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NXP Semiconductors PHD108NQ03LT,118

Part No.:
PHD108NQ03LT,118
Manufacturer:
NXP Semiconductors
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixPHD108NQ03LT,118.pdf
Description:
MOSFET N-CH 25V 75A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,577

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Product details

Overview

PHD108NQ03LT from NXP Semiconductors (formerly Philips Semiconductors) is a logic-level N-channel TrenchMOS™ power MOSFET in DPAK (SOT428) package, rated for 25 V VDS, 75 A continuous drain current at Tmb = 25 °C, and 6.7 mΩ typical RDS(on) at VGS = 5 V. It serves as a high-efficiency synchronous rectifier or main switch in low-voltage DC-DC converters and switch-mode power supplies.

For engineers reviewing the PHD108NQ03LT datasheet, PHD108NQ03LT pinout, PHD108NQ03LT application, or PHD108NQ03LT equivalent, key selection criteria include its logic-level gate drive compatibility (VGS(th) = 1.5 V typ), low Qgd (5.6 nC), avalanche ruggedness (180 mJ), and thermal resistance Rth(j-mb) = 0.8 K/W - critical for high-current, thermally constrained board designs.

Technical Context

This device employs TrenchMOS™ technology to achieve very low on-state resistance and low gate charge. Its gate-source threshold voltage of 1.5 V (typ) enables direct drive from 3.3 V or 5 V logic without level shifting, while its 25 V drain-source rating targets 12 V and 24 V input systems.

The mounting base is internally connected to the drain terminal, enabling low-inductance thermal and electrical connection to heatsinks or PCB copper planes. Its safe operating area supports peak drain currents up to 240 A with pulse width ≤10 µs, and it features an integrated source-drain diode with 34 ns reverse recovery time and 21 nC recovered charge.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 25 V - Maximum DC drain-source voltage; defines use in ≤24 V bus systems.
ID (continuous) 75 A at Tmb = 25 °C - Sustained current capability with adequate heatsinking.
RDS(on) 6.7 mΩ (typ) at VGS = 5 V, Tj = 25 °C - Enables <1 W conduction loss at 40 A.
Qgd 5.6 nC (typ) - Low Miller charge reduces switching losses and improves gate drive efficiency.
Rth(j-mb) 0.8 K/W - Junction-to-mounting-base thermal resistance; enables high-power dissipation with minimal ΔT.
EDS(AL)S 180 mJ - Non-repetitive avalanche energy; supports inductive load switching without external snubbers.
VGS(th) 1.5 V (typ) - Logic-level threshold ensures full enhancement with 3.3 V microcontroller outputs.

Pinout & Package

PHD108NQ03LT uses the DPAK (SOT428) plastic surface-mount package with three leads (one lead cropped). The mounting base is electrically connected to the drain and serves as the primary thermal path.

Pin/Terminal Circuit Role Design Meaning
1 Gate (G) Control terminal; requires ≤±20 V gate-source voltage; low 1.2 Ω gate resistance minimizes RC delay.
2 Drain (D) Main power output terminal; internally bonded to mounting base for low-inductance, high-current return path.
3 Source (S) Power reference node; forms common return for gate drive and load current; connects to system ground plane.
Mounting base Drain (D) Electrically and thermally tied to pin 2; must be soldered to large copper area or heatsink for thermal management.

Key Features

Feature Design Value
Logic-level gate drive VGS(th) = 1.5 V (typ); enables direct interface with 3.3 V/5 V controllers without gate drivers.
Ultra-low RDS(on) 6.7 mΩ at 5 V drive - reduces conduction losses by >30% vs. standard 25 V MOSFETs in same package.
Low Qgd 5.6 nC - minimizes Miller-induced switching delay and dv/dt-induced turn-on risk in hard-switched topologies.
Avalanche-rated 180 mJ non-repetitive energy - withstands inductive kickback in motor drives and SMPS without clamping circuits.
Lead-free construction RoHS-compliant materials and finish - meets industrial and automotive environmental compliance requirements.

Applications

DC-DC Converter Secondary Side 12 V Input Switch-Mode PSU

Use Scenario: High-current synchronous rectification in isolated 12 V → 3.3 V/5 V buck-derived converters for telecom and server power.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode; switched complementary to primary-side FET.

Use Value: Reduces forward voltage drop from ~0.5 V to <50 mV at 50 A, cutting conduction losses by >70% and improving efficiency by 2–3%.

Use Scenario: Primary-side high-side switch in 12 V input, 200 W open-frame AC-DC adapter with active PFC front-end.

IC Role / Device Role / Timing Role: Main switching transistor in LLC resonant half-bridge; driven by gate driver IC at 200–500 kHz.

Use Value: 6.7 mΩ RDS(on) and 16.3 nC total gate charge enable <1.2 W switching + conduction loss at 200 kHz/50 A, supporting compact heatsink design.

Automotive Body Control Module Industrial Motor Drive H-Bridge

Use Scenario: Load switch for 12 V battery-fed actuators (e.g., window lift, seat adjust) with overcurrent and thermal protection.

IC Role / Device Role / Timing Role: High-side power switch controlled via microcontroller GPIO; operated in linear or saturated mode.

Use Value: 75 A DC rating and 240 A pulsed capability support stall-current surges; 1.5 V VGS(th) ensures reliable turn-on even under cold-cranking (6.5 V battery).

Use Scenario: Low-side switch in 24 V brushed DC motor H-bridge for factory automation conveyors.

IC Role / Device Role / Timing Role: PWM-controlled power stage element; commutated at 10–20 kHz with dead-time control.

Use Value: 34 ns trr and 21 nC Qr minimize shoot-through risk and body-diode conduction loss during freewheeling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STL110N3LLH6 25 V, 110 A, RDS(on) = 4.5 mΩ @ 10 V; SO-8FL package; higher current but requires 10 V gate drive for optimal RDS(on). Better conduction loss at high VGS; unsuitable for 3.3 V-only drive due to VGS(th) = 2.0 V min. Select when gate drive ≥10 V is available and board space allows SO-8FL footprint.
IRL3803PBF 30 V, 140 A, RDS(on) = 6.0 mΩ @ 5 V; TO-220AB package; higher voltage rating but larger through-hole footprint. Wider VDS margin (30 V) suits 24 V systems with transients; not surface-mount compatible with DPAK layout. Select for 24 V industrial systems needing transient headroom and through-hole assembly.

Compared with STL110N3LLH6 and IRL3803PBF, PHD108NQ03LT offers optimal balance of logic-level drive, DPAK surface-mount compatibility, and 25 V rating for cost-sensitive 12 V DC-DC and PSU designs - delivering lowest gate drive complexity without sacrificing thermal performance or avalanche robustness.

Availability

PHD108NQ03LT is available at Aetrix Electronics and suitable for DC-DC converters, switch-mode power supplies, and automotive body electronics requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for PHD108NQ03LT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips Semiconductors in 2006, specializing in high-performance analog, logic, and power devices for automotive, industrial, and consumer markets.

PHD108NQ03LT belongs to NXP's TrenchMOS™ logic-level power MOSFET product line, designed specifically for high-efficiency, low-voltage switching applications where gate drive simplicity, thermal performance, and ruggedness are critical.

FAQ

What is the maximum continuous drain current for PHD108NQ03LT at 100 °C mounting base temperature?

The PHD108NQ03LT supports 75 A continuous drain current at Tmb = 100 °C with VGS = 5 V, as specified in Table 3 of the datasheet. This rating assumes proper thermal management via the mounting base and accounts for RDS(on) increase at elevated temperature - no derating is required between 25 °C and 100 °C mounting base conditions.

Is PHD108NQ03LT suitable for 3.3 V microcontroller gate drive without a level shifter?

Yes, PHD108NQ03LT is explicitly designed for logic-level operation: its typical gate-source threshold voltage is 1.5 V, and it achieves full enhancement with 3.3 V gate drive, delivering 6.7 mΩ RDS(on) at 25 A. This eliminates the need for external level shifters or gate driver ICs in 3.3 V control architectures.

Does PHD108NQ03LT have an integrated body diode, and what are its key parameters?

Yes, PHD108NQ03LT includes an integrated source-drain diode. Key parameters include 75 A DC forward current rating, 240 A peak forward current, 0.86 V typical forward voltage at 25 A, 34 ns reverse recovery time, and 21 nC recovered charge - making it suitable for synchronous rectification and freewheeling in hard-switched topologies.

What is the thermal resistance from junction to mounting base for PHD108NQ03LT?

The PHD108NQ03LT has a maximum thermal resistance of Rth(j-mb) = 0.8 K/W from junction to mounting base, as stated in Table 4. This value enables efficient heat transfer to external heatsinks or PCB copper planes, supporting up to 187 W total power dissipation at Tmb = 25 °C.

Can PHD108NQ03LT be used in avalanche-mode switching applications?

Yes, PHD108NQ03LT is rated for non-repetitive drain-source avalanche energy of 180 mJ under defined test conditions (ID = 43 A, tp = 0.25 ms, VDD ≤25 V). This ruggedness supports reliable operation in inductive switching applications such as motor drives and flyback converters without external avalanche clamping.

PHD108NQ03LT,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
TrenchMOS™
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
25 V
Current - Continuous Drain (Id) @ 25°C:
75A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
5V, 10V
Rds On (Max) @ Id, Vgs:
6mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
16.3 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1375 pF @ 12 V
FET Feature:
-
Power Dissipation (Max):
187W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DPAK

PHD108NQ03LT,118 FAQ

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Please submit a Request for Quotation (RFQ) for PHD108NQ03LT,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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6.How does Aetrix verify that PHD108NQ03LT,118 is sourced from the original manufacturer or authorized distributors?

All PHD108NQ03LT,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHD108NQ03LT,118 meets industry standards.

7.What is the process for return or replacement of PHD108NQ03LT,118?

All PHD108NQ03LT,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHD108NQ03LT,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PHD108NQ03LT,118 part is unused and in its original packaging.

Return procedure for PHD108NQ03LT,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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