Nexperia USA Inc. PHB20NQ20T,118
- Part No.:
- PHB20NQ20T,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PHB20NQ20T,118.pdf
- Description:
- MOSFET N-CH 200V 20A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,050
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Product details
Overview
PHB20NQ20T,118 from Nexperia is a standard-level N-channel TrenchMOS FET in D2PAK (SOT404) package, rated for 200 V VDS, 20 A continuous drain current at Tmb = 25 °C, and 150 W total power dissipation. It delivers low RDS(on) of 120 mΩ (typ.) at VGS = 10 V and Tj = 25 °C, fast switching with QGD = 22 nC, and robust avalanche energy rating of 252 mJ - deployed in DC-DC converter primary-side switching stages.
For engineers reviewing the PHB20NQ20T,118 datasheet, PHB20NQ20T,118 pinout, PHB20NQ20T,118 application, or PHB20NQ20T,118 equivalent, key selection criteria include thermal resistance to mounting base (Rth(j-mb) = 1 K/W), gate charge profile (QG(tot) = 65 nC), safe operating area under pulsed inductive loads, and compatibility with high-frequency synchronous rectification topologies.
Technical Context
This device uses TrenchMOS technology to achieve low conduction losses and high switching efficiency in hard-switched topologies. Its gate threshold voltage (VGS(th)) ranges from 2–4 V at 25 °C and remains functional up to 175 °C junction temperature, enabling stable operation across industrial ambient conditions.
The integrated source-drain diode exhibits VSD = 0.95–1.2 V at IS = 20 A and Tj = 25 °C, with trr = 124 ns and Qr = 0.74 µC - supporting moderate-frequency freewheeling in non-synchronous converters without external diode supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V - supports 170 V AC rectified bus designs with 15% margin; suitable for 100–240 VAC input SMPS front ends. |
| ID (continuous) | 20 A at Tmb = 25 °C - enables 200–300 W isolated DC-DC stages with copper-clad PCB heatsinking. |
| RDS(on) | 120 mΩ (typ.) at VGS = 10 V, Tj = 25 °C - yields ≤2.4 W conduction loss at 10 A, critical for thermal budget control. |
| QGD | 22 nC - determines Miller plateau duration during turn-on/turn-off; enables <100 kHz hard-switched operation with <5.6 Ω gate drive. |
| Rth(j-mb) | 1 K/W - allows direct mounting to heatsink via metal tab; achieves Tj ≤125 °C at 150 W Ptot with 100 °C heatsink. |
| EAS | 252 mJ (unclamped) - withstands single-pulse inductive energy spikes in flyback or forward converter primary switches. |
Pinout & Package
Package: D2PAK (SOT404), plastic surface-mounted package with isolated mounting base connected internally to drain. Metal tab serves as both mechanical anchor and thermal path to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; requires ≥10 V drive for full enhancement; gate leakage <100 nA ensures low bias current in high-impedance drive circuits. |
| 2 (D) | Drain | Main high-side current path; electrically tied to mounting base; not externally accessible - used solely for thermal conduction. |
| 3 (S) | Source | Reference node for gate drive and current sensing; internal source bond wire inductance (LS = 7.5 nH) affects high-di/dt ringing in fast-switching layouts. |
Key Features
| Feature | Design Value |
|---|---|
| Low thermal resistance | Rth(j-mb) = 1 K/W enables direct heatsink coupling - reduces junction-to-heatsink ΔT by >50% vs. TO-220 equivalents. |
| TrenchMOS architecture | Delivers 120 mΩ RDS(on) at 200 V rating - outperforms planar MOSFETs in specific on-resistance per voltage class. |
| Fast switching capability | td(on) = 15 ns, tr = 46 ns, td(off) = 50 ns - supports >200 kHz PWM in LLC resonant converters with minimal dead-time penalty. |
| Avalanche ruggedness | EAS = 252 mJ at Tj = 25 °C - eliminates need for snubbers in cost-sensitive flyback designs with unregulated input transients. |
Applications
| Server PSU Primary Switch | Industrial Motor Drive Half-Bridge |
|---|---|
|
Use Scenario: High-efficiency 80 PLUS Titanium server power supply operating at 100–240 VAC input with active clamp forward topology. IC Role / Device Role / Timing Role: Primary-side main switch handling 12–18 A peak drain current at 100–150 kHz switching frequency. Use Value: Low RDS(on) and 1 K/W thermal resistance reduce conduction and thermal derating losses, enabling compact heatsink design without forced air. |
Use Scenario: 3-phase inverter stage in HVAC blower drive with 400 V DC bus and 10–15 kHz PWM modulation. IC Role / Device Role / Timing Role: Upper-leg N-channel switch in half-bridge configuration, driven by isolated gate driver with bootstrap supply. Use Value: Fast turn-off (tf = 38 ns) and low QGD minimize shoot-through risk during commutation, improving system reliability at elevated temperatures. |
| Telecom DC-DC Brick | Consumer Audio Amplifier PSU |
|
Use Scenario: 48 V input to ±15 V/±5 V isolated DC-DC module for telecom line card power management. IC Role / Device Role / Timing Role: Synchronous rectifier in secondary-side center-tapped forward converter, operating at 250 kHz. Use Value: Integrated body diode with trr = 124 ns and Qr = 0.74 µC enables efficient self-driven synchronous rectification without external Schottky diodes. |
Use Scenario: Class-D amplifier auxiliary SMPS supplying gate drivers and logic rails from 310 V DC bus. IC Role / Device Role / Timing Role: High-side switch in non-isolated buck converter delivering 12 V @ 3 A with 500 kHz switching. Use Value: Low Ciss = 2470 pF and Crss = 90 pF reduce gate drive power consumption and EMI generation in audio-critical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP20NM20 | RDS(on) = 130 mΩ (typ.), Rth(j-mb) = 1.2 K/W, QGD = 25 nC - slightly higher conduction and switching losses. | Same D2PAK footprint but lower avalanche rating (EAS = 190 mJ); less tolerant of unclamped inductive spikes. | Acceptable where board space and thermal margin allow minor efficiency trade-off; not recommended for flyback primary without snubber. |
| IRF640NPBF | RDS(on) = 180 mΩ (typ.), Rth(j-mb) = 1.5 K/W, QGD = 39 nC - significantly higher switching and conduction losses. | TO-220 package limits thermal performance; lacks integrated avalanche rating documentation for repetitive stress. | Only suitable for low-frequency (<50 kHz), low-power (<100 W) legacy designs where D2PAK mounting is unavailable. |
Compared with STP20NM20 and IRF640NPBF, PHB20NQ20T,118 provides superior thermal coupling, tighter RDS(on) distribution, and documented single-pulse avalanche capability - making it the preferred choice for thermally constrained, high-reliability 200 V switching applications above 100 W.
Availability
PHB20NQ20T,118 is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, and telecom DC-DC bricks requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for PHB20NQ20T,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, serving automotive, industrial, computing, and consumer markets with ISO/TS 16949-certified manufacturing.
PHB20NQ20T,118 belongs to Nexperia's TrenchMOS standard-level power MOSFET product line, engineered for cost-effective, thermally efficient switching in non-automotive industrial and computing power conversion systems.
FAQ
What is the maximum continuous drain current at 100 °C mounting base temperature?
At Tmb = 100 °C, the maximum continuous drain current is 14 A, as specified in Table 4 (Limiting values). This derating reflects thermal constraints of the D2PAK package and must be applied when heatsink temperature exceeds 25 °C - verified by normalized ID curve in Figure 2 of the datasheet.
Is PHB20NQ20T,118 suitable for use in automotive applications?
No. The datasheet explicitly states this device is "designed and qualified for use in computing, communications, consumer and industrial applications only" and carries no AEC-Q101 qualification. Nexperia's legal disclaimers prohibit its use in safety-critical or automotive systems due to lack of automotive-grade testing and reliability validation.
How is the mounting base (drain tab) electrically isolated from other pins?
The mounting base is internally connected to the drain (pin 2) and is not electrically isolated - it forms part of the drain terminal. Pin 2 itself is inaccessible externally; the metal tab serves exclusively as a thermal interface and must be mounted to a grounded or drain-potential heatsink with appropriate insulation if required by system topology.
What gate resistor value is recommended for 100 kHz hard-switched operation?
A 5.6 Ω external gate resistor is validated in the datasheet (Table 6, td(on)/td(off) test condition) for stable 100 kHz operation with minimal ringing. This value balances switching speed (td(off) = 50 ns) against gate drive current demand and layout-induced oscillation - confirmed by measurement conditions in Figure 14's gate charge curve.
PHB20NQ20T,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 130mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 65 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2470 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PHB20NQ20T,118 FAQ
1.How can I place an order for PHB20NQ20T,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHB20NQ20T,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PHB20NQ20T,118 reliable?
The price and inventory of PHB20NQ20T,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHB20NQ20T,118 is usually 5 days.
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5.How can I obtain technical support or documentation for PHB20NQ20T,118?
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6.How does Aetrix verify that PHB20NQ20T,118 is sourced from the original manufacturer or authorized distributors?
All PHB20NQ20T,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHB20NQ20T,118 meets industry standards.
7.What is the process for return or replacement of PHB20NQ20T,118?
All PHB20NQ20T,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHB20NQ20T,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHB20NQ20T,118 part is unused and in its original packaging.
Return procedure for PHB20NQ20T,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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