120L4A0 equivalent, key selection criteria include its 1200 V VDS, Kelvin-source–enabled gate drive stability, temperature-stable RDS(on), low QGD/QG ratio for hard-switching resilience, and verified 175 °C maximum junction temperature operation.
Technical Context
This SiC MOSFET uses a planar trench-gate structure optimized for high-voltage ruggedness and minimal dynamic losses. Its 4-pin TO-247-4L configuration separates the power source (Pin 2) from the Kelvin source (Pin 3), eliminating source inductance impact on gate control and enabling precise turn-off timing and reduced voltage overshoot during commutation.
The device integrates a fast, robust intrinsic body diode with 4.4 V forward drop at IS = 20 A and VGS = −5 V, supporting bidirectional energy transfer in totem-pole PFC and three-level NPC topologies. Its Rth(j-c) of 0.68 K/W enables high-power dissipation (183 W at Tc = 25 °C) with direct heatsink mounting via the metal base (Pin 1, drain-connected).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 1200 V - Enables use in 1000 V DC bus systems with 20 % safety margin for overvoltage transients. |
| RDS(on) | 80 mΩ @ VGS = 15 V, ID = 20 A, Tj = 25 °C - Low conduction loss supports >99 % efficiency in 10–50 kW inverters. |
| ID (cont.) | 25 A @ Tc = 100 °C - Sustains full-rated current under industrial ambient thermal conditions without derating. |
| Eoff | 41 µJ @ VDD = 800 V, ID = 20 A, RG(ext) = 2.2 Ω - Enables 100 kHz+ switching in motor drives without excessive thermal burden. |
| trr | 6 ns - Minimizes reverse recovery charge (Qr = 79 nC), reducing shoot-through risk and diode losses in bridge-leg operation. |
| Rth(j-c) | 0.68 K/W - Allows direct thermal coupling to heatsinks, simplifying thermal design for high-power density modules. |
| VGS(th) | 2.77 V typ. @ ID = 10 mA - Ensures reliable enhancement-mode turn-on while maintaining noise immunity above 1.7 V. |
Pinout & Package
NSF080120L4A0 is housed in a TO-247-4L (SOT8071-1) plastic through-hole package with isolated mounting base. The metal tab (Pin 1) is internally connected to the drain and serves as both electrical connection and thermal interface to heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (mb) | Drain / Mounting Base | Electrically tied to drain; provides low-inductance, low-thermal-resistance path to heatsink; must be insulated from PCB ground plane. |
| 2 (S) | Power Source | Carries full load current to source rail; connects to main PCB trace; subject to high di/dt and voltage drop. |
| 3 (KS) | Kelvin Source | Provides gate driver reference point only; carries negligible current; eliminates source inductance effect on gate loop stability. |
| 4 (G) | Gate | Controls channel conduction; requires low-inductance layout to KS pin; driven with −5 V/15 V for optimal switching performance. |
Key Features
| Feature | Design Value |
|---|---|
| Kelvin source terminal | Enables stable gate control under high di/dt by decoupling gate return path from power source current path. |
| Temperature-stable RDS(on) | RDS(on) increases only ~37 % from 25 °C to 175 °C (80 → 110 mΩ), ensuring predictable conduction loss across operating range. |
| Fast intrinsic body diode | 6 ns trr and 79 nC Qr allow zero-voltage switching (ZVS) in resonant converters and reduce dead-time sensitivity. |
| Low QGD/QG ratio | 16/52 nC = 0.31 - Improves Miller immunity and enables faster, more controllable turn-off in hard-switched topologies. |
| 175 °C max junction temperature | Supports operation in sealed enclosures or high-ambient environments without forced air cooling in many industrial applications. |
Applications
| Photovoltaic Inverters | E-Vehicle Charging Stations |
|---|---|
|
Use Scenario: DC–AC conversion stage in string or central solar inverters handling up to 1500 V DC input. IC Role / Device Role / Timing Role: High-side switch in three-level NPC or T-type inverter leg; operates at 16–25 kHz with ZVS-assisted transitions. Use Value: 1200 V rating accommodates 1500 V PV arrays; low RDS(on) reduces thermal stress on heatsinks; fast trr prevents cross-conduction during phase-leg commutation. |
Use Scenario: Primary-side switching in 11–22 kW AC–DC on-board chargers (OBC) and 150–350 kW DC fast-charging (DCFC) front-end rectifiers. IC Role / Device Role / Timing Role: Active switch in totem-pole PFC and dual-active-bridge (DAB) isolation stages; switched at 65–100 kHz. Use Value: Kelvin source ensures clean gate drive under high dv/dt; 41 µJ Eoff enables high-frequency operation without excessive loss; 175 °C Tj(max) supports compact packaging. |
| Motor Drives | Uninterruptible Power Supplies |
|
Use Scenario: Inverter output stage in industrial servo drives and HVAC compressors rated for 400–690 V AC line input. IC Role / Device Role / Timing Role: Low-side switch in 6-pack IGBT/SiC hybrid or full-SiC inverter modules; operated with 5–10 µs dead time. Use Value: 25 A continuous current at Tc = 100 °C sustains peak torque delivery; fast tr/tf (13/8 ns) minimizes switching transition losses; robust body diode handles regenerative braking current. |
Use Scenario: Bidirectional DC–AC inverter stage in double-conversion UPS systems delivering 10–40 kVA with <1 % THD. IC Role / Device Role / Timing Role: Full-bridge switch in high-frequency PWM inverter; modulated using space-vector modulation (SVM) at 10–20 kHz. Use Value: Low Coss (74 pF) and Crss (4 pF) reduce capacitive turn-on loss; stable VGS(th) ensures consistent channel activation across temperature; 1200 V rating covers 1000 V DC link with margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Wolfspeed C3M0065120K | Same 1200 V/65 mΩ rating but TO-247-3L; no Kelvin source; higher QGD (18 nC vs. 16 nC); Rth(j-c) = 0.75 K/W. | Lacks Kelvin source, limiting gate-loop stability in high-di/dt designs; less suitable for ultra-fast switching above 75 kHz. | Select when cost sensitivity outweighs need for enhanced gate control; verify gate driver loop inductance remains <3 nH. |
| ROHM SCT3080KL | 1200 V/80 mΩ in TO-247-4L; slightly higher RDS(on) at 175 °C (115 mΩ vs. 110 mΩ); lower Eoff (32 µJ) but higher QG(tot) (62 nC). | Better turn-off loss but slower effective switching due to higher total gate charge; requires stronger gate driver (≥3 A peak). | Prefer for applications prioritizing Eoff reduction over gate drive simplicity; confirm driver capability before substitution. |
Compared with C3M0065120K, NSF080120L4A0 offers superior gate control fidelity and thermal performance; versus SCT3080KL, it trades marginal Eoff increase for lower gate drive demand and tighter RDS(on) temperature coefficient-critical for thermally constrained industrial enclosures.
Availability
NSF080120L4A0 is available at Aetrix Electronics and suitable for photovoltaic inverters, e-vehicle charging infrastructure, and uninterruptible power supplies requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for NSF080120L4A0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade power semiconductors.
The NSF series targets high-efficiency, high-voltage power conversion in renewable energy and industrial automation, emphasizing rugged SiC MOSFETs with Kelvin-source packaging for next-generation switching performance.
FAQ
What gate drive voltage is recommended for NSF080120L4A0?
Nexperia specifies −5 V to 0 V for turn-off and +15 V for turn-on; operation below +13 V is not recommended due to increased RDS(on) and thermal instability. The Kelvin source (Pin 3) must be connected directly to the gate driver's source reference, not to the power source trace.
How does the Kelvin source improve switching behavior?
The Kelvin source separates the gate return path from high-current source routing, eliminating voltage drop-induced gate threshold shift during high di/dt events. This maintains precise VGS control, reduces turn-off delay variation, and suppresses parasitic oscillation in the gate loop-critical for stable 100 kHz+ operation.
Can NSF080120L4A0 replace silicon IGBTs in existing 1200 V designs?
Yes, with gate drive and layout modifications: the lower gate charge (52 nC vs. typical IGBT 200+ nC) allows faster switching, but requires reduced external gate resistance (≤2.2 Ω) and strict control of stray inductance. Thermal interface must accommodate higher power density due to lower Rth(j-c).
What is the maximum allowable case temperature for continuous operation?
The datasheet defines 100 °C as the maximum case temperature for 25 A continuous drain current. Derating begins linearly above this point, reaching zero current at 175 °C. At Tc = 25 °C, full 183 W power dissipation is supported, assuming proper heatsink mounting and thermal interface material.
NSF080120L4A0Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- TO-247-4
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- SiCFET (Silicon Carbide)
- Drain to Source Voltage (Vdss):
- 1200 V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 15V, 18V
- Rds On (Max) @ Id, Vgs:
- 120mOhm @ 20A, 15V
- Vgs(th) (Max) @ Id:
- 2.9V @ 2mA
- Gate Charge (Qg) (Max) @ Vgs:
- 52 nC @ 15 V
- Vgs (Max):
- +22V, -10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1335 pF @ 800 V
- FET Feature:
- -
- Power Dissipation (Max):
- 183W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247
NSF080120L4A0Q FAQ
1.How can I place an order for NSF080120L4A0Q through Aetrix?
Please submit a Request for Quotation (RFQ) for NSF080120L4A0Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NSF080120L4A0Q reliable?
The price and inventory of NSF080120L4A0Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NSF080120L4A0Q is usually 5 days.
3.What payment methods are accepted for NSF080120L4A0Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NSF080120L4A0Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for NSF080120L4A0Q?
NSF080120L4A0Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NSF080120L4A0Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NSF080120L4A0Q?
For technical support, including NSF080120L4A0Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NSF080120L4A0Q requirements.
6.How does Aetrix verify that NSF080120L4A0Q is sourced from the original manufacturer or authorized distributors?
All NSF080120L4A0Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NSF080120L4A0Q meets industry standards.
7.What is the process for return or replacement of NSF080120L4A0Q?
All NSF080120L4A0Q units undergo pre-shipment inspection (PSI). If there is an issue with NSF080120L4A0Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NSF080120L4A0Q part is unused and in its original packaging.
Return procedure for NSF080120L4A0Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
NSF080120L4A0Q Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

