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NXP Semiconductors NX3008NBKMB315
- Part No.:
- NX3008NBKMB315
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-101, SOT-883
- Datasheet:
-
NX3008NBKMB315.pdf
- Description:
- NOW NEXPERIA NX3008NBKMB SMALL S
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
NX3008NBKMB from Nexperia is a single N-channel enhancement-mode Trench MOSFET in a DFN1006B-3 (SOT883B) package, rated for 30 V drain-source voltage, 530 mA continuous drain current at 4.5 V gate drive, and 1.0 Ω typical RDS(on) at 350 mA/25 °C - optimized for low-side load switching in space-constrained portable electronics.
For engineers reviewing the NX3008NBKMB datasheet, NX3008NBKMB pinout, NX3008NBKMB application, or NX3008NBKMB equivalent, key selection criteria include its ultra-thin 0.37 mm profile, 2 kV HBM ESD rating, fast switching (15 ns turn-on delay), low 0.9 V typical gate threshold, and thermal resistance of 305 K/W junction-to-ambient on FR4 PCB.
Technical Context
This MOSFET employs Trench MOSFET technology to achieve low RDS(on) and fast switching with minimal gate charge (0.68 nC total). Its low 0.9 V typical VGS(th) enables direct interface with 1.8 V and 2.5 V logic systems without level shifting.
The device features an integrated source-drain diode with 0.85 V typical forward voltage at 350 mA and operates across –55 °C to 150 °C junction temperature range. Thermal performance is defined by Rth(j-a) = 305 K/W (FR4, standard footprint) and Rth(j-sp) = 40 K/W to solder point.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - maximum blocking voltage for low-voltage DC power path switching |
| RDS(on) | 1.0 Ω typ @ VGS = 4.5 V, ID = 350 mA - enables <100 mW conduction loss at 350 mA |
| VGS(th) | 0.9 V typ - supports direct drive from 1.8 V GPIOs without external level shifter |
| QG(tot) | 0.68 nC - low gate charge minimizes driver power and speeds switching transitions |
| Tj Range | –55 °C to 150 °C - suitable for extended industrial and portable operating environments |
| ESD Rating | 2 kV HBM - provides robust handling during board assembly and end-user operation |
| Ptot | 360 mW @ Tamb = 25 °C - defines safe continuous power dissipation on standard FR4 |
Pinout & Package
Package: DFN1006B-3 (SOT883B), leadless ultra-small plastic package; 1.0 mm × 0.6 mm × 0.37 mm body; 0.35 mm pitch; three solder lands.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | G (Gate) | Control terminal; accepts logic-level voltage to modulate channel conduction |
| 2 | S (Source) | Reference node for gate drive and current return path; tied to system ground in low-side configuration |
| 3 | D (Drain) | Power output terminal; connects to load; thermally enhanced via exposed pad (not electrically isolated) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-thin profile | 0.37 mm height - enables use in ultra-slim consumer wearables and hearing aids |
| Low VGS(th) | 0.9 V typical - ensures reliable turn-on with 1.8 V microcontroller outputs |
| Fast switching | 15 ns turn-on delay + 11 ns rise time - reduces switching losses in high-frequency PWM loads |
| Trench MOSFET architecture | Enables 1.0 Ω RDS(on) in 1.0 × 0.6 mm footprint - maximizes power density per unit area |
| ESD protection | 2 kV HBM - eliminates need for external ESD clamps in handheld interfaces |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
Use Scenario: Replacing electromechanical relays in battery-powered IoT sensor nodes requiring silent, bounce-free switching. IC Role / Device Role: Low-side switch controlling coil current path to activate solid-state relay emulation. Use Value: Eliminates mechanical wear and acoustic noise while reducing PCB area by >70% versus SOIC-8 relay drivers. | Use Scenario: Driving short, capacitive PCB traces (<10 cm) between FPGA I/O banks and peripheral ICs in portable medical monitors. IC Role / Device Role: Active pull-down element in open-drain bus interface with controlled edge rate. Use Value: Achieves <30 ns signal transition with <1.4 Ω on-resistance, minimizing timing skew and reflections. |
| Low-Side Load Switch | Switching Circuits |
Use Scenario: Power gating individual subsystems (e.g., BLE radio, display backlight) in smart earbuds to extend battery life. IC Role / Device Role: Controlled series switch between battery rail and load, managed by PMIC or MCU GPIO. Use Value: Delivers <100 mW conduction loss at 500 mA and supports rapid enable/disable cycles without thermal derating. | Use Scenario: Building compact DC-DC converter synchronous rectifiers or LED flash current control in compact camera modules. IC Role / Device Role: Main switching element in non-isolated buck topology or constant-current sink stage. Use Value: Supports 2.1 A peak drain current pulses and maintains stable RDS(on) up to 150 °C junction temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H400SFD-13 | Higher VDS (40 V), larger SOT-723 package (1.2 × 0.8 mm), 0.85 Ω RDS(on) @ 4.5 V | Better suited for 24 V industrial sensors; less space-efficient for sub-10 mm² designs | Select when higher voltage margin or slightly lower RDS(on) outweighs size penalty. |
| PMZB390UNE | Same DFN1006B-3 package, 20 V rating, 0.7 Ω RDS(on), 0.6 V VGS(th) | Optimized for 1.2–1.8 V logic; unsuitable for 30 V bus applications due to lower breakdown | Prefer for ultra-low-voltage systems where 20 V headroom suffices and sub-1 V threshold is critical. |
Compared with DMN10H400SFD-13 and PMZB390UNE, the NX3008NBKMB uniquely balances 30 V capability, 1.0 Ω RDS(on), and 0.37 mm height in the smallest standardized footprint - making it optimal for space- and voltage-constrained portable power switches.
Availability
NX3008NBKMB is available at Aetrix Electronics and suitable for portable medical devices, wireless earbuds, and IoT sensor nodes requiring stable component supply and long-term manufacturability.
Supply support for NX3008NBKMB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-grade qualification.
The NX3008NBKMB belongs to Nexperia's TrenchMOS family designed specifically for ultra-compact, low-voltage power switching in battery-powered consumer electronics - prioritizing thinness, logic-level drivability, and robust ESD tolerance.
FAQ
What is the maximum continuous drain current for NX3008NBKMB at 100 °C ambient temperature?
The NX3008NBKMB supports 330 mA continuous drain current at Tamb = 100 °C with VGS = 4.5 V, as specified in Table 5 (Limiting values). This reflects thermal derating due to reduced heat dissipation at elevated ambient temperatures on standard FR4 PCBs.
Does NX3008NBKMB have an integrated ESD protection diode, and what is its rating?
Yes, the NX3008NBKMB includes on-chip ESD protection rated at 2000 V HBM (Human Body Model), measured between all pins per IEC 61000-4-2. This eliminates the need for external TVS components in most handheld and wearable applications.
Can NX3008NBKMB be driven directly by a 1.8 V microcontroller GPIO?
Yes, NX3008NBKMB has a typical gate threshold voltage of 0.9 V and guaranteed turn-on at VGS ≥ 1.25 V (Fig. 11), enabling reliable switching with 1.8 V logic. Its low 0.68 nC total gate charge further reduces required drive strength.
What is the thermal resistance from junction to solder point (Rth(j-sp)) for NX3008NBKMB?
The NX3008NBKMB has a typical Rth(j-sp) of 40 K/W, defined with the device mounted on an FR4 PCB with single-sided copper, tin-plated, and a 1 cm² mounting pad for the drain. This value supports accurate thermal modeling for solder-joint reliability assessment.
Is NX3008NBKMB suitable for automotive applications?
No, NX3008NBKMB is not automotive-qualified. The datasheet explicitly states it is a non-automotive qualified product, lacking AEC-Q101 stress testing and automotive-specific reliability validation. It is intended for industrial and consumer applications only.
NX3008NBKMB315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SC-101, SOT-883
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 530mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 1.4Ohm @ 350mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.68 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 50 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 360mW (Ta), 2.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006B-3
NX3008NBKMB315 FAQ
1.How can I place an order for NX3008NBKMB315 through Aetrix?
Please submit a Request for Quotation (RFQ) for NX3008NBKMB315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for NX3008NBKMB315 reliable?
The price and inventory of NX3008NBKMB315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3008NBKMB315 is usually 5 days.
3.What payment methods are accepted for NX3008NBKMB315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3008NBKMB315 transactions.
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4.How is shipping managed for NX3008NBKMB315?
NX3008NBKMB315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your NX3008NBKMB315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for NX3008NBKMB315?
For technical support, including NX3008NBKMB315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3008NBKMB315 requirements.
6.How does Aetrix verify that NX3008NBKMB315 is sourced from the original manufacturer or authorized distributors?
All NX3008NBKMB315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3008NBKMB315 meets industry standards.
7.What is the process for return or replacement of NX3008NBKMB315?
All NX3008NBKMB315 units undergo pre-shipment inspection (PSI). If there is an issue with NX3008NBKMB315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The NX3008NBKMB315 part is unused and in its original packaging.
Return procedure for NX3008NBKMB315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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