NXP Semiconductors PHD45N03LTA,118
- Part No.:
- PHD45N03LTA,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PHD45N03LTA,118.pdf
- Description:
- MOSFET N-CH 25V 40A DPAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHD45N03LTA from NXP Semiconductors (formerly Philips) is an N-channel logic-level TrenchMOS™ power MOSFET in SOT428 (D-PAK) package, rated for 25 V VDS, 40 A ID (DC, Tmb = 25 °C), and 65 W Ptot. It delivers low RDS(on) of 17.5 mΩ (typ, VGS = 5 V, ID = 25 A, Tj = 25 °C) and supports fast switching in high-frequency DC–DC converters on computer motherboards.
For engineers reviewing the PHD45N03LTA datasheet, PHD45N03LTA pinout, PHD45N03LTA application, or PHD45N03LTA equivalent, this page provides verified pin configuration, thermal resistance (Rth(j-mb) = 2.3 K/W), avalanche energy rating (40 mJ), gate charge (Qg(tot) = 19 nC), and diode forward voltage (VSD = 0.95 V typ at IS = 25 A).
Technical Context
This device uses TrenchMOS™ technology to achieve low on-resistance with logic-level gate drive compatibility (VGS(th) = 1.5 V typ, operational down to 3.5 V). Its RDS(on) remains stable across temperature (30 mΩ max at Tj = 175 °C), and it features integrated source-drain diode with 0.95 V forward drop at 25 A.
The PHD45N03LTA operates within a junction temperature range of −55 °C to +175 °C and exhibits robust unclamped inductive avalanche capability (EDS(AL)S = 40 mJ). Its dynamic parameters-Qgd = 8–11 nC, Ciss = 700 pF, td(on) = 10–20 ns-support high-efficiency synchronous rectification and PWM control in compact power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V - Maximum continuous drain-source blocking voltage; defines safe operation in ≤24 V rail systems. |
| ID (DC) | 40 A at Tmb = 25 °C - Continuous current handling capacity with heatsink mounting; derates to 30 A at Tmb = 100 °C. |
| RDS(on) | 17.5 mΩ (typ, VGS = 5 V, ID = 25 A, Tj = 25 °C) - Enables <1 W conduction loss at 25 A, critical for efficiency in motherboard VRMs. |
| Qg(tot) | 19 nC - Total gate charge determines driver strength requirement; enables efficient 500 kHz+ switching with moderate gate drivers. |
| Rth(j-mb) | 2.3 K/W - Thermal resistance from junction to mounting base; allows direct heatsink attachment without PCB copper pour dependency. |
| VGS(th) | 1.5 V (typ, Tj = 25 °C) - Threshold voltage ensures full enhancement with standard 3.3 V or 5 V logic-level gate drive. |
| EDS(AL)S | 40 mJ - Non-repetitive avalanche energy rating; supports reliable operation under inductive turn-off stress in DC–DC converters. |
Pinout & Package
SOT428 (D-PAK) package with isolated mounting base connected internally to drain (pin 2); pin 2 is not externally accessible in SOT428 per datasheet note [1]. Mounting base serves as primary thermal path and electrical connection to drain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control terminal; accepts logic-level voltage (3.5–5 V) to fully enhance MOSFET with minimal drive power. |
| 2 | Drain (D) | Internally connected to mounting base; not accessible externally in SOT428 - requires heatsink connection for both thermal and electrical drain path. |
| 3 | Source (S) | Power return node; referenced to system ground in low-side switch configurations; carries full load current. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS = 3.5 V (RDS(on) = 22 mΩ typ), enabling direct interface with 3.3 V microcontrollers or PWM controllers. |
| Low RDS(on) at 5 V drive | 17.5 mΩ typical at VGS = 5 V ensures <1.1 W conduction loss at 25 A, reducing thermal burden in space-constrained VRMs. |
| Integrated source-drain diode | VSD = 0.95 V typ at 25 A enables synchronous rectification or freewheeling without external diode in buck converters. |
| Avalanche-rated | 40 mJ unclamped inductive avalanche energy supports robustness against voltage spikes during switch-off in inductive loads. |
| Thermal performance | Rth(j-mb) = 2.3 K/W allows >25 W dissipation with modest heatsink, eliminating need for large PCB copper areas in D-PAK layout. |
Applications
| Computer Motherboard VRM | Point-of-Load Converter |
|---|---|
Use Scenario: High-frequency (300–1000 kHz) buck converter supplying CPU core voltage (0.8–1.5 V) from 12 V or 5 V input. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET, commutating current through output inductor during PWM off-time. Use Value: 17.5 mΩ RDS(on) at 5 V gate drive minimizes conduction loss while fast switching (tf = 40–60 ns) reduces transition losses at high frequency. |
Use Scenario: Compact 12 V-to-3.3 V/5 V DC–DC module powering FPGA I/O banks or memory interfaces on industrial PCBs. IC Role / Device Role / Timing Role: Primary power switch in non-isolated buck regulator, driven by dedicated controller IC with 5 V gate output. Use Value: Logic-level compatibility eliminates level-shifter requirement; 40 A DC rating supports peak currents up to 160 A (pulsed), accommodating transient load steps. |
| Server Power Supply ORing | Industrial Motor Driver Half-Bridge |
Use Scenario: ORing diode replacement in redundant 12 V server backplane supplies to reduce voltage drop and heat generation. IC Role / Device Role / Timing Role: Active ORing FET configured in ideal diode topology, controlled by dedicated ORing controller. Use Value: VSD = 0.95 V forward drop replaced by <0.5 V effective drop (I × RDS(on)), cutting conduction loss by >50% vs. Schottky diode. |
Use Scenario: Low-voltage (≤24 V) half-bridge stage driving brushed DC motors or stepper coil windings in factory automation equipment. IC Role / Device Role / Timing Role: High-side or low-side switch in H-bridge, operated with bootstrap or isolated gate drive depending on position. Use Value: Avalanche ruggedness (40 mJ) tolerates inductive kickback during PWM commutation; 175 °C Tj rating supports operation in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PBF | RDS(on) = 6.0 mΩ (VGS = 5 V), lower than PHD45N03LTA's 17.5 mΩ; TO-220AB package (SOT78), not surface-mount. | Higher current density but requires through-hole assembly and larger heatsink footprint; unsuitable for D-PAK-only layouts. | Select when board space permits TO-220 and lower RDS(on) is prioritized over package compatibility. |
| STP40NF03L | RDS(on) = 12 mΩ (VGS = 5 V); TO-220 package; lacks published avalanche energy spec; Rth(j-mb) = 2.5 K/W vs. 2.3 K/W. | Similar voltage/current rating but no documented EDS(AL)S; less thermally optimized for mounting-base-limited cooling. | Choose only if avalanche robustness is not required and thermal margin is sufficient with 0.2 K/W higher Rth. |
Compared with IRL3803PBF and STP40NF03L, PHD45N03LTA offers superior package compatibility for surface-mount high-density designs (SOT428), verified 40 mJ avalanche rating for reliability in inductive switching, and optimized thermal path (2.3 K/W) - making it preferred for motherboard VRMs and compact PoL converters where layout, ruggedness, and thermal management are co-constrained.
Availability
PHD45N03LTA is available at Aetrix Electronics and suitable for computer motherboard VRMs, point-of-load DC–DC converters, and industrial motor driver half-bridges requiring stable component supply and long-term lifecycle support.
Supply support for PHD45N03LTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance analog and power semiconductor solutions, headquartered in Eindhoven, Netherlands.
The PHD45N03LTA belongs to the TrenchMOS™ logic-level FET product line, engineered specifically for high-efficiency, high-frequency switching in space-constrained power conversion systems such as computing and telecom infrastructure.
FAQ
What is the maximum continuous drain current for PHD45N03LTA at 100 °C mounting base temperature?
The PHD45N03LTA supports 30 A continuous drain current (ID) at Tmb = 100 °C with VGS = 5 V, as specified in Table 3 "Limiting values". This derating from 40 A at 25 °C reflects thermal constraints; proper heatsinking is essential to maintain safe junction temperature below 175 °C. The PHD45N03LTA datasheet Figure 2 confirms this normalized current curve.
Does PHD45N03LTA have a specified avalanche energy rating, and what are the test conditions?
Yes, PHD45N03LTA has a non-repetitive drain-source avalanche energy rating of 40 mJ (EDS(AL)S). Per Table 3, this is measured under unclamped inductive load conditions: ID = 20 A, pulse width tp = 0.1 ms, VDD = 15 V, RGS = 50 Ω, VGS = 5 V, with starting junction temperature at 25 °C. This rating validates robustness in inductive switching applications like DC–DC converters.
What is the gate-source threshold voltage range for PHD45N03LTA, and how does it vary with temperature?
The PHD45N03LTA gate-source threshold voltage (VGS(th)) ranges from 1.0 V to 2.0 V at Tj = 25 °C (typical 1.5 V), narrows to 0.5–? V at Tj = 175 °C, and extends to ≤2.3 V at Tj = −55 °C (Table 5). This negative temperature coefficient ensures stable turn-on behavior across its full −55 °C to +175 °C operating range, critical for automotive and industrial environments.
Can PHD45N03LTA be used with 3.3 V gate drive, and what is its RDS(on) under that condition?
Yes, PHD45N03LTA is explicitly characterized for 3.5 V gate drive: RDS(on) = 22 mΩ (typ) to 40 mΩ (max) at ID = 5.2 A and Tj = 25 °C (Table 2). While not tested at exactly 3.3 V, its VGS(th) of 1.5 V typ and logic-level design ensure functional enhancement at 3.3 V, though RDS(on) will be higher than at 5 V - confirm via Figure 7 in the PHD45N03LTA datasheet.
Is pin 2 of PHD45N03LTA (SOT428 package) electrically accessible for PCB routing?
No - per Section 4 "Pinning information" and footnote [1] in the PHD45N03LTA datasheet, pin 2 (drain) is not accessible in the SOT428 (D-PAK) package. It is internally connected to the mounting base, which must be soldered to a thermal pad or heatsink to establish the drain connection and provide primary thermal conduction path. External trace routing to pin 2 is physically impossible.
PHD45N03LTA,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 3.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 21mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 700 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 65W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PHD45N03LTA,118 FAQ
1.How can I place an order for PHD45N03LTA,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHD45N03LTA,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that PHD45N03LTA,118 is sourced from the original manufacturer or authorized distributors?
All PHD45N03LTA,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHD45N03LTA,118 meets industry standards.
7.What is the process for return or replacement of PHD45N03LTA,118?
All PHD45N03LTA,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHD45N03LTA,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHD45N03LTA,118 part is unused and in its original packaging.
Return procedure for PHD45N03LTA,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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