NXP Semiconductors PH1875L,115
- Part No.:
- PH1875L,115
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PH1875L,115.pdf
- Description:
- MOSFET N-CH 75V 45.8A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:6,182
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Product details
Overview
PH1875L,115 from NXP Semiconductors (formerly Philips Semiconductors) is a logic-level N-channel TrenchMOS power MOSFET in LFPAK (SOT669) package, designed for high-efficiency DC power switching. It features 75 V VDS, 45.8 A continuous drain current at Tmb = 25 °C, 13.3 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C, 15.3 nC QGD, and low thermal resistance of 2 K/W junction-to-mounting-base - enabling compact motor control and DC-DC converter designs.
For engineers reviewing the PH1875L,115 datasheet, PH1875L,115 pinout, PH1875L,115 application, or PH1875L,115 equivalent, key selection criteria include logic-level gate drive compatibility (VGS(th) = 1–2 V), low conduction loss under 20 A loads, mounting-base thermal management capability, and avalanche energy rating of 165 mJ for inductive load robustness.
Technical Context
This device uses TrenchMOS technology to achieve low RDS(on) and fast switching with minimal gate charge. Its gate threshold voltage range (1–2 V at 25 °C) ensures reliable turn-on with standard 3.3 V or 5 V logic controllers, while its 75 V breakdown rating supports 48 V bus systems and automotive 24 V applications.
The SOT669 (LFPAK) package integrates a thermally optimized mounting base directly connected to the drain, enabling efficient heat transfer to PCB copper or heatsinks. Thermal resistance Rth(j-mb) = 2 K/W allows sustained 29 A operation at Tmb = 100 °C, and its unclamped inductive avalanche rating (EDS(AL)S = 165 mJ) supports rugged operation in relay replacement and solenoid driving.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V - Supports 48 V nominal systems with 50 % safety margin against transients |
| ID (continuous) | 45.8 A at Tmb = 25 °C - Enables high-current switching without external heatsink in short-duration duty cycles |
| RDS(on) | 13.3 mΩ typ @ VGS = 10 V, Tj = 25 °C - Delivers ≤2.7 W conduction loss at 20 A, reducing thermal stress |
| QGD | 15.3 nC - Limits Miller-induced switching delay and improves hard-switching efficiency in buck converters |
| Rth(j-mb) | 2 K/W - Allows direct thermal coupling to PCB ground plane or heatsink, simplifying thermal design |
| VGS(th) | 1–2 V @ ID = 1 mA - Ensures full enhancement with 3.3 V microcontroller GPIOs without level-shifting |
| EAS | 165 mJ - Withstands single-pulse inductive energy in motor commutation or relay snubbing without failure |
Pinout & Package
PH1875L,115 is housed in the SOT669 (LFPAK) plastic surface-mount package - a 4-lead, single-ended outline with an exposed mounting base electrically tied to the drain terminal for enhanced thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Low-side return path; three parallel pins reduce source inductance and improve current sharing |
| 4 | Gate (G) | Control input; requires <15 V max gate drive; low 1 Ω gate resistance enables fast switching |
| Mounting base (mb) | Drain (D) | Primary power output and thermal interface; soldered directly to PCB copper for <2 K/W thermal path |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate threshold | VGS(th) = 1–2 V enables direct drive from 3.3 V/5 V MCUs without gate driver ICs |
| Ultra-low RDS(on) | 13.3 mΩ typ @ 10 V reduces conduction losses by >30 % vs. comparable 80 V MOSFETs |
| Low thermal resistance | Rth(j-mb) = 2 K/W supports >29 A continuous current at 100 °C mounting base temperature |
| TrenchMOS architecture | Optimizes cell density and gate charge balance for high dI/dt immunity and reduced EMI |
| Avalanche-rated | 165 mJ unclamped EAS provides inherent protection in inductive switching without external clamps |
Applications
| Brushed DC Motor Control | 48 V DC-DC Converter Primary Switch |
|---|---|
|
Use Scenario: H-bridge or half-bridge driving of 24–48 V brushed motors in industrial actuators and power tools. IC Role / Device Role / Timing Role: Low-side or high-side power switch handling bidirectional current up to 45 A peak. Use Value: Logic-level gate drive eliminates need for dedicated level shifters; low RDS(on) minimizes I²R heating during PWM commutation. |
Use Scenario: Primary-side synchronous rectifier or main switch in isolated/non-isolated 48 V input buck or forward converters. IC Role / Device Role / Timing Role: High-efficiency power switch operating at 100–500 kHz with low QGD and fast tf = 60 ns. Use Value: 15.3 nC QGD reduces Miller plateau time, improving switching efficiency and reducing gate driver power demand. |
| Automotive Body Control Module | Industrial Solenoid Driver |
|
Use Scenario: Load switching for lamps, fans, and window lifters in 12/24 V vehicle subsystems. IC Role / Device Role / Timing Role: High-reliability power FET with integrated avalanche ruggedness for inductive load suppression. Use Value: 165 mJ EAS withstands back-EMF from relay coils and brushed motors without external TVS diodes. |
Use Scenario: Driving 24 V solenoids and valves in factory automation and fluid control systems. IC Role / Device Role / Timing Role: Fast-turn-off power switch with low VSD = 0.85 V (typ) for minimized hold power dissipation. Use Value: Low gate threshold and fast tf = 60 ns enable precise pulse-width control and rapid de-energization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PBF | 60 V VDS, 140 A ID, 3.3 mΩ RDS(on), TO-220 package, higher Rth(j-c) = 1.25 K/W | Higher current capacity but larger footprint and no mounting-base thermal path | Preferred where board space permits and higher peak current is required; not drop-in due to package and voltage mismatch |
| STL125N4LF6AG | 40 V VDS, 125 A ID, 1.2 mΩ RDS(on), PowerFLAT 5x6 package, 1.5 K/W Rth(j-mb) | Lower voltage rating limits use to ≤36 V systems; superior RDS(on) but narrower safe operating area at high VDS | Best for 24 V high-current applications requiring ultra-low on-resistance; unsuitable for 48 V bus systems |
Compared with IRL3803PBF and STL125N4LF6AG, PH1875L,115 offers optimal balance of 75 V rating, logic-level drive, and LFPAK thermal performance - making it uniquely suited for space-constrained 48 V industrial and automotive switching where mounting-base cooling is critical.
Availability
PH1875L,115 is available at Aetrix Electronics and suitable for brushed DC motor control, 48 V DC-DC converter primary switching, and automotive body control modules requiring stable component supply across extended production lifecycles.
Supply support for PH1875L,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering semiconductor division.
PH1875L,115 belongs to NXP's legacy TrenchMOS logic-level power MOSFET family, engineered for high-efficiency, thermally robust switching in space-constrained industrial and automotive power systems.
FAQ
What is the maximum gate-source voltage rating for PH1875L,115?
The PH1875L,115 has a maximum gate-source voltage (VGS) rating of ±15 V, as specified in its Absolute Maximum Ratings table. Exceeding this limit risks permanent gate oxide damage. For reliable operation, gate drive circuits should be clamped to ≤12 V during transient conditions, and gate resistors must be selected to suppress ringing without compromising switching speed. The PH1875L,115's low 1 Ω gate resistance supports fast, controlled transitions within this voltage envelope.
Can PH1875L,115 be used in high-frequency switching applications like 500 kHz DC-DC converters?
Yes, PH1875L,115 supports high-frequency operation up to 500 kHz due to its low dynamic parameters: QGD = 15.3 nC, tf = 60 ns, and Ciss = 2600 pF at VDS = 25 V. These values minimize switching losses and gate drive power requirements. However, thermal management remains critical - at 500 kHz, conduction and switching losses must be jointly evaluated using the provided SOA curves and thermal resistance (Rth(j-mb) = 2 K/W) to ensure Tj stays within −55 °C to +150 °C limits. PH1875L,115's performance is validated in such applications per its Figure 3 Safe Operating Area plot.
Does PH1875L,115 have built-in avalanche ruggedness, and how is it rated?
Yes, PH1875L,115 is fully rated for unclamped inductive avalanche with EDS(AL)S = 165 mJ under defined test conditions: ID = 26 A, tp = 0.11 ms, VDS ≤ 75 V, RGS = 50 Ω, VGS = 10 V, and starting Tj = 25 °C. This rating confirms robustness against inductive kickback in motor and solenoid drives without external snubbers. The PH1875L,115's TrenchMOS structure and optimized layout contribute to consistent avalanche performance across its operating temperature range.
What is the thermal resistance from junction to mounting base for PH1875L,115, and how does it affect PCB layout?
The PH1875L,115 has a thermal resistance Rth(j-mb) of 2 K/W from junction to mounting base, measured per JEDEC standards. This value assumes full-solder coverage of the exposed mounting base (pin mb) to ≥100 mm² of 2-oz copper on the PCB. To achieve rated current (e.g., 29 A at Tmb = 100 °C), designers must provide low-impedance thermal vias beneath the mounting base and avoid thermal isolation. The PH1875L,115's SOT669 package relies entirely on this mounting base path - unlike TO-220 or DPAK - so PCB layout directly determines thermal performance.
Is PH1875L,115 compatible with 3.3 V microcontroller GPIOs for direct gate drive?
Yes, PH1875L,115 is explicitly designed for logic-level drive: its gate-source threshold voltage VGS(th) ranges from 1 V to 2 V at ID = 1 mA and Tj = 25 °C, ensuring full enhancement with 3.3 V outputs. At VGS = 4.5 V, RDS(on) remains low (≤20 mΩ), supporting efficient operation even with marginal gate drive. However, for best dynamic performance, a dedicated gate driver is recommended above 100 kHz to manage QG(tot) = 33.4 nC. PH1875L,115's compatibility with 3.3 V logic is confirmed in its Figure 7 transfer characteristics and Table 5 static parameters.
PH1875L,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 45.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 16.5mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 33.4 nC @ 5 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 62.5W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PH1875L,115 FAQ
1.How can I place an order for PH1875L,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PH1875L,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PH1875L,115 reliable?
The price and inventory of PH1875L,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PH1875L,115 is usually 5 days.
3.What payment methods are accepted for PH1875L,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PH1875L,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PH1875L,115?
PH1875L,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PH1875L,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PH1875L,115?
For technical support, including PH1875L,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PH1875L,115 requirements.
6.How does Aetrix verify that PH1875L,115 is sourced from the original manufacturer or authorized distributors?
All PH1875L,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PH1875L,115 meets industry standards.
7.What is the process for return or replacement of PH1875L,115?
All PH1875L,115 units undergo pre-shipment inspection (PSI). If there is an issue with PH1875L,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PH1875L,115 part is unused and in its original packaging.
Return procedure for PH1875L,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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