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NXP Semiconductors PHN203,518

Part No.:
PHN203,518
Manufacturer:
NXP Semiconductors
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixPHN203,518.pdf
Description:
MOSFET 2N-CH 30V 6.3A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,200

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Product details

Overview

PHN203 from Nexperia is a dual N-channel TrenchMOS logic-level power MOSFET in an SO8 (SOT96-1) package, designed for high-efficiency DC-to-DC conversion and lithium-ion battery protection circuits. It features 30 V VDS, 6.3 A continuous drain current at 25 °C, 24 mΩ typical RDS(on) at VGS = 10 V and 25 °C, fast switching with 5 ns turn-on delay and 3 nC QGD, and logic-level gate drive compatibility down to 4.5 V.

For engineers reviewing the PHN203 datasheet, PHN203 pinout, PHN203 application, or PHN203 equivalent, this device is selected for compact dual-FET topologies requiring low conduction loss, fast transient response, and direct microcontroller-compatible gate control in portable power systems.

Technical Context

The PHN203 integrates two independent N-channel enhancement-mode MOSFETs using TrenchMOS technology, enabling synchronous rectification and bidirectional load switching in half-bridge or dual-switch configurations. Its gate threshold voltage ranges from 0.6 V (at 150 °C) to 2.2 V (at −55 °C), ensuring reliable turn-on across industrial temperature extremes.

Static and dynamic parameters are characterized under pulsed conditions per IEC 60134 limiting values, with RDS(on) specified at both 10 V and 4.5 V gate drive, and avalanche ruggedness rated at 37.8 mJ (unclamped, 0.2 ms pulse). Thermal resistance from junction to ambient is 62.5 K/W on minimum PCB footprint.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V maximum - supports 24 V nominal input rails with 20 % margin for transients
ID (continuous)6.3 A at Tamb = 25 °C - enables ≥5 W power handling in compact SO8 layout
RDS(on)24 mΩ typ @ VGS = 10 V, 25 °C - yields <0.1 W conduction loss at 2 A load
QGD3 nC - minimizes Miller-induced switching delay in high-frequency (>500 kHz) converters
td(on)5 ns - ensures tight timing control in synchronous buck topologies
VGS(th)1.0–2.0 V @ 25 °C - guarantees full enhancement with 3.3 V or 5 V logic-level drivers
EAS37.8 mJ unclamped avalanche energy - withstands inductive kickback in battery disconnect applications

Pinout & Package

PHN203 uses the SOT96-1 (SO8) plastic small outline package, 8-lead, 3.9 mm body width, with exposed drain pads for thermal performance. Pin 1 is source1, pin 2 is gate1, pin 3 is source2, pin 4 is gate2, pins 5–6 are drain2, pins 7–8 are drain1 - enabling dual high-side or low-side switch configuration with shared drain terminals per channel.

Pin/TerminalCircuit RoleDesign Meaning
1S1Source terminal of Channel 1 - connects to ground or low-side return path
2G1Gate terminal of Channel 1 - accepts logic-level drive (≥4.5 V) for full enhancement
3S2Source terminal of Channel 2 - electrically isolated from S1; enables dual independent switches
4G2Gate terminal of Channel 2 - independently controllable; no internal gate coupling
5, 6D2Drain terminal of Channel 2 - paralleled pins reduce inductance and improve current sharing
7, 8D1Drain terminal of Channel 1 - paralleled pins support higher peak current and lower thermal resistance

Key Features

FeatureDesign Value
Logic-level gate driveOperates fully enhanced at VGS = 4.5 V, compatible with 3.3 V/5 V microcontrollers without level-shifting
TrenchMOS technologyEnables 24 mΩ RDS(on) in SO8 package - 30 % lower on-resistance vs planar MOSFETs at same die size
Dual-channel isolationIndependent gate and source terminals per channel - supports asymmetric PWM, phase-shifted control, or redundancy
Avalanche-rated37.8 mJ unclamped EAS - protects against inductive energy during hard-switching faults in battery management
Thermal robustnessRth(j-a) = 62.5 K/W on minimal PCB - sustains 2 W dissipation with ≤125 °C junction rise above ambient

Applications

DC-to-DC ConvertersLithium-ion Battery Protection

Use Scenario: Synchronous buck converter in portable USB-C PD adapters operating at 300–1000 kHz switching frequency.

IC Role / Device Role / Timing Role: Dual low-side switch replacing discrete diodes; one channel handles main output, second enables auxiliary rail or power-path arbitration.

Use Value: 24 mΩ RDS(on) reduces conduction loss by >40 % vs Schottky diode, improving efficiency from 88 % to 92 % at 2 A load.

Use Scenario: Dual-MOSFET protection circuit in 2-cell Li-ion packs (8.4 V max), guarding against overcharge, over-discharge, and short-circuit.

IC Role / Device Role / Timing Role: Independent high-side and low-side FETs configured as back-to-back switches to interrupt charge/discharge paths under fault conditions.

Use Value: Logic-level gate drive allows direct control from battery monitor ICs (e.g., BQ series) without external drivers, reducing BOM count by 2 components.

Load Switching in Industrial IoT SensorsHot-Swap Controllers for Edge Gateways

Use Scenario: Power sequencing for ultra-low-power sensor nodes (e.g., BLE + environmental sensors), where each subsystem powers up only when active.

IC Role / Device Role / Timing Role: Dual independent load switches - one controls MCU core voltage, the other manages RF transceiver supply, enabling precise power gating.

Use Value: 5 ns td(on) and 11 ns tf ensure sub-microsecond enable/disable transitions, minimizing wake-up latency and leakage during sleep states.

Use Scenario: Hot-swap insertion detection and inrush current limiting in modular edge gateway backplanes with multiple 12 V slots.

IC Role / Device Role / Timing Role: Dual-channel current-limiting switch - one channel handles primary 12 V bus, second manages auxiliary 5 V standby rail with independent fault reporting.

Use Value: 30 V VDS rating accommodates 12 V ±10 % input plus ripple and surge, while 18 A peak current supports 200 ms inrush events without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel logic-level FET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2033LSD-1330 V VDS, 5.8 A ID, 28 mΩ RDS(on) @ 4.5 V - higher on-resistance at logic drive, slightly lower current ratingOptimized for space-constrained single-channel use; lacks dual-source isolation of PHN203Select when board area is critical and dual-channel independence is not required
SI3457DV-T1-GE330 V VDS, 5.5 A ID, 26 mΩ RDS(on) @ 4.5 V - tighter VGS(th) distribution but no avalanche ratingTargeted at consumer-grade USB power delivery; not qualified for industrial temperature cyclingSelect for cost-sensitive consumer designs where avalanche robustness is not mandated

Compared with DMN2033LSD-13 and SI3457DV-T1-GE3, the PHN203 offers superior thermal robustness (62.5 K/W), verified avalanche capability (37.8 mJ), and true dual-channel electrical isolation - making it preferred for industrial battery protection and high-reliability DC-DC converters.

Availability

PHN203 is available at Aetrix Electronics and suitable for DC-to-DC converters, lithium-ion battery protection circuits, and industrial load switching applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for PHN203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions, with leadership in automotive and industrial power management.

The PHN203 belongs to Nexperia's TrenchMOS logic-level FET product line, engineered specifically for high-efficiency, space-constrained power conversion and battery management systems demanding low gate drive voltage and robust avalanche performance.

FAQ

What is the maximum continuous drain current for PHN203 at 70 °C ambient?

The PHN203 supports 5 A continuous drain current at Tamb = 70 °C, as specified in Table 4 (Limiting Values). This derating reflects thermal constraints on the SO8 package with standard PCB mounting, and aligns with the normalized current curve in Figure 1, where current drops to ~80 % of the 25 °C value.

Can PHN203 be used in a high-side switch configuration?

Yes - each channel operates as an independent N-channel MOSFET, so high-side switching is possible with appropriate gate drive (e.g., bootstrap or charge-pump circuitry). However, the device itself does not integrate level-shifting; external gate control must provide VGS ≥ 4.5 V relative to the source node, which floats in high-side operation.

Does PHN203 have integrated ESD protection on its gate terminals?

No - the datasheet does not specify built-in gate ESD protection structures. Nexperia recommends external gate resistors (≤100 Ω) and TVS diodes between gate and source for robustness in automated assembly or field environments with static discharge risk, especially given the 20 V absolute maximum VGS.

How is thermal performance affected when both channels operate simultaneously?

Simultaneous conduction increases total power dissipation and junction temperature. The 2 W Ptot rating applies to the entire package - if both channels dissipate 1 W each, junction temperature rise will exceed limits unless PCB copper area and airflow are enhanced. Derating curves in Figure 2 confirm that total power must be reduced by ~25 % at 70 °C ambient for dual-channel steady-state operation.

PHN203,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Bulk
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
6.3A (Ta)
Rds On (Max) @ Id, Vgs:
30mOhm @ 7A, 10V
Vgs(th) (Max) @ Id:
2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
14.6nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
560pF @ 20V
Power - Max:
2W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

PHN203,518 FAQ

1.How can I place an order for PHN203,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for PHN203,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PHN203,518 reliable?

The price and inventory of PHN203,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHN203,518 is usually 5 days.

3.What payment methods are accepted for PHN203,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PHN203,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PHN203,518?

PHN203,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PHN203,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PHN203,518?

For technical support, including PHN203,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PHN203,518 requirements.

6.How does Aetrix verify that PHN203,518 is sourced from the original manufacturer or authorized distributors?

All PHN203,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHN203,518 meets industry standards.

7.What is the process for return or replacement of PHN203,518?

All PHN203,518 units undergo pre-shipment inspection (PSI). If there is an issue with PHN203,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PHN203,518 part is unused and in its original packaging.

Return procedure for PHN203,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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