Nexperia USA Inc. PHB33NQ20T,118
- Part No.:
- PHB33NQ20T,118
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
PHB33NQ20T,118.pdf
- Description:
- MOSFET N-CH 200V 32.7A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,600
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Product details
Overview
PHB33NQ20T from Nexperia is a standard-level N-channel TrenchMOS power MOSFET in D2PAK (SOT404) package, rated for 200 V VDS, 32.7 A continuous drain current at Tmb = 25 °C, and 65 mΩ typical RDS(on) at VGS = 10 V and Tj = 25 °C. It serves as a primary-side switching device in DC-to-DC converters requiring high efficiency and fast switching.
For engineers reviewing the PHB33NQ20T datasheet, PHB33NQ20T pinout, PHB33NQ20T application, or PHB33NQ20T equivalent, key selection criteria include its 0.65 K/W junction-to-mounting-base thermal resistance, 9.6 nC gate-drain charge, avalanche ruggedness (190 mJ), and suitability for high-frequency hard-switching topologies with low gate drive complexity.
Technical Context
This MOSFET employs TrenchMOS technology to achieve low RDS(on) and fast switching with minimal gate charge-QG(tot) = 32.2 nC and QGD = 9.6 nC at VDS = 100 V and ID = 25 A. Its gate threshold voltage ranges from 1 V (Tj = 175 °C) to 4.4 V (Tj = −55 °C), enabling robust turn-on margin across temperature.
The device features an integrated source-drain diode with 150 ns reverse recovery time and 645 nC recovered charge, supporting synchronous rectification and freewheeling roles. Its mounting base is electrically connected to the drain, requiring isolation in PCB layout, and thermal performance is optimized via direct heatsink coupling through the metal base.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V maximum drain-source voltage - supports 176 V AC input rectified rails with safety margin |
| ID (continuous) | 32.7 A at Tmb = 25 °C - enables high-current primary switch in 300–500 W DC-DC stages |
| RDS(on) | 65 mΩ typical at VGS = 10 V, Tj = 25 °C - limits conduction loss to ≤2.1 W at 18 A |
| QGD | 9.6 nC - reduces Miller-induced switching delay and improves EMI control in hard-switched converters |
| Rth(j-mb) | 0.65 K/W - allows >200 W dissipation with 130 °C ΔT to heatsink, critical for compact power designs |
| EAS | 190 mJ non-repetitive avalanche energy - sustains unclamped inductive turn-off events without failure |
| tr/tf | 35 ns rise / 45 ns fall time - supports >500 kHz switching frequencies with controlled dV/dt |
Pinout & Package
PHB33NQ20T uses the SOT404 (D2PAK) plastic surface-mount package with a copper mounting base thermally and electrically tied to the drain. Pin 2 is internally connected to the mounting base and not externally accessible; only pins 1 (Gate), 3 (Source), and the base (Drain) are functional terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Low-charge (32.2 nC total) control terminal requiring simple 10 V logic-level drive |
| Pin 3 | Source | Reference node for gate drive and current sensing; isolated from mounting base |
| Mounting Base | Drain | High-current power terminal and primary thermal path; must be insulated from chassis ground |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × QG figure of merit | 65 mΩ × 32.2 nC = 2.09 Ω·nC - balances conduction and switching losses in medium-power SMPS |
| Drain-connected mounting base | 0.65 K/W Rth(j-mb) - enables direct heatsink attachment without thermal interface material penalty |
| Fast body diode | 150 ns trr, 645 nC Qr - reduces snubbing requirements and improves light-load efficiency in flyback/LLC |
| High avalanche ruggedness | 190 mJ EAS - tolerates transient overvoltage during transformer leakage energy release |
| Wide VGS rating | ±20 V - accommodates gate drive overshoot and noise without oxide stress or latch-up risk |
Applications
| Server PSU Primary Switch | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-efficiency 48 V input to 12 V output step-down converter in 1U server power supply. IC Role / Device Role / Timing Role: Primary-side synchronous rectifier switch in active-clamp forward topology operating at 300 kHz. Use Value: 65 mΩ RDS(on) and 9.6 nC QGD minimize combined conduction and switching losses, enabling >95% full-load efficiency. |
Use Scenario: Isolated 24 V to 5 V/3.3 V auxiliary supply in programmable logic controller (PLC) backplane. IC Role / Device Role / Timing Role: Main switching FET in 200 kHz flyback controller with integrated feedback. Use Value: 190 mJ avalanche energy withstands transformer reset transients without external clamping, reducing BOM count. |
| Telecom Rectifier Module | Consumer AC-DC Adapter |
Use Scenario: 3 kW telecom rectifier module converting -48 V DC input to +12 V system bus. IC Role / Device Role / Timing Role: Parallel-configured primary switch in phase-shifted full-bridge topology. Use Value: 0.65 K/W Rth(j-mb) enables uniform thermal distribution across multiple devices mounted on shared heatsink. |
Use Scenario: 65 W USB-C PD adapter with QR flyback architecture. IC Role / Device Role / Timing Role: High-side switch in quasi-resonant controller with valley switching. Use Value: Fast 35 ns/45 ns switching transitions reduce EMI filter size while maintaining CISPR-32 Class B compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP33N20 | Higher RDS(on) (75 mΩ typ), higher QG (45 nC), TO-220 package | Limited to <400 kHz due to slower switching; requires mechanical heatsink mounting | Preferred where cost sensitivity outweighs thermal density and frequency needs |
| IRF640NPBF | Lower voltage rating (200 V same), but higher RDS(on) (180 mΩ), older planar process | Not suitable for high-current DC-DC primaries above 10 A continuous; higher conduction loss | Acceptable only in legacy designs with derated current and no thermal constraints |
Compared with STP33N20 and IRF640NPBF, PHB33NQ20T delivers superior thermal performance (0.65 K/W vs. ≥1.5 K/W), lower switching losses (9.6 nC QGD vs. ≥15 nC), and higher current capability-making it optimal for space-constrained, high-frequency, high-efficiency power stages.
Availability
PHB33NQ20T is available at Aetrix Electronics and suitable for server power supplies, industrial DC-DC converters, and telecom rectifier modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for PHB33NQ20T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions, with roots in NXP's standard products division.
PHB33NQ20T belongs to Nexperia's TrenchMOS standard-level power MOSFET product line, engineered for computing, communications, consumer, and industrial power conversion where efficiency, thermal density, and ruggedness are critical.
FAQ
Is PHB33NQ20T suitable for gate drive with 5 V logic?
No. PHB33NQ20T is a standard-level MOSFET requiring VGS ≥10 V for full enhancement. Its gate threshold voltage is 2–4 V at 25 °C, but RDS(on) remains high below 8 V-typical value is 182 mΩ at VGS = 10 V and Tj = 175 °C. A dedicated 10–12 V gate driver is mandatory for low-loss operation.
How is the mounting base electrically connected?
The mounting base is internally bonded to the drain terminal (Pin 2). It is not isolated and must be treated as a live high-voltage node. PCB layout requires full creepage/clearance isolation from other circuitry and chassis ground, and thermal interface material must be electrically insulating if heatsink grounding is required.
What is the maximum safe operating temperature for continuous use?
The absolute maximum junction temperature is 175 °C, but continuous operation should be limited to Tj ≤150 °C per Nexperia's reliability guidelines. At Tmb = 100 °C, the rated continuous drain current drops to 23.1 A-designers must apply derating curves from Figure 1 and ensure thermal design maintains Tj within this limit under worst-case ambient and airflow conditions.
Does PHB33NQ20T have built-in ESD protection?
Yes. The device meets HBM ESD classification of Class 1C (≥1 kV, <2 kV) per JESD22-A114. However, it lacks dedicated gate protection diodes-external Zener clamping (e.g., 15 V TVS) is recommended in high-noise environments to prevent gate oxide damage from transient overvoltage exceeding ±20 V.
PHB33NQ20T,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- TrenchMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 32.7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 77mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 32.2 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1870 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
PHB33NQ20T,118 FAQ
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6.How does Aetrix verify that PHB33NQ20T,118 is sourced from the original manufacturer or authorized distributors?
All PHB33NQ20T,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHB33NQ20T,118 meets industry standards.
7.What is the process for return or replacement of PHB33NQ20T,118?
All PHB33NQ20T,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHB33NQ20T,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHB33NQ20T,118 part is unused and in its original packaging.
Return procedure for PHB33NQ20T,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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