NXP Semiconductors PHD66NQ03LT,118
- Part No.:
- PHD66NQ03LT,118
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
PHD66NQ03LT,118.pdf
- Description:
- MOSFET N-CH 25V 66A DPAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHD66NQ03LT from NXP Semiconductors (formerly Philips) is a logic-level N-channel TrenchMOS™ power MOSFET in D-PAK (SOT428) package, rated for 25 V VDS, 66 A ID at VGS = 10 V, and 9.1 mΩ typical RDS(on) at Tj = 25 °C - optimized for high-efficiency DC-to-DC converters and low-voltage switching applications requiring fast turn-on with 5 V gate drive.
For engineers reviewing the PHD66NQ03LT datasheet, PHD66NQ03LT pinout, PHD66NQ03LT application, or PHD66NQ03LT equivalent, key selection criteria include its 1.5 V typical gate threshold voltage, 3.6 nC Miller charge, avalanche energy rating of 90 mJ, thermal resistance of 1.6 K/W (junction-to-mounting-base), and compatibility with surface-mount PCB layouts using standard D-PAK footprints.
Technical Context
This discrete MOSFET uses TrenchMOS™ technology to achieve low on-resistance and enhanced switching performance at logic-level gate voltages. Its gate threshold voltage range (1.0–2.0 V at 25 °C) ensures reliable turn-on with 3.3 V or 5 V microcontroller outputs, while the 1.6 K/W Rth(j-mb) enables high-power operation when mounted on thermally conductive PCB copper areas.
The device features an integrated source-drain diode with 0.95 V typical forward voltage at 25 A and 32 ns reverse recovery time, supporting synchronous rectification and freewheeling in buck converters. Its safe operating area supports pulsed drain currents up to 228 A with unclamped inductive switching capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V maximum - defines absolute upper limit for drain-source blocking in low-voltage systems like 12 V automotive or 5/3.3 V point-of-load supplies. |
| RDS(on) | 9.1 mΩ typical at VGS = 10 V, Tj = 25 °C - enables <1 W conduction loss at 30 A, critical for thermal management in compact converters. |
| VGS(th) | 1.5 V typical - guarantees full enhancement with standard 3.3 V or 5 V logic drivers without level-shifting circuitry. |
| Qgd | 3.6 nC typical - low Miller charge reduces switching losses and improves controllability during hard-switching transitions. |
| EAS | 90 mJ non-repetitive avalanche energy - provides robustness against inductive switching transients in motor drives and relay control. |
| Rth(j-mb) | 1.6 K/W maximum - allows direct thermal coupling to heatsink or PCB copper, enabling >70 W continuous dissipation with proper mounting. |
| ID | 66 A DC at VGS = 10 V, Tmb = 25 °C - specifies maximum continuous current under ideal thermal conditions using mounting base as heat path. |
Pinout & Package
PHD66NQ03LT is housed in a plastic D-PAK (SOT428) surface-mount package with three leads (one lead cropped), where the mounting base is electrically connected to the drain terminal and serves as the primary thermal interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control input; requires ≤±20 V gate-source voltage; low input capacitance (860 pF Ciss) eases driver design. |
| 2 | Drain (D) | Main high-side current path; internally bonded to mounting base - must be connected to PCB copper pour for thermal and electrical integrity. |
| 3 | Source (S) | Power return node; referenced to gate drive ground; forms common node with internal body diode cathode. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | 1.5 V typical VGS(th) enables direct interfacing with 3.3 V/5 V MCUs and gate drivers without external level shifters. |
| Low RDS(on) | 9.1 mΩ @ 10 V ensures minimal I²R losses in high-current paths, reducing thermal stress in space-constrained DC-DC modules. |
| TrenchMOS™ structure | Optimized cell layout delivers superior figure-of-merit (RDS(on) × Qg) for high-frequency switching efficiency in SMPS designs. |
| Integrated body diode | 32 ns trr and 20 nC Qr support efficient freewheeling in synchronous and asynchronous buck topologies. |
| Avalanche-rated | 90 mJ EAS provides margin against voltage spikes in inductive load switching, eliminating need for external snubbers in many cases. |
Applications
| Automotive Body Control Module | Industrial DC-DC Converter |
|---|---|
|
Use Scenario: Driving 12 V solenoids, relays, and LED arrays in vehicle door modules and lighting controllers. IC Role / Device Role / Timing Role: High-side load switch controlling current flow from battery rail to actuator loads. Use Value: Low 1.5 V gate threshold ensures full turn-on with automotive MCU GPIOs; 9.1 mΩ RDS(on) minimizes voltage drop and self-heating during sustained 30–50 A pulses. |
Use Scenario: Synchronous rectifier in 5 V/12 V input, 3.3 V/1.8 V output buck converter for industrial PLC I/O modules. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction loss and improve efficiency. Use Value: 32 ns reverse recovery time and low Qgd enable clean commutation at 300–500 kHz; mounting base thermal path sustains >40 W dissipation. |
| Server Point-of-Load Regulator | Consumer Power Bank Switching Circuit |
|
Use Scenario: High-current power stage in multiphase VRM supplying CPU/GPU core voltage (0.8–1.2 V @ up to 100 A). IC Role / Device Role / Timing Role: Low-side power switch in interleaved buck phase leg, driven by dedicated gate driver IC. Use Value: 66 A ID rating and 1.6 K/W Rth(j-mb) allow parallel operation with minimal derating; tight VGS(th) distribution ensures consistent channel activation across phases. |
Use Scenario: Input protection and load switching in portable USB-C PD power banks handling 20 V/5 A input and dual-battery charging. IC Role / Device Role / Timing Role: Reverse-polarity and overcurrent protection switch placed between input port and battery management system. Use Value: 25 V VDS rating safely covers USB PD 20 V max; low 10.5 mΩ max RDS(on) limits voltage drop and heat generation during 5 A continuous operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP66NF03L | 25 V VDS, 60 A ID, 10 mΩ RDS(on), TO-220 package - higher Rth(j-a) (62 K/W) and through-hole mounting. | Requires heatsink and through-hole assembly; less suitable for high-density SMT designs but offers easier prototyping and thermal testing. | Select STP66NF03L when board-level thermal management is constrained and manual heatsinking is acceptable. |
| IRLZ44NPBF | 55 V VDS, 49 A ID, 22 mΩ RDS(on), TO-220 - higher voltage rating but double the on-resistance and larger footprint. | Better suited for 24–48 V systems; not recommended for 12 V/5 V high-current applications due to excessive conduction loss. | Choose IRLZ44NPBF only if system voltage exceeds 25 V or legacy TO-220 layout reuse is mandatory. |
Compared with STP66NF03L and IRLZ44NPBF, PHD66NQ03LT delivers lower RDS(on) and superior thermal performance in SMT form factor, making it optimal for compact, high-efficiency 12 V and lower DC-DC stages where mounting base thermal coupling is leveraged.
Availability
PHD66NQ03LT is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC-DC converters, and server point-of-load regulators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from original manufacturer channels.
Supply support for PHD66NQ03LT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors, headquartered in Eindhoven, Netherlands, is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The PHD66NQ03LT belongs to NXP's legacy TrenchMOS™ logic-level power MOSFET family, engineered specifically for high-current, low-voltage switching in space- and thermally-constrained power conversion systems.
FAQ
What is the maximum continuous drain current for PHD66NQ03LT at 100 °C mounting base temperature?
The PHD66NQ03LT supports 45 A continuous drain current at Tmb = 100 °C and VGS = 10 V, as specified in Table 3 of the datasheet. This derated value reflects thermal limitations under real-world PCB mounting conditions and must be used for thermal design validation - not the 66 A rating, which applies only at 25 °C mounting base temperature.
Does PHD66NQ03LT have a built-in body diode, and what are its key parameters?
Yes, PHD66NQ03LT integrates a source-drain body diode with 0.95 V typical forward voltage at 25 A and 32 ns reverse recovery time (trr). These values, confirmed in Table 5, enable effective freewheeling in buck converters and reduce need for external diodes - especially valuable in synchronous rectifier configurations where fast recovery minimizes switching loss.
Can PHD66NQ03LT be driven directly by a 3.3 V microcontroller GPIO without a gate driver?
Yes, PHD66NQ03LT has a 1.5 V typical gate threshold voltage (VGS(th)) and is explicitly designed as a logic-level MOSFET. At 3.3 V gate drive, it achieves sufficient enhancement for moderate-current switching (e.g., <15 A), though full 66 A capability requires ≥5 V gate voltage per datasheet Figure 2 and Table 5 RDS(on) test conditions.
What is the thermal resistance from junction to mounting base (Rth(j-mb)) for PHD66NQ03LT, and how is it used in thermal design?
The PHD66NQ03LT has a maximum Rth(j-mb) of 1.6 K/W, as stated in Table 4. This parameter quantifies thermal conduction from silicon die to the exposed mounting base - the primary heat path in SOT428 packages. Engineers use it with measured or estimated mounting base temperature to calculate junction temperature: Tj = Tmb + (Pdiss × Rth(j-mb)).
Is PHD66NQ03LT suitable for avalanche operation, and what is its rated energy?
Yes, PHD66NQ03LT is avalanche-rated with a non-repetitive drain-source avalanche energy (EAS) of 90 mJ under specified test conditions (ID = 43 A, tp = 0.15 ms, VDD ≤25 V). This rating, documented in Table 3, confirms ruggedness against inductive switching transients - essential for relay driving, motor control, and other inductive load applications where voltage spikes occur.
PHD66NQ03LT,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 66A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 10.5mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 12 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 860 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 93W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
PHD66NQ03LT,118 FAQ
1.How can I place an order for PHD66NQ03LT,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHD66NQ03LT,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that PHD66NQ03LT,118 is sourced from the original manufacturer or authorized distributors?
All PHD66NQ03LT,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHD66NQ03LT,118 meets industry standards.
7.What is the process for return or replacement of PHD66NQ03LT,118?
All PHD66NQ03LT,118 units undergo pre-shipment inspection (PSI). If there is an issue with PHD66NQ03LT,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHD66NQ03LT,118 part is unused and in its original packaging.
Return procedure for PHD66NQ03LT,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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