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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FET, MOSFET Arrays

Nexperia USA Inc. NX7002BKXBZ

Name: NX7002BKXBZ
Brand: Nexperia USA Inc.
SKU: NX7002BKXBZ
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: NX7002BKXBZ

Manufacturer:: Nexperia USA Inc.

Category:: FET, MOSFET Arrays

Package:: 6-XFDFN Exposed Pad

Datasheet:: NX7002BKXBZ.pdf

Description:: MOSFET 2N-CH 60V 0.26A 6DFN

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Product details

Overview

NX7002BKXB from Nexperia is a dual N-channel enhancement-mode Trench MOSFET in a DFN1010B-6 (SOT1216) package, rated for 60 V V_DS, 2.2 Ω R_DS(on) at V_GS = 10 V and I_D = 200 mA, with logic-level gate drive compatibility and >2 kV HBM ESD protection. It serves as a compact low-side loadswitch or high-speed line driver in space-constrained portable and interface circuits.

For engineers reviewing the NX7002BKXB datasheet, NX7002BKXB pinout, NX7002BKXB application, or NX7002BKXB equivalent, this device supports dual independent switching paths in ultra-small footprint designs requiring thermal efficiency, fast switching (t_d(on) = 4.7 ns), and stable on-resistance over temperature (R_DS(on) = 4.5 Ω max at T_j = 150 °C).

Technical Context

This dual MOSFET integrates two identical N-channel Trench devices sharing no internal connection - each transistor operates independently with separate gate, source, and drain terminals. The structure enables synchronous or isolated low-side switching without cross-talk, supporting discrete gate control per channel.

Thermal performance is optimized via the DFN1010B-6 package's exposed drain pad, delivering R_th(j-sp) = 27–31 K/W and enabling 4032 mW total power dissipation at solder point (T_sp = 25 °C). Dynamic characteristics include Q_G(tot) = 1 nC and C_iss = 23.6 pF, confirming suitability for high-frequency (<1 MHz) digital switching.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum drain-source blocking voltage; supports 24 V and 48 V bus applications with margin.
R_DS(on)	2.2 Ω (typ) at V_GS = 10 V, I_D = 200 mA, T_j = 25 °C - Enables <100 mW conduction loss at 200 mA, critical for battery-powered loadswitching.
V_GS(th)	1.1–2.1 V - Logic-level compatible; fully enhanced with 3.3 V or 5 V microcontroller GPIOs without level shifting.
t_d(on)/t_f	4.7 ns / 2.9 ns - Fast switching reduces transition losses in PWM-driven loads up to ~10 MHz.
ESD Rating	>2 kV HBM - Robust handling during PCB assembly and end-user integration without additional protection circuitry.
P_tot	4032 mW at T_sp = 25 °C - High thermal capability for its 1.1 × 1.0 mm footprint due to thermal-enhanced DFN package.
C_iss	23.6 pF - Low input capacitance minimizes gate drive current demand and improves rise/fall time consistency.

Pinout & Package

Package: DFN1010B-6 (SOT1216), 1.1 × 1.0 × 0.37 mm, leadless, thermally enhanced plastic SMD package with exposed drain pads.

Pin/Terminal	Circuit Role	Design Meaning
1	S1	Source terminal of transistor TR1 - connects to ground reference for first switch path.
2	G1	Gate terminal of transistor TR1 - accepts logic-level control signal for independent switching of TR1.
3	D2	Drain terminal of transistor TR2 - connects to load or supply rail for second switch path.
4	S2	Source terminal of transistor TR2 - isolated ground node for second switch; not internally tied to S1.
5	G2	Gate terminal of transistor TR2 - enables fully independent control of TR2, decoupled from TR1.
6	D1	Drain terminal of transistor TR1 - primary output node for first switch; shares thermal pad with D2.

Key Features

Feature	Design Value
Logic-level gate drive	V_GS(th) ≤ 2.1 V ensures full enhancement with standard 3.3 V/5 V MCU outputs, eliminating external level shifters.
Dual independent channels	No internal connection between TR1 and TR2 - supports isolated load control, redundancy, or differential signaling paths.
Ultra-small DFN1010B-6	1.1 × 1.0 mm footprint saves >60% board area vs. comparable SO-8 dual MOSFETs, ideal for wearables and IoT edge nodes.
Thermally enhanced construction	Exposed drain pads on pins 3 and 6 reduce R_th(j-sp) to 27–31 K/W, enabling higher continuous current in confined layouts.
ESD-hardened design	>2 kV HBM rating allows direct handling and placement without special ESD precautions during SMT assembly.

Applications

Relay Driver

High-Speed Line Driver

Use Scenario: Replacing electromechanical relays in PLC I/O modules and industrial sensor interfaces where mechanical wear and bounce are unacceptable.

IC Role / Device Role: Dual low-side switch controlling two independent relay coils or solid-state output stages.

Use Value: Eliminates coil flyback energy management complexity by integrating body diodes; 60 V rating handles 24 V DC coil transients without external clamping.

Use Scenario: Driving terminated RS-485 or CAN FD stub lines in automotive domain controllers with tight timing budgets.

IC Role / Device Role: Active pull-down element in push-pull or open-drain line driver configurations.

Use Value: 2.9 ns fall time and 23.6 pF C_iss enable clean 10+ Mbps edge transitions while minimizing capacitive loading on shared buses.

Low-Side Loadswitch

Switching Power Supply Sync Rectifier

Use Scenario: Enabling/disabling power to USB peripherals, sensors, or display backlights in portable medical devices.

IC Role / Device Role: Dual-channel controlled power gate with independent enable inputs for selective subsystem power management.

Use Value: 2.2 Ω R_DS(on) limits voltage drop to <500 mV at 200 mA, preserving battery runtime and meeting USB 2.0 voltage tolerance.

Use Scenario: Secondary-side synchronous rectification in isolated 5–12 V DC-DC converters for telecom power modules.

IC Role / Device Role: Paired N-channel switches replacing Schottky diodes in center-tapped or active-clamp forward topologies.

Use Value: Dual configuration allows interleaved operation or redundancy; 60 V V_DS withstands reflected voltage spikes during transformer reset.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN2004LSD-13	Single-channel, 20 V V_DS, 32 mΩ R_DS(on), SO-8 package	Lower voltage rating and larger footprint limit use to 5 V logic rails and non-space-constrained boards.	Select only when higher current (>500 mA) per channel is required and board area is not constrained.
PMGD290UN,115	Dual N-channel, 20 V V_DS, 37 mΩ R_DS(on), DFN1010-6 package	Half the voltage rating and 17× higher R_DS(on) restricts use to 3.3 V systems with sub-100 mA loads.	Prefer for ultra-low-voltage IoT sensor nodes where 60 V margin is unnecessary and cost is prioritized.

Compared with NX7002BKXB, DMN2004LSD-13 offers higher current but lacks dual-channel integration and miniaturization; PMGD290UN provides dual topology in same footprint but sacrifices voltage headroom and on-resistance performance - making NX7002BKXB optimal for 24–48 V, space-limited, medium-current switching.

Availability

NX7002BKXB is available at Aetrix Electronics and suitable for relay drivers, high-speed line drivers, low-side loadswitches, and switching power supply sync rectifiers requiring stable component supply across production lifecycles.

Supply support for NX7002BKXB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic components, spun off from Philips in 2017 and headquartered in Nijmegen, Netherlands.

This device belongs to Nexperia's TrenchMOS dual-FET product line, engineered specifically for miniaturized power management in portable, industrial, and automotive-qualified (non-automotive grade) applications demanding logic compatibility and thermal efficiency.

FAQ

What is the maximum continuous drain current per channel at 100 °C ambient?

At T_amb = 100 °C, the maximum continuous drain current per channel is 170 mA, as specified in Table 5 (Limiting Values). This derating accounts for thermal resistance and junction temperature limits (T_j ≤ 150 °C), assuming FR4 PCB mounting with 1 cm² drain pad.

Can the two channels be paralleled to increase current capacity?

No - the channels are electrically isolated with no internal connection, but they share thermal coupling through the common DFN package. Paralleling requires matched V_GS(th) and R_DS(on) tracking, which is not characterized or guaranteed. Use a single-channel higher-current device instead.

Is the body diode suitable for reverse polarity protection?

Yes - each channel includes an integrated source-drain diode with V_SD = 0.87–1.2 V at I_S = 200 mA. It can serve as reverse polarity protection in low-power applications, though dedicated protection ICs offer lower forward voltage and tighter control.

Does the DFN1010B-6 package require special PCB layout considerations?

Yes - the exposed drain pads (pins 3 and 6) must be connected to large copper areas (≥1 cm²) on the PCB for thermal performance. Figure 20 specifies the recommended reflow footprint: 0.35 mm solder land width, 0.25 mm solder resist opening, and precise alignment to avoid solder bridging in the 0.4 mm pitch layout.

NX7002BKXBZ Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: 6-XFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: MOSFET (Metal Oxide)

Configuration:: 2 N-Channel (Dual)

FET Feature:: Logic Level Gate

Drain to Source Voltage (Vdss):: 60V

Current - Continuous Drain (Id) @ 25°C:: 260mA

Rds On (Max) @ Id, Vgs:: 2.8Ohm @ 200mA, 10V

Vgs(th) (Max) @ Id:: 2.1V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 1nC @ 10V

Input Capacitance (Ciss) (Max) @ Vds:: 23.6pF @ 10V

Power - Max:: 285mW

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DFN1010B-6

NX7002BKXBZ FAQ

1.How can I place an order for NX7002BKXBZ through Aetrix?

Please submit a Request for Quotation (RFQ) for NX7002BKXBZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for NX7002BKXBZ reliable?

The price and inventory of NX7002BKXBZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for NX7002BKXBZ is usually 5 days.

3.What payment methods are accepted for NX7002BKXBZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for NX7002BKXBZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for NX7002BKXBZ?

NX7002BKXBZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your NX7002BKXBZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for NX7002BKXBZ?

For technical support, including NX7002BKXBZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your NX7002BKXBZ requirements.

6.How does Aetrix verify that NX7002BKXBZ is sourced from the original manufacturer or authorized distributors?

All NX7002BKXBZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that NX7002BKXBZ meets industry standards.

7.What is the process for return or replacement of NX7002BKXBZ?

All NX7002BKXBZ units undergo pre-shipment inspection (PSI). If there is an issue with NX7002BKXBZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The NX7002BKXBZ part is unused and in its original packaging.

Return procedure for NX7002BKXBZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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