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Nexperia USA Inc. NX3008PBKMB,315

Part No.:
NX3008PBKMB,315
Manufacturer:
Nexperia USA Inc.
Category:
FETs, MOSFETs
Package:
3-XFDFN
Datasheet:
AetrixNX3008PBKMB,315.pdf
Description:
MOSFET P-CH 30V 300MA DFN1006B-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,899

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Product details

Overview

NX3008PBKMB,315 from Nexperia is a P-channel enhancement-mode Trench MOSFET in a DFN1006B-3 (SOT883B) package, designed for high-side load switching and relay driving. It features a -30 V drain-source voltage rating, 2.8 Ω typical RDS(on) at VGS = -4.5 V and ID = -200 mA, -0.9 V typical gate threshold voltage, 0.37 mm profile height, and 2 kV HBM ESD protection.

For engineers reviewing the NX3008PBKMB,315 datasheet, NX3008PBKMB,315 pinout, NX3008PBKMB,315 application, or NX3008PBKMB,315 equivalent, this device serves as a compact, low-threshold, fast-switching P-channel switch for space-constrained DC power control circuits requiring minimal gate drive and robust transient immunity.

Technical Context

This MOSFET employs Trench MOSFET technology to achieve low on-resistance and fast switching with minimal gate charge (0.55 nC typical total gate charge). Its ultra-thin 0.37 mm DFN1006B-3 package enables integration into high-density portable and wearable electronics where thermal and spatial constraints are critical.

The device operates with a low gate threshold of -0.9 V (typ), enabling direct interface with 1.8 V and 2.5 V logic outputs, and supports continuous drain currents up to -300 mA at 25 °C ambient. Its source-drain diode exhibits a forward voltage of -0.88 V at -200 mA, supporting bidirectional current handling in load-switch configurations.

Key Specifications

Parameter Value and Actual Design Meaning
VDS -30 V maximum - supports 24 V rail switching with 20 % safety margin
RDS(on) 2.8 Ω typ @ VGS = -4.5 V, ID = -200 mA - limits conduction loss to ≤112 mW at rated current
VGS(th) -0.9 V typ - ensures reliable turn-on with 1.8 V/2.5 V GPIO without level shifting
QG(tot) 0.55 nC typ - enables <40 ns turn-on delay and <130 ns turn-off delay with 6 Ω gate resistor
ESD Rating 2 kV HBM - provides robust handling during PCB assembly and field operation
Package Height 0.37 mm - fits under 0.4 mm Z-height connectors and stacked flex assemblies
Ptot 360 mW @ Tamb = 25 °C - defines thermal derating curve for FR4 PCBs with standard footprint

Pinout & Package

DFN1006B-3 (SOT883B) is a 3-terminal, leadless, ultra-small surface-mount plastic package measuring 1.0 × 0.6 × 0.37 mm, with exposed drain pad for thermal conduction and solderable side terminals.

Pin/Terminal Circuit Role Design Meaning
1 G (Gate) Control input; requires ≤0.55 nC charge for full enhancement; referenced to source
2 S (Source) Return path for load current; tied to system ground or positive rail in high-side configuration
3 D (Drain) Power output terminal; thermally connected to PCB copper pad for heat dissipation

Key Features

Feature Design Value
Ultra-low profile 0.37 mm height enables use in wearables and ultra-thin IoT modules
Trench MOSFET architecture Delivers 2.8 Ω RDS(on) in 1.0 × 0.6 mm footprint - 3× lower resistance than planar equivalents at same size
Low VGS(th) -0.9 V typ allows direct drive from 1.8 V microcontrollers without external level shifters
Fast switching 30 ns rise time and 38 ns fall time support >5 MHz PWM in load-switch applications
Integrated ESD protection 2 kV HBM rating eliminates need for external TVS in most board-level ESD environments

Applications

Relay Driver High-Speed Line Driver

Use Scenario: Driving coil of miniature signal relays in industrial PLC I/O modules.

IC Role / Device Role / Timing Role: High-side switch controlling relay coil current with fast turn-off to suppress back-EMF-induced arcing.

Use Value: 38 ns fall time minimizes contact bounce; -30 V rating accommodates 24 V relay coils with margin.

Use Scenario: Transmitting TTL/CMOS logic signals across short PCB traces or flexible cables in test equipment.

IC Role / Device Role / Timing Role: Active pull-up switch enabling bidirectional line control with low capacitive loading.

Use Value: 31 pF Ciss and 2.8 Ω RDS(on) preserve signal edge integrity up to 10 MHz.

High-Side Load Switch Switching Circuits

Use Scenario: Power gating of sensors or RF modules in battery-powered IoT nodes.

IC Role / Device Role / Timing Role: P-channel high-side switch enabling zero-quiescent-current shutdown via gate control.

Use Value: -1 µA IDSS at 25 °C ensures <1 µA leakage in off-state, extending battery life.

Use Scenario: Discrete switching element in DC-DC converter synchronous rectifier or LED current control.

IC Role / Device Role / Timing Role: Low-loss power switch operating in linear or saturated mode depending on gate bias.

Use Value: 5.3 Ω RDS(on) at 150 °C ensures stable performance across automotive-grade temperature range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2020LFG-7 20 V VDS, 1.8 Ω RDS(on), same DFN1006B-3 package Limited to ≤20 V systems; better RDS(on) but lower voltage margin Select when 20 V rail and lowest possible conduction loss are prioritized over voltage headroom
PMZB390UNEY 30 V VDS, 4.5 Ω RDS(on), same package, -1.2 V VGS(th) Higher threshold requires ≥3.3 V logic; higher RDS(on) increases conduction loss by ~60 % Select when cost sensitivity outweighs performance, and 3.3 V+ gate drive is available

Compared with DMN2020LFG-7 and PMZB390UNEY, NX3008PBKMB,315 uniquely balances -30 V capability, -0.9 V threshold, and 2.8 Ω RDS(on) in the DFN1006B-3 footprint-making it optimal for 1.8–2.5 V logic-driven, 24 V-compatible high-side switches where space and thermal density are constrained.

Availability

NX3008PBKMB,315 is available at Aetrix Electronics and suitable for relay driver circuits, high-speed line drivers, high-side loadswitches, and discrete switching circuits requiring stable component supply across industrial automation, portable instrumentation, and battery-powered embedded systems.

Supply support for NX3008PBKMB,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions for consumer, industrial, and automotive markets.

This part belongs to Nexperia's TrenchMOS portfolio, engineered specifically for space-constrained, low-voltage switching applications demanding fast response, low gate drive, and robust ESD tolerance in ultra-miniature packages.

FAQ

What is the maximum continuous drain current for NX3008PBKMB,315 at 100 °C ambient?

The maximum continuous drain current is -185 mA at Tamb = 100 °C with VGS = -4.5 V, as specified in the Limiting Values table. This reflects thermal derating due to reduced power dissipation capability at elevated ambient temperatures on standard FR4 PCBs.

Can NX3008PBKMB,315 be used in high-side switch configurations with 3.3 V microcontroller GPIO?

Yes - its -0.9 V typical VGS(th) and -1.1 V maximum ensure full enhancement with 3.3 V logic (VGS = -3.3 V), delivering ≤4.1 Ω RDS(on). No level shifter is required, simplifying circuit design and reducing BOM count.

Is the DFN1006B-3 package thermally enhanced for PCB mounting?

Yes - the DFN1006B-3 package features an exposed drain pad that must be soldered to a ≥1 cm² copper area on the PCB to achieve the specified Rth(j-a) of 150 K/W. Without this thermal pad, junction-to-ambient resistance degrades to 305 K/W, limiting usable power.

Does NX3008PBKMB,315 include body diode functionality, and what is its forward voltage?

Yes - it integrates a source-drain body diode with VSD = -0.88 V typical at IS = -200 mA and Tj = 25 °C. This enables freewheeling in inductive loads and reverse-current blocking in high-side configurations without external diodes.

NX3008PBKMB,315 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
300mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Rds On (Max) @ Id, Vgs:
4.1Ohm @ 200mA, 4.5V
Vgs(th) (Max) @ Id:
1.1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.72 nC @ 4.5 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
46 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
360mW (Ta), 2.7W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN1006B-3

NX3008PBKMB,315 FAQ

1.How can I place an order for NX3008PBKMB,315 through Aetrix?

Please submit a Request for Quotation (RFQ) for NX3008PBKMB,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX3008PBKMB,315 reliable?

The price and inventory of NX3008PBKMB,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX3008PBKMB,315 is usually 5 days.

3.What payment methods are accepted for NX3008PBKMB,315?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX3008PBKMB,315 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NX3008PBKMB,315?

NX3008PBKMB,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NX3008PBKMB,315 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NX3008PBKMB,315?

For technical support, including NX3008PBKMB,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX3008PBKMB,315 requirements.

6.How does Aetrix verify that NX3008PBKMB,315 is sourced from the original manufacturer or authorized distributors?

All NX3008PBKMB,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX3008PBKMB,315 meets industry standards.

7.What is the process for return or replacement of NX3008PBKMB,315?

All NX3008PBKMB,315 units undergo pre-shipment inspection (PSI). If there is an issue with NX3008PBKMB,315, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX3008PBKMB,315 part is unused and in its original packaging.

Return procedure for NX3008PBKMB,315:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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