NXP Semiconductors PHB176NQ04T,118
- Part No.:
- PHB176NQ04T,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PHB176NQ04T,118.pdf
- Description:
- MOSFET N-CH 40V 75A D2PAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHB176NQ04T from NXP Semiconductors (formerly Philips Semiconductors) is an N-channel TrenchMOS™ standard-level power MOSFET in D2-PAK (SOT404) package, rated for 40 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 4.3 mΩ maximum RDS(on) at VGS = 10 V and Tj = 25 °C. It serves as a high-current, low-loss switching element in DC-DC converters, motor drives, and industrial power control circuits.
For engineers reviewing the PHB176NQ04T datasheet, PHB176NQ04T pinout, PHB176NQ04T application, or PHB176NQ04T equivalent, key selection criteria include its 0.6 K/W junction-to-mounting-base thermal resistance, avalanche energy rating of 560 mJ, gate threshold voltage range of 2–4 V at 25 °C, and compatibility with standard-level gate drive (10 V).
Technical Context
This device uses TrenchMOS™ technology to achieve low on-state resistance while maintaining robust avalanche ruggedness and fast switching performance. Its gate charge profile-68.9 nC total, with 22.2 nC Miller charge-supports efficient hard-switching in high-frequency power stages up to several hundred kHz.
The integrated source-drain diode exhibits 0.85–1.2 V forward voltage at 25 A and 68 ns reverse recovery time, enabling synchronous rectification or freewheeling in buck and half-bridge topologies without external diodes. Thermal design is anchored to the mounting base, with Rth(j-mb) ≤ 0.6 K/W and Rth(j-a) = 50 K/W when mounted on a minimum PCB footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage; suitable for 24 V and 36 V nominal bus systems with margin. |
| ID (continuous) | 75 A at Tmb = 25 °C - Enables high-power switching without forced air cooling when heatsink-mounted. |
| RDS(on) max | 4.3 mΩ at VGS = 10 V, Tj = 25 °C - Delivers <1.5 W conduction loss at 60 A, critical for efficiency in high-current DC-DC stages. |
| EAS | 560 mJ - Withstands unclamped inductive switching events (e.g., relay coil or motor winding turn-off) without failure. |
| Qg(tot) | 68.9 nC - Determines gate driver power requirement; enables use with common 1–2 A peak gate drivers. |
| VGS(th) | 2–4 V at Tj = 25 °C - Ensures reliable turn-on with standard logic-level or microcontroller GPIO drive. |
| Ciss | 3620 pF - Influences gate drive loop stability and EMI behavior; requires careful PCB layout near gate node. |
Pinout & Package
PHB176NQ04T is housed in a plastic single-ended surface-mounted D2-PAK package (SOT404), featuring a large copper mounting base thermally and electrically connected to the drain terminal. Pin 2 is internally connected to the drain but not externally accessible - only pins 1 (gate), 3 (source), and the mounting base (drain) are functional terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control input; requires 10 V for full enhancement; threshold range 2–4 V ensures compatibility with 3.3 V/5 V logic. |
| 3 | Source (S) | Power return path; referenced to system ground in low-side switch configurations. |
| Mounting base | Drain (D) | High-current power terminal and primary thermal interface; must be soldered to a copper pour or heatsink for thermal management. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ technology | Enables 4.3 mΩ RDS(on) in D2-PAK, reducing conduction losses by >30% vs. planar MOSFETs of same die size. |
| Avalanche ruggedness | 560 mJ non-repetitive EAS allows safe operation in inductive load switching without snubbers or clamps. |
| Low Qgd/Qg ratio | 32% Miller-to-total gate charge ratio improves switching controllability and reduces risk of shoot-through in bridge circuits. |
| Integrated body diode | 68 ns trr and 62 nC Qr support efficient freewheeling in synchronous rectifiers and H-bridge motor drives. |
| Thermal resistance | 0.6 K/W Rth(j-mb) enables >200 W power dissipation with modest heatsinking, simplifying thermal design. |
Applications
| Motor Drive Systems | Uninterruptible Power Supplies |
|---|---|
|
Use Scenario: Driving brushed DC motors or stepper phase windings in industrial automation equipment requiring 24–48 V supply and up to 75 A peak current. IC Role / Device Role / Timing Role: Low-side power switch controlling motor current flow; operates in PWM mode at 10–20 kHz. Use Value: 4.3 mΩ RDS(on) minimizes I²R heating during sustained stall conditions, extending motor controller lifetime. |
Use Scenario: Output stage switching in offline UPS inverters converting 48 V battery bank to 120/230 V AC via H-bridge topology. IC Role / Device Role / Timing Role: High-current half-bridge leg switch handling bidirectional current up to 75 A with fast turn-off (<95 ns). Use Value: 560 mJ avalanche rating absorbs energy from transformer leakage inductance during dead-time transitions. |
| DC-DC Converters | Industrial Load Switching |
|
Use Scenario: Synchronous rectifier or primary-side switch in 48 V–12 V isolated buck converters for telecom and server power supplies. IC Role / Device Role / Timing Role: High-efficiency power FET operating at 200–500 kHz with gate drive synchronized to controller timing. Use Value: 3620 pF Ciss and 415 pF Crss enable stable gate drive with minimal ringing, reducing EMI filter burden. |
Use Scenario: Solid-state replacement for electromechanical relays controlling solenoids, lamps, or HVAC actuators in factory control panels. IC Role / Device Role / Timing Role: Single-pole, high-current load switch activated by PLC output or microcontroller GPIO. Use Value: Standard-level VGS(th) (2–4 V) ensures direct drive from 3.3 V or 5 V logic without level-shifting circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP75NF40 | 40 V VDS, 75 A ID, 4.5 mΩ RDS(on), TO-220 package, higher Rth(j-a) (60 K/W) | Requires larger heatsink due to higher thermal resistance; less suitable for surface-mount designs. | Preferred where through-hole assembly and legacy TO-220 footprint are required. |
| IRF1404ZPBF | 40 V VDS, 130 A ID, 4.7 mΩ RDS(on), TO-220AB, no specified EAS rating | Lacks documented avalanche energy spec; unsuitable for unclamped inductive switching without external protection. | Appropriate for resistive or lightly inductive loads where avalanche stress is absent. |
Compared with STP75NF40 and IRF1404ZPBF, PHB176NQ04T offers superior thermal performance (0.6 K/W vs. ≥1.0 K/W), verified 560 mJ avalanche capability, and surface-mount D2-PAK packaging-making it optimal for space-constrained, high-reliability industrial power modules.
Availability
PHB176NQ04T is available at Aetrix Electronics and suitable for motor drives, uninterruptible power supplies, and DC-DC converters requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing.
Supply support for PHB176NQ04T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips Semiconductors in 2006, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PHB176NQ04T belongs to NXP's legacy TrenchMOS™ power MOSFET family, designed specifically for high-current, high-efficiency switching in industrial power conversion and motor control systems.
FAQ
What is the maximum continuous drain current rating for PHB176NQ04T?
The PHB176NQ04T supports a continuous drain current of 75 A when the mounting base temperature (Tmb) is maintained at 25 °C. At Tmb = 100 °C, the device still delivers 75 A per the datasheet derating curve, enabled by its low RDS(on) and 0.6 K/W thermal resistance to the mounting base. Actual usable current depends on PCB copper area, heatsinking, and ambient conditions.
Does PHB176NQ04T require a gate driver IC, or can it be driven directly from a microcontroller?
PHB176NQ04T can be driven directly from a 3.3 V or 5 V microcontroller GPIO in low-frequency switching applications (e.g., <1 kHz load switching), as its gate threshold voltage (VGS(th)) ranges from 2–4 V. However, for PWM operation above 10 kHz or high-efficiency DC-DC conversion, a dedicated gate driver is recommended to deliver the 68.9 nC total gate charge quickly and minimize switching losses in the PHB176NQ04T.
What is the avalanche energy rating of PHB176NQ04T, and how is it tested?
The PHB176NQ04T has a non-repetitive drain-source avalanche energy rating (EDS(AL)S) of 560 mJ, measured under unclamped inductive load conditions: ID = 75 A, tp = 0.29 ms, VDD ≤ 40 V, RGS = 50 Ω, VGS = 10 V, starting at Tj = 25 °C. This rating validates its ability to absorb transient inductive energy without failure-critical for motor and solenoid drive reliability.
Is PHB176NQ04T pin-compatible with other D2-PAK MOSFETs like the STP75NF40?
No, PHB176NQ04T is not pin-compatible with STP75NF40. The PHB176NQ04T uses SOT404 (D2-PAK) with pin 2 internally connected and inaccessible, while STP75NF40 uses TO-220AB (SOT78) with three fully accessible leads. Their footprints, thermal interfaces, and pin assignments differ fundamentally-PCB redesign is required for substitution.
What is the typical reverse recovery time of the body diode in PHB176NQ04T?
The source-drain body diode in PHB176NQ04T has a typical reverse recovery time (trr) of 68 ns, measured at IS = 20 A, dIS/dt = −100 A/µs, and VGS = 0 V. This fast recovery supports efficient synchronous rectification and reduces switching losses in buck and half-bridge topologies where the PHB176NQ04T operates as both switch and freewheeling element.
PHB176NQ04T,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 4.3mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 68.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3620 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PHB176NQ04T,118 FAQ
1.How can I place an order for PHB176NQ04T,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHB176NQ04T,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PHB176NQ04T,118 reliable?
The price and inventory of PHB176NQ04T,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHB176NQ04T,118 is usually 5 days.
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5.How can I obtain technical support or documentation for PHB176NQ04T,118?
For technical support, including PHB176NQ04T,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PHB176NQ04T,118 requirements.
6.How does Aetrix verify that PHB176NQ04T,118 is sourced from the original manufacturer or authorized distributors?
All PHB176NQ04T,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHB176NQ04T,118 meets industry standards.
7.What is the process for return or replacement of PHB176NQ04T,118?
All PHB176NQ04T,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHB176NQ04T,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHB176NQ04T,118 part is unused and in its original packaging.
Return procedure for PHB176NQ04T,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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