NXP Semiconductors PHD16N03LT,118
- Part No.:
- PHD16N03LT,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PHD16N03LT,118.pdf
- Description:
- MOSFET N-CH 30V 16A DPAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHD16N03LT from NXP Semiconductors (formerly Philips) is a logic-level N-channel TrenchMOS™ power MOSFET in SOT428 (D-PAK) package, rated for 30 V VDS, 16 A ID (Tmb = 25 °C), 67 mΩ RDS(on) at VGS = 10 V, and 32.6 W Ptot. It serves as a low-side switching element in DC-to-DC converters and general-purpose load control circuits where gate drive compatibility with 3.3 V/5 V logic is required.
For engineers reviewing the PHD16N03LT datasheet, PHD16N03LT pinout, PHD16N03LT application, or PHD16N03LT equivalent, key selection criteria include its logic-level VGS(th) (1–2 V), fast switching performance (td(on) = 8 ns, tf = 5 ns), thermal resistance to mounting base (Rth(j-mb) = 4.6 K/W), and robust SOA for pulsed operation up to 32 A.
Technical Context
This device employs TrenchMOS™ technology to achieve low RDS(on) while maintaining stable threshold voltage across temperature (VGS(th) = 0.5–2.2 V from −55 °C to +175 °C). Its gate charge profile (Qg(tot) = 8.5 nC, Qgd = 2 nC) supports efficient high-frequency switching in synchronous buck stages.
The integrated source-drain diode exhibits VSD = 0.98–1.2 V at IS = 10 A and is rated for 16 A continuous forward current. Thermal design centers on the mounting base (MB), which is electrically connected to the drain and provides the primary heat path with Rth(j-mb) = 4.6 K/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines upper limit of input/output rail voltage in switch-mode applications. |
| ID (DC) | 16 A at Tmb = 25 °C - Continuous current capability when mounted on heatsink; derates to 11.3 A at Tmb = 100 °C. |
| RDS(on) | 50–67 mΩ at VGS = 10 V, Tj = 25 °C - On-resistance directly determines conduction loss and junction temperature rise under load. |
| VGS(th) | 1–2 V at Tj = 25 °C - Logic-level threshold enables full enhancement with 3.3 V or 5 V gate drive without level-shifting. |
| Qg(tot) | 8.5 nC - Total gate charge dictates driver strength requirement and switching energy loss in hard-switched topologies. |
| Rth(j-mb) | 4.6 K/W - Thermal resistance from junction to mounting base; enables direct heatsink attachment for high-power dissipation. |
| tf | 5 ns - Fall time at VDD = 15 V, RG = 5.6 Ω; critical for minimizing turn-off losses in high-frequency converters. |
Pinout & Package
SOT428 (D-PAK) plastic surface-mount package with three leads (one lead cropped); mounting base (MB) is integral to the package and electrically connected to the drain terminal. The package measures 10.4 × 6.73 × 2.55 mm (L × W × H) and is optimized for PCB heatsinking via the exposed drain pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control electrode; requires ≤±15 V gate-source voltage; low input capacitance (Ciss = 210 pF) eases driver design. |
| 2 | Drain (D) | Main current-carrying terminal; internally bonded to mounting base (MB); not accessible externally per datasheet note [1]. |
| 3 | Source (S) | Reference node for gate drive and current return path; forms common connection point with driver ground in low-side configurations. |
| MB | Mounting Base (Drain) | Exposed copper pad on underside; electrically tied to drain; primary thermal interface to heatsink or copper pour. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate threshold | VGS(th) = 1–2 V enables direct drive from microcontrollers and PWM controllers operating at 3.3 V or 5 V. |
| Low RDS(on) at 4.5 V | 76–100 mΩ at VGS = 4.5 V ensures usable on-state performance even with marginal gate drive headroom. |
| Fast switching speed | 8 ns turn-on delay and 5 ns fall time reduce switching losses in DC-DC converters operating above 100 kHz. |
| Robust safe operating area | Supports 32 A peak drain current (tp ≤ 10 µs) and withstands avalanche energy in inductive load switching. |
| Integrated source-drain diode | Rated for 16 A continuous forward current with VSD = 0.98–1.2 V; suitable for freewheeling in non-synchronous topologies. |
Applications
| DC-DC Buck Converter | Motor Drive Half-Bridge |
|---|---|
Use Scenario: High-efficiency 12 V input to 3.3 V/5 V output step-down converter in embedded power supplies. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET controlled by PWM controller's phase-output signal. Use Value: 67 mΩ RDS(on) minimizes conduction loss at 10–15 A loads; logic-level gate allows direct interface with controller's 5 V gate driver output. |
Use Scenario: 24 V brushed DC motor control in industrial actuators with PWM-based speed regulation. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration, commutated at 20–50 kHz. Use Value: Fast tf = 5 ns and low Qgd = 2 nC reduce cross-conduction losses; 32 A peak rating handles motor stall currents. |
| LED Constant-Current Driver | Hot-Swap Load Switch |
Use Scenario: Dimmable LED string driver using constant-current buck topology with analog/PWM dimming. IC Role / Device Role / Timing Role: Power switch modulating average current through high-brightness LEDs. Use Value: Stable RDS(on) over temperature ensures consistent current regulation; low VGS(th) simplifies gate bias network. |
Use Scenario: Inrush-limited 12 V board-level power distribution with fault protection and soft-start. IC Role / Device Role / Timing Role: Main pass element in discrete hot-swap circuit with external current-sense and gate control. Use Value: 30 V VDS rating accommodates 12 V rail plus transients; MB-connected drain simplifies Kelvin sensing of load current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP16NF03L | Same VDS (30 V), higher RDS(on) (80 mΩ typ), TO-220 package, no mounting-base thermal path. | Requires external heatsink; less suitable for space-constrained SMT designs needing low-profile thermal management. | Select when through-hole assembly is preferred and PCB heatsinking is impractical. |
| IRLZ34NPBF | Same VDS (30 V), slightly higher RDS(on) (55 mΩ typ at VGS = 10 V), TO-220AB package, higher Rth(j-a). | Lacks integrated mounting base; thermal performance relies on case-to-heatsink interface rather than direct PCB copper coupling. | Choose when legacy TO-220 footprint compatibility is required and thermal budget permits higher junction rise. |
Compared with STP16NF03L and IRLZ34NPBF, PHD16N03LT offers superior thermal coupling via its D-PAK mounting base and lower RDS(on), enabling higher power density in compact SMT power stages without external heatsinks.
Availability
PHD16N03LT is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, LED drivers, and hot-swap load switches requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and embedded programs.
Supply support for PHD16N03LT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' semiconductor division.
The PHD16N03LT belongs to NXP's TrenchMOS™ logic-level power MOSFET family, engineered for high-efficiency, low-voltage switching in space- and thermally constrained power conversion systems.
FAQ
What is the maximum gate-source voltage rating for PHD16N03LT?
The PHD16N03LT has a maximum gate-source voltage (VGS) rating of ±15 V, as specified in the Absolute Maximum Ratings table. Exceeding this value risks permanent gate oxide damage. For reliable operation, gate drive circuits should be clamped to stay within this range, especially during transient conditions or when using bootstrap gate drivers in high-side configurations.
Can PHD16N03LT be used in a high-side switch configuration?
No - PHD16N03LT is an N-channel MOSFET with its mounting base tied to the drain, making it unsuitable for standard high-side switching without a floating gate driver. Its logic-level threshold and low RDS(on) are optimized for low-side use, such as synchronous rectification or ground-referenced load control. For high-side applications, a P-channel device or N-channel with isolated gate drive is required.
What is the thermal resistance from junction to mounting base for PHD16N03LT?
The PHD16N03LT has a maximum thermal resistance from junction to mounting base (Rth(j-mb)) of 4.6 K/W, as stated in Table 4. This value assumes proper soldering of the mounting base to a sufficiently sized copper area or heatsink. Effective thermal design must account for solder voiding, interface material, and PCB copper thickness to approach this spec.
Does PHD16N03LT have avalanche capability?
The PHD16N03LT datasheet does not specify rated single-pulse avalanche energy (EAS) or repetitive avalanche characteristics. While the device can withstand limited unclamped inductive switching events due to its SOA, it is not characterized or guaranteed for avalanche operation. Designers should implement snubbers or clamp circuits to avoid relying on untested avalanche behavior in PHD16N03LT.
Is PHD16N03LT RoHS compliant?
Yes - PHD16N03LT was manufactured under Philips' RoHS-compliant processes prior to the 2004 datasheet release, and NXP maintains compliance for legacy parts through controlled material declarations. Aetrix Electronics supplies only RoHS-compliant versions of PHD16N03LT, verified via lot-level material documentation and supplier certification.
PHD16N03LT,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 67mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 8.5 nC @ 10 V
- Vgs (Max):
- ±15V
- Input Capacitance (Ciss) (Max) @ Vds:
- 210 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 32.6W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PHD16N03LT,118 FAQ
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6.How does Aetrix verify that PHD16N03LT,118 is sourced from the original manufacturer or authorized distributors?
All PHD16N03LT,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHD16N03LT,118 meets industry standards.
7.What is the process for return or replacement of PHD16N03LT,118?
All PHD16N03LT,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHD16N03LT,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHD16N03LT,118 part is unused and in its original packaging.
Return procedure for PHD16N03LT,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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