NXP Semiconductors PH4025L,115
- Part No.:
- PH4025L,115
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-100, SOT-669
- Datasheet:
-
PH4025L,115.pdf
- Description:
- MOSFET N-CH 25V 99A LFPAK56
- Quantity:
- Payment:

- Shipping:

Inventory:6,178
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Product details
Overview
PH4025L,115 from Nexperia is a logic-level N-channel TrenchMOS FET in LFPAK (SOT669) package, rated for 25 V VDS, 99 A continuous drain current at Tmb = 25 °C, and 3.4 mΩ typical RDS(on) at VGS = 10 V - optimized for high-efficiency DC-to-DC converters and voltage regulators in PC motherboards.
For engineers reviewing the PH4025L,115 datasheet, PH4025L,115 pinout, PH4025L,115 application, or PH4025L,115 equivalent, key selection criteria include low gate threshold (1.3–2.15 V), 5 nC gate-drain charge, 2 K/W junction-to-mounting-base thermal resistance, ruggedness-tested construction, and lead-free LFPAK packaging for high-power density board designs.
Technical Context
This device uses TrenchMOS technology to achieve low conduction loss and fast switching: RDS(on) remains ≤6.4 mΩ up to 150 °C, and QGD = 5 nC enables efficient hard-switching in synchronous buck topologies. Its logic-level gate drive (VGS(th) max 2.15 V at 25 °C) allows direct interfacing with 3.3 V or 5 V controllers without level-shifting.
The mounting base (pin mb) is internally connected to the drain, providing low-inductance thermal and electrical path to PCB copper. Thermal resistance Rth(j-mb) = 2 K/W supports high-power operation when mounted on ≥100 mm² 2-oz copper, and avalanche energy rating EDS(AL)S = 150 mJ ensures robustness under unclamped inductive transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V - maximum drain-source blocking voltage; suitable for 12 V input rails with margin. |
| ID (continuous) | 99 A at Tmb = 25 °C - enables high-current power stages without parallel devices in compact layouts. |
| RDS(on) | 3.4 mΩ typ @ VGS = 10 V, Tj = 25 °C - reduces conduction loss to <0.7 W at 40 A, critical for thermally constrained DC-DC modules. |
| QGD | 5 nC typ - minimizes switching loss during Miller plateau transition; supports >1 MHz operation with moderate gate drive. |
| Rth(j-mb) | 2 K/W - enables efficient heat transfer to PCB thermal pad; allows sustained 46.4 W dissipation with proper layout. |
| VGS(th) | 1.3–2.15 V @ ID = 1 mA - ensures full enhancement with standard logic-level drivers (e.g., microcontroller GPIO, PWM ICs). |
| EDS(AL)S | 150 mJ - withstands unclamped inductive energy in synchronous rectifier or motor control fault conditions. |
Pinout & Package
Package: LFPAK (SOT669) - plastic single-ended surface-mounted package with exposed mounting base for enhanced thermal and electrical performance. Dimensions: 5.0 × 3.3 × 1.3 mm (L × W × H); mounting base electrically tied to drain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Low-side return path; three parallel pins reduce source inductance and improve current sharing in high-di/dt applications. |
| 4 | Gate (G) | Control terminal; RG = 0.48 Ω typ enables stable gate driving with minimal external resistance. |
| mb (mounting base) | Drain (D) | Exposed copper pad connected internally to drain; serves as primary thermal path and high-current drain connection. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | VGS(th) ≤ 2.15 V ensures reliable turn-on with 3.3 V/5 V controllers - eliminates need for gate driver ICs in space-constrained designs. |
| 100 % ruggedness tested | Each PH4025L,115 unit passes avalanche energy test (150 mJ), guaranteeing robustness against transient overloads in real-world power systems. |
| TrenchMOS technology | Delivers 3.4 mΩ RDS(on) in SOT669 - achieves MOSFET performance previously requiring larger SO-8 or DPAK packages. |
| Lead-free LFPAK package | SOT669 footprint offers 3× lower thermal resistance than SO-8 and superior solder joint reliability vs. D²PAK in automated assembly. |
| Optimized for DC-DC converters | Low QGD/QG(tot) ratio (5/21.3 nC) and fast switching (tr = 52 ns) minimize losses in synchronous buck converters operating up to 2 MHz. |
Applications
| PC Motherboard VRMs | Server Point-of-Load Converters |
|---|---|
|
Use Scenario: High-current CPU/GPU voltage regulation delivering up to 100 A at 1.0–1.8 V from 12 V input. IC Role / Device Role / Timing Role: Synchronous rectifier (low-side switch) in multiphase buck converter; operates at 300–1000 kHz with precise duty-cycle control. Use Value: 3.4 mΩ RDS(on) reduces conduction loss by >40% vs. legacy SO-8 MOSFETs, enabling higher efficiency and cooler VRM operation. |
Use Scenario: Compact 48 V-to-12 V intermediate bus converter in rack-mounted servers. IC Role / Device Role / Timing Role: Primary-side switch in active clamp forward or LLC resonant topology; driven by isolated gate driver. Use Value: 25 V rating and 150 mJ avalanche capability allow safe operation during output short-circuit events without external snubbers. |
| Industrial DC-DC Modules | Automotive Body Control Units |
|
Use Scenario: DIN-rail mounted 24 V input, 5/3.3 V output isolated DC-DC module for PLC I/O power. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward converter; commutated by transformer reset signal. Use Value: Low VGS(th) ensures full enhancement even with aging gate drive signals, improving long-term reliability across temperature. |
Use Scenario: Load switch for 12 V battery-fed infotainment subsystems with reverse polarity and overcurrent protection. IC Role / Device Role / Timing Role: High-side or low-side power switch controlled by automotive MCU; integrated body electronics. Use Value: 100 % RG and ruggedness testing meet AEC-Q101 stress requirements for automotive under-hood environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PSMN2R0-25YL,115 | RDS(on) = 2.0 mΩ @ 10 V (lower), but VDS = 25 V same; QGD = 4.8 nC; LFPAK56 (SOT1205) package - 0.5 mm taller. | Better conduction loss at high current; slightly higher gate charge demands stronger driver for >1 MHz operation. | Preferred where <1 mΩ RDS(on) reduction justifies minor layout revision and driver upgrade. |
| IPB180N03L G | RDS(on) = 1.8 mΩ @ 10 V; VDS = 30 V; TO-263 (D²PAK) package; QGD = 6.2 nC; no 100 % ruggedness test documented. | Higher voltage rating adds margin for 24 V systems; larger package increases board area and thermal mass. | Selected when 30 V rating or legacy D²PAK compatibility outweighs LFPAK's thermal advantage. |
Compared with PSMN2R0-25YL,115 and IPB180N03L G, the PH4025L,115 delivers balanced performance: its 3.4 mΩ RDS(on) and 5 nC QGD optimize efficiency in 12 V-input, sub-1 MHz DC-DC converters, while 100 % ruggedness testing and SOT669 footprint ensure reliability and manufacturability in high-volume motherboard production.
Availability
PH4025L,115 is available at Aetrix Electronics and suitable for PC motherboard VRMs, server point-of-load converters, and industrial DC-DC modules requiring stable component supply, consistent parametric performance, and long-term lifecycle support.
Supply support for PH4025L,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division.
The PH4025L,115 belongs to Nexperia's TrenchMOS logic-level power MOSFET family, engineered for high-efficiency, high-current switching in space-constrained computing and industrial power supplies.
FAQ
What is the maximum continuous drain current for PH4025L,115 at 100 °C mounting base temperature?
The PH4025L,115 supports 67.5 A continuous drain current at Tmb = 100 °C and VGS = 10 V, as specified in Table 3 of the datasheet. This derating reflects thermal limits of the LFPAK package and ensures safe operation in high-ambient environments like enclosed server chassis or industrial enclosures where PCB copper area may be constrained.
Does PH4025L,115 require a gate resistor for stable switching in a 500 kHz buck converter?
Yes - while the PH4025L,115 has low intrinsic gate resistance (0.48 Ω typ), a series gate resistor (typically 2.2–10 Ω) is recommended to damp ringing, control dV/dt, and prevent shoot-through in synchronous configurations. The 5 nC QGD and 21.3 nC total gate charge make it compatible with standard 1–2 A peak gate drivers at 500 kHz without excessive power loss.
Is PH4025L,115 qualified for automotive applications per AEC-Q101?
No - the PH4025L,115 is not AEC-Q101 qualified. It is designed for computing and industrial applications. For automotive body control units, Nexperia offers AEC-Q101-qualified variants such as the PSMN2R0-25YL,115, which shares the same TrenchMOS process and LFPAK56 package but undergoes additional stress testing.
How does the mounting base (mb) connection affect PCB layout for PH4025L,115?
The mounting base of the PH4025L,115 is internally connected to the drain, so the PCB thermal pad must be routed to the drain net - not ground or source. A minimum 100 mm² 2-oz copper area with multiple thermal vias to inner layers is required to achieve the rated 2 K/W Rth(j-mb) and sustain 46.4 W power dissipation without exceeding Tj = 150 °C.
What is the typical reverse recovery time (trr) of the body diode in PH4025L,115?
The PH4025L,115 body diode has a typical reverse recovery time trr of 38 ns under conditions of IS = 25 A, dIS/dt = −100 A/µs, VR = 20 V, and VGS = 0 V (Table 5). This fast recovery supports efficient synchronous rectification and reduces switching loss compared to standard MOSFETs with slower body diodes.
PH4025L,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- SC-100, SOT-669
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 99A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2.15V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 21.3 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2601 pF @ 12 V
- FET Feature:
- -
- Power Dissipation (Max):
- 46.4W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LFPAK56, Power-SO8
PH4025L,115 FAQ
1.How can I place an order for PH4025L,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PH4025L,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PH4025L,115 reliable?
The price and inventory of PH4025L,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PH4025L,115 is usually 5 days.
3.What payment methods are accepted for PH4025L,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PH4025L,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PH4025L,115?
PH4025L,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PH4025L,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PH4025L,115?
For technical support, including PH4025L,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PH4025L,115 requirements.
6.How does Aetrix verify that PH4025L,115 is sourced from the original manufacturer or authorized distributors?
All PH4025L,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PH4025L,115 meets industry standards.
7.What is the process for return or replacement of PH4025L,115?
All PH4025L,115 units undergo pre-shipment inspection (PSI). If there is an issue with PH4025L,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PH4025L,115 part is unused and in its original packaging.
Return procedure for PH4025L,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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