Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Nexperia USA Inc. PHKD6N02LT,518

Part No.:
PHKD6N02LT,518
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixPHKD6N02LT,518.pdf
Description:
MOSFET 2N-CH 20V 10.9A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,474

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

PHKD6N02LT from Nexperia is a dual N-channel TrenchMOS logic-level power FET in SO8 (SOT96-1) package, designed for high-efficiency DC-DC conversion and battery management. It delivers 10.9 A continuous drain current at 25 °C, 20 V drain-source rating, and 16–20 mΩ RDS(on) at VGS = 5 V and Tj = 25 °C, enabling compact synchronous buck stages in portable computing power rails.

For engineers reviewing the PHKD6N02LT datasheet, PHKD6N02LT pinout, PHKD6N02LT application, or PHKD6N02LT equivalent, this device is selected for dual-channel logic-level switching where low gate-threshold compatibility (VGS(th) = 0.5–1.5 V), tight thermal resistance (Rth(j-sp) = 30 K/W), and integrated source-drain diode recovery (trr = 40 ns) are critical to system efficiency and layout density.

Technical Context

This dual N-channel FET integrates two independent trench-based MOSFETs in a single SO8 package, sharing no internal connection between channels - each has dedicated gate, source, and drain terminals. Its logic-level drive capability (VGS(th) ≤ 1.5 V, fully enhanced at VGS = 2.5 V) allows direct interface with 3.3 V or 5 V microcontrollers without level-shifting circuitry.

The device employs TrenchMOS technology to achieve low RDS(on) while maintaining robust safe operating area (SOA) up to 44 A peak pulsed current and 20 V VDS. Thermal design is supported by a defined junction-to-solder-point path (Rth(j-sp) = 30 K/W), enabling accurate PCB thermal modeling for high-power-density applications.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 20 V maximum - supports input rails up to 18 V in DC-DC converters with margin for transients
ID (continuous) 10.9 A at Tsp = 25 °C - enables 12 W+ output power per channel with standard PCB copper
RDS(on) 16–20 mΩ at VGS = 5 V, Tj = 25 °C - reduces conduction loss to <1 W at 7 A, improving thermal headroom
QGD 6 nC - limits Miller-induced switching delay and gate drive power in high-frequency (>500 kHz) topologies
trr 40 ns - minimizes body-diode reverse recovery loss during synchronous rectification
Rth(j-sp) 30 K/W - enables precise junction temperature estimation using solder point thermocouple measurement

Pinout & Package

PHKD6N02LT uses the SOT96-1 (SO8) plastic small-outline package, 8-lead, 3.9 mm body width, with exposed drain pads for thermal performance. Pin numbering follows standard SO8 orientation (pin 1 index corner).

Pin/Terminal Circuit Role Design Meaning
1 S1 Source terminal of Channel 1 - connects to low-side return path; electrically isolated from S2
2 G1 Gate terminal of Channel 1 - requires <1.5 V threshold to initiate conduction; driven independently
3 S2 Source terminal of Channel 2 - separate return node; enables dual independent half-bridges or load switches
4 G2 Gate terminal of Channel 2 - fully decoupled from G1; supports asynchronous or complementary control
5, 6 D2 Drain terminal of Channel 2 - internally paralleled pins (pins 5 & 6) reduce package inductance and improve current sharing
7, 8 D1 Drain terminal of Channel 1 - internally paralleled pins (pins 7 & 8) provide low-inductance high-current path

Key Features

Feature Design Value
Logic-level gate drive Operates fully enhanced at VGS = 2.5 V - eliminates need for gate driver ICs in 3.3 V systems
Dual independent channels No internal connection between G1/S1/D1 and G2/S2/D2 - supports asymmetric topologies like dual-phase buck or dual load switch
Low RDS(on) at 5 V drive 16–20 mΩ ensures <0.5 W conduction loss at 5 A - reduces heatsink requirements in space-constrained notebooks
Fast body diode recovery trr = 40 ns and Qr = 7 nC - lowers switching loss in synchronous rectifier mode versus standard Schottky alternatives
Thermally optimized SO8 Rth(j-sp) = 30 K/W - enables direct thermal coupling to inner-layer copper planes for reliable 10.9 A operation

Applications

Battery Charger Output Stage DC-DC Synchronous Buck Converter

Use Scenario: Dual-channel load switching in multi-cell lithium-ion charger IC reference designs, managing charge path and system power path.

IC Role / Device Role: High-side and low-side power switch controlling battery charge enable and system power routing.

Use Value: Logic-level drive allows direct MCU control; low RDS(on) minimizes voltage drop across charge path, preserving battery voltage accuracy.

Use Scenario: Dual-phase 12 V to 1.2 V VRM in ultrabook CPU power delivery, with one PHKD6N02LT per phase handling high-side and low-side switching.

IC Role / Device Role: Integrated high- and low-side N-FET pair per phase, replacing discrete dual-FET solutions.

Use Value: Matched RDS(on) and fast trr reduce shoot-through risk and body-diode loss, improving full-load efficiency by ~1.2% over discrete alternatives.

Notebook Computer Power Management Portable Equipment Load Switching

Use Scenario: Dual-rail power sequencing for GPU and SoC core domains in thin-and-light notebooks, requiring independent enable control and current limiting.

IC Role / Device Role: Dual independent load switches providing controlled inrush current and fault isolation per rail.

Use Value: Independent S1/G1/D1 and S2/G2/D2 terminals allow separate current sensing and thermal monitoring per domain without shared ground interference.

Use Scenario: USB-C PD sink power path management in portable SSDs and docking stations, switching 5–20 V input to internal 3.3 V/5 V rails.

IC Role / Device Role: Dual-channel reverse-polarity and overcurrent protected switch for flexible input selection and rail isolation.

Use Value: VGS(th) range (0.5–1.5 V) ensures clean turn-on at 3.3 V logic levels; low QG (15.3 nC total) enables fast enable/disable transitions under firmware control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel logic-level FET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN6016LSD-13 Single SO8 dual-N FET but with higher RDS(on) (20–25 mΩ @ 4.5 V) and no specified trr or Qr Lacks documented body-diode recovery specs - unsuitable for synchronous rectification above 300 kHz Preferable only when thermal budget permits higher conduction loss and recovery behavior is not critical
SI7850DP-T1-GE3 Higher VDS (30 V), lower RDS(on) (12 mΩ @ 4.5 V), but requires ≥3 V VGS for full enhancement Not logic-level compatible with 2.5 V GPIO - mandates gate boosting or level shifting in low-voltage MCU systems Select when 30 V rating and sub-15 mΩ RDS(on) outweigh gate drive simplicity

Compared with DMN6016LSD-13 and SI7850DP-T1-GE3, PHKD6N02LT uniquely balances logic-level drive (≤1.5 V VGS(th)), verified 40 ns trr, and SO8 dual-channel integration - making it optimal for compact, high-frequency, low-voltage synchronous converters where gate drive simplicity and body-diode performance are jointly constrained.

Availability

PHKD6N02LT is available at Aetrix Electronics and suitable for battery chargers, DC-to-DC convertors, and notebook computers requiring stable component supply and long-term industrial lifecycle support.

Supply support for PHKD6N02LT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade power semiconductors.

PHKD6N02LT belongs to Nexperia's TrenchMOS logic-level FET product line, engineered specifically for space-constrained, high-efficiency power conversion in computing and portable consumer electronics - emphasizing low gate-threshold, low RDS(on), and robust thermal performance in standard surface-mount packages.

FAQ

Is PHKD6N02LT qualified for automotive applications?

No. PHKD6N02LT is explicitly designated for computing, communications, consumer, and industrial applications only. It is not AEC-Q101 qualified, lacks automotive-grade screening, and is not tested to automotive temperature or reliability standards. Use in automotive systems requires formal qualification by the customer and carries full liability risk per Nexperia's legal disclaimers.

What is the maximum continuous drain current per channel at 100 °C solder point temperature?

At Tsp = 100 °C, the maximum continuous drain current per channel is 6.8 A, as specified in Table 4 (Limiting values). This derating reflects thermal constraints of the SO8 package and must be applied in thermal design - not the 10.9 A value rated at 25 °C.

Can the two channels share a common source connection?

No. Pins 1 (S1) and 3 (S2) are physically and electrically isolated source terminals. They are not internally connected and must be routed separately. Shared-source operation would require external PCB wiring and introduces cross-talk risk - the device is designed for independent channel control.

Does PHKD6N02LT include ESD protection on gate terminals?

Yes. The device incorporates built-in gate protection diodes, evidenced by the ±12 V absolute maximum VGS rating and IGSS leakage specification (≤100 nA at ±12 V). However, it is not rated to HBM or CDM ESD standards - external gate resistors and TVS clamping are recommended in noisy environments.

PHKD6N02LT,518 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
TrenchMOS™
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
10.9A
Rds On (Max) @ Id, Vgs:
20mOhm @ 3A, 5V
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
15.3nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds:
950pF @ 10V
Power - Max:
4.17W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

PHKD6N02LT,518 FAQ

1.How can I place an order for PHKD6N02LT,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for PHKD6N02LT,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PHKD6N02LT,518 reliable?

The price and inventory of PHKD6N02LT,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHKD6N02LT,518 is usually 5 days.

3.What payment methods are accepted for PHKD6N02LT,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PHKD6N02LT,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PHKD6N02LT,518?

PHKD6N02LT,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PHKD6N02LT,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PHKD6N02LT,518?

For technical support, including PHKD6N02LT,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PHKD6N02LT,518 requirements.

6.How does Aetrix verify that PHKD6N02LT,518 is sourced from the original manufacturer or authorized distributors?

All PHKD6N02LT,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHKD6N02LT,518 meets industry standards.

7.What is the process for return or replacement of PHKD6N02LT,518?

All PHKD6N02LT,518 units undergo pre-shipment inspection (PSI). If there is an issue with PHKD6N02LT,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PHKD6N02LT,518 part is unused and in its original packaging.

Return procedure for PHKD6N02LT,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PHKD6N02LT,518 Tags

  • PHKD6N02LT,518
  • PHKD6N02LT,518 PDF
  • PHKD6N02LT,518 Datasheet
  • PHKD6N02LT,518 Specifications
  • PHKD6N02LT,518 Images
  • Nexperia USA Inc.
  • Nexperia USA Inc. PHKD6N02LT,518
  • Buy PHKD6N02LT,518
  • PHKD6N02LT,518 Price
  • PHKD6N02LT,518 Distributor
  • PHKD6N02LT,518 Supplier
  • PHKD6N02LT,518 Wholesale
Related Products
SSM6N7002KFU,LF
SSM6N7002KFU,LF

Toshiba Semiconductor and Storage

2N7002DW-7-F
2N7002DW-7-F

Diodes Incorporated

SSM6L56FE,LM
SSM6L56FE,LM

Toshiba Semiconductor and Storage

SSM6N37FU,LF
SSM6N37FU,LF

Toshiba Semiconductor and Storage

2N7002DWH6327XTSA1
2N7002DWH6327XTSA1

Infineon Technologies

2N7002BKS,115
2N7002BKS,115

Nexperia USA Inc.

DMG1016UDW-7
DMG1016UDW-7

Diodes Incorporated

UM6K33NTN
UM6K33NTN

Rohm Semiconductor

DMG6602SVT-7
DMG6602SVT-7

Diodes Incorporated

EM6K34T2CR
EM6K34T2CR

Rohm Semiconductor

UM6K34NTCN
UM6K34NTCN

Rohm Semiconductor

DMG6601LVT-7
DMG6601LVT-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER