Nexperia USA Inc. NX7002BKVL

Overview

NX7002BK from Nexperia is a 60 V, N-channel enhancement-mode Trench MOSFET in SOT23 (TO-236AB) package, designed for low-side switching with logic-level gate drive compatibility, 2.2 Ω R_DS(on) at V_GS = 10 V and I_D = 200 mA, 270 mA continuous drain current at T_amb = 25 °C, and ESD protection > 2 kV HBM - used in relay drivers and high-speed line drivers.

For engineers reviewing the NX7002BK datasheet, NX7002BK pinout, NX7002BK application, or NX7002BK equivalent, this page delivers verified electrical parameters, thermal derating curves, gate charge timing data, and real-world switching use cases - all validated against Nexperia's official 2015 product data sheet.

Technical Context

This MOSFET employs Trench technology to achieve low on-resistance and fast switching performance, with turn-on delay of 4.7 ns and fall time of 2.9 ns under defined test conditions (V_DS = 50 V, I_D = 200 mA, R_G(ext) = 6 Ω). Its gate threshold voltage ranges from 1.1 V to 2.1 V at T_j = 25 °C, enabling reliable logic-level operation with 3.3 V or 5 V microcontroller outputs.

The device integrates an intrinsic source-drain diode with V_SD = 0.87–1.2 V at I_S = 200 mA and exhibits dynamic capacitances of C_iss = 23.6 pF, C_oss = 4.6 pF, and C_rss = 3 pF at V_DS = 10 V - supporting high-frequency switching up to several MHz in compact PCB layouts.

Key Specifications

Pinout & Package

Package: TO-236AB (SOT23), surface-mount plastic package with 3 leads, 1.4 mm × 2.9 mm footprint, 1.1 mm height, and drain-connected tab for thermal relief.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-side switching applications.

Compared with DMN2004K and BS170, the NX7002BK offers superior combination of low R_DS(on), fast switching, logic-level compatibility, and robust ESD protection in a standard SMT package - making it optimal for space-constrained, high-reliability digital switching applications.

Availability

NX7002BK is available at Aetrix Electronics and suitable for relay drivers, high-speed line drivers, low-side load switches, and switching circuits requiring stable component supply and consistent parametric performance across production batches.

Supply support for NX7002BK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade and industrial MOSFETs, ESD protection, and logic ICs.

The NX7002BK belongs to Nexperia's TrenchMOS family - engineered specifically for logic-driven, low-power switching in space-constrained consumer, computing, and industrial applications where efficiency, speed, and manufacturability are critical.

FAQ

What is the maximum continuous drain current for NX7002BK at 100 °C ambient temperature?

The NX7002BK supports 170 mA continuous drain current at T_amb = 100 °C, as specified in Table 5 (Limiting values) of the 2015 datasheet. This derating reflects thermal constraints of the SOT23 package on FR4 PCB with single-sided copper, and aligns with the normalized current curve in Figure 2.

Does NX7002BK require a gate resistor for stable switching?

A gate resistor is recommended to control dV/dt and prevent oscillation, especially when driving capacitive loads. The datasheet specifies timing parameters with R_G(ext) = 6 Ω; using 10–47 Ω provides optimal trade-off between switching speed and ringing suppression in most 3.3 V/5 V logic-driven applications.

Can NX7002BK be used in linear (analog) amplification mode?

No - the NX7002BK is characterized and qualified only for switching operation. Its Safe Operating Area (Figure 3) shows limited DC capability at low V_DS, and its transfer characteristics (Figure 10) lack guaranteed linearity or gain stability required for analog amplification. It is not rated for linear-mode power dissipation.

Is the drain pad in the SOT23 package electrically isolated from other pins?

No - the drain (Pin 3) is directly connected to the internal die's drain metallization and the exposed copper area on the bottom of the SOT23 package. This thermal pad must be soldered to a PCB copper pour for thermal performance but remains at drain potential and must be routed accordingly in high-voltage isolation schemes.