NXP Semiconductors PHX14NQ20T,127
- Part No.:
- PHX14NQ20T,127
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
PHX14NQ20T,127.pdf
- Description:
- MOSFET N-CH 200V 7.6A TO220F
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHX14NQ20T from NXP Semiconductors (formerly Philips Semiconductors) is an N-channel enhancement-mode TrenchMOS power transistor in SOT186A (FPAK) package, rated for 200 V drain-source voltage, 7.6 A continuous drain current at 25 °C, and ≤230 mΩ on-state resistance at VGS = 10 V and ID = 7 A. It is designed for DC–DC converters and general-purpose switching applications requiring low conduction loss and fast switching.
For engineers reviewing the PHX14NQ20T datasheet, PHX14NQ20T pinout, PHX14NQ20T application, or PHX14NQ20T equivalent, key selection considerations include its isolated heatsink mounting capability, 2500 VRMS isolation rating, avalanche energy rating of 70 mJ, and thermal resistance of 4.17 K/W junction-to-mounting-base - critical for high-reliability industrial power stages.
Technical Context
This device uses trench-gate MOSFET technology to achieve low RDS(ON) and high transconductance (gfs = 12.1 S typ). Its gate threshold voltage (VGS(TO)) ranges from 2 V to 4 V at 25 °C, with reduced hysteresis over temperature (1 V min at 150 °C).
The integrated body diode supports synchronous rectification and flyback operation, exhibiting 1.0–1.5 V forward voltage at 14 A and 135 ns reverse recovery time. Its internal drain and source inductances (Ld = 4.5 nH, Ls = 7.5 nH) are optimized for high-frequency switching stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 200 V - maximum blocking voltage before avalanche; enables use in 170 VAC mains-derived 200 V DC bus systems. |
| ID (continuous) | 7.6 A at Ths = 25 °C - defines steady-state current handling with adequate heatsinking. |
| RDS(ON) | ≤230 mΩ at VGS = 10 V, ID = 7 A - determines conduction loss (Pcond ≈ 12.2 W at full load), critical for thermal design. |
| EAS | 70 mJ non-repetitive avalanche energy - supports unclamped inductive switching without failure under defined conditions (IAS = 14 A, tp = 38 µs). |
| Rth j-hs | 4.17 K/W - thermal resistance from junction to mounting base; enables direct heatsink attachment for efficient power dissipation. |
| Visol (RMS) | 2500 V - isolation voltage between all three terminals and external heatsink; satisfies reinforced insulation requirements for industrial safety standards. |
| Qg(tot) | 38 nC - total gate charge at VDD = 160 V; determines driver strength requirement and switching loss trade-off. |
Pinout & Package
SOT186A (FPAK) is a plastic single-ended package with electrically isolated heatsink mounting plane, 3 leads, and TO-220-compatible footprint. The case (heatsink tab) is isolated from all terminals and serves as thermal interface only.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; requires ≥10 V drive for full enhancement; gate leakage <100 nA ensures low standby power. |
| 2 | Drain | High-side power node; connected to load/switching node; carries full output current and withstands 200 V. |
| 3 | Source | Reference node for gate drive; also forms cathode of integral body diode; low-inductance path critical for EMI control. |
| Case | Isolated Heatsink Interface | Electrically isolated mounting surface; enables safe thermal coupling to chassis or heatsink without shorting circuit nodes. |
Key Features
| Feature | Design Value |
|---|---|
| Trench MOSFET architecture | Enables lower RDS(ON) per die area than planar MOSFETs, improving power density in space-constrained converters. |
| Isolated heatsink mounting | Eliminates need for insulating pads or washers when mounting to grounded metal chassis, reducing thermal impedance and assembly cost. |
| Body diode with fast recovery | 135 ns trr and 690 nC Qrr support moderate-frequency hard-switched topologies without external diode. |
| Avalanche-rated operation | Guaranteed 70 mJ single-pulse avalanche energy allows robustness against inductive kickback in relay drivers or motor controls. |
| Low gate charge | 38 nC total gate charge reduces driver power consumption and enables use with low-power gate drivers in battery-powered systems. |
Applications
| Industrial DC–DC Converters | Switch-Mode Power Supplies |
|---|---|
Use Scenario: Step-down conversion from 200 V DC bus to 12 V/5 V for PLC I/O modules and sensor interfaces. IC Role / Device Role / Timing Role: Primary high-side switch in synchronous buck topology operating at 100–300 kHz. Use Value: Low RDS(ON) minimizes conduction loss at high load currents; isolated heatsink simplifies thermal management in compact enclosures. | Use Scenario: Main switching transistor in offline AC–DC adapters delivering up to 90 W output. IC Role / Device Role / Timing Role: Primary switch in flyback converter with 65–130 kHz operation and 200 V reflected output voltage. Use Value: 2500 VRMS isolation meets IEC 62368-1 reinforced insulation requirements; avalanche rating protects against transformer leakage inductance spikes. |
| Motor Drive Half-Bridge Stages | High-Voltage Relay Replacement |
Use Scenario: Low-side switch in 24–48 V brushed DC motor H-bridge for HVAC actuators and industrial valves. IC Role / Device Role / Timing Role: Fast-switching N-channel MOSFET paired with complementary high-side driver; operates with 10–20 ns dead-time. Use Value: 30 A pulsed drain current (IDM) handles motor stall surges; low Qgd/Qgs ratio improves switching controllability. | Use Scenario: Solid-state replacement for electromechanical relays in 120/240 V AC control panels. IC Role / Device Role / Timing Role: Zero-crossing–triggered or logic-controlled high-voltage switch driving resistive or inductive loads. Use Value: 200 V VDSS and 7.6 A ID support 1.8 kVA resistive loads; isolated case eliminates creepage/clearance concerns on PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP14NF20 | TO-220 package (non-isolated case); RDS(ON) = 220 mΩ; no specified isolation voltage. | Requires insulating hardware for heatsink mounting; unsuitable where reinforced insulation is mandated. | Select STP14NF20 only if board-level isolation is implemented externally and thermal budget permits higher Rth j-a. |
| IRF640NPBF | TO-220 package; VDSS = 200 V; RDS(ON) = 180 mΩ; no avalanche rating or isolation spec. | Lacks guaranteed avalanche energy and isolation - not recommended for unclamped inductive loads or safety-critical mounting. | Prefer IRF640NPBF only in cost-sensitive, non-safety-critical linear or low-duty-cycle switching where gate drive margin is ample. |
Compared with STP14NF20 and IRF640NPBF, PHX14NQ20T uniquely combines certified 2500 VRMS isolation, 70 mJ avalanche capability, and SOT186A's integrated heatsink interface - making it the only option among the three qualified for industrial power stages requiring both safety compliance and ruggedness.
Availability
PHX14NQ20T is available at Aetrix Electronics and suitable for industrial DC–DC converters, switch-mode power supplies, and motor drive half-bridge stages requiring stable component supply and long-term lifecycle assurance.
Supply support for PHX14NQ20T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions, automotive, industrial, and power management ICs.
The PHX14NQ20T belongs to NXP's TrenchMOS power transistor family, engineered for high-efficiency, high-reliability industrial switching applications where isolation, avalanche robustness, and thermal performance are critical.
FAQ
What is the maximum continuous drain current rating for PHX14NQ20T at 100 °C heatsink temperature?
The PHX14NQ20T supports 4.8 A continuous drain current at Ths = 100 °C and VGS = 10 V, as specified in the Limiting Values table. This derating reflects thermal constraints of the SOT186A package and must be applied in thermal design calculations alongside Rth j-hs = 4.17 K/W to ensure junction temperature remains below 150 °C. PHX14NQ20T datasheets confirm this value applies under steady-state conduction with proper heatsinking.
Does PHX14NQ20T have a built-in body diode, and what are its key characteristics?
Yes, PHX14NQ20T integrates a body diode with typical forward voltage of 1.0 V at 14 A and reverse recovery time of 135 ns. Its reverse recovery charge is 690 nC at VR = 30 V. These parameters are measured with VGS = 0 V and enable use in freewheeling and synchronous rectification roles without external diodes in many medium-frequency applications. PHX14NQ20T's body diode performance is fully characterized in the Reverse Diode Characteristics section.
What is the gate threshold voltage range for PHX14NQ20T across its operating temperature range?
The gate threshold voltage (VGS(TO)) of PHX14NQ20T ranges from 1 V (minimum at Tj = 150 °C) to 6 V (maximum at Tj = −55 °C), with a typical value of 3 V at 25 °C. This wide variation necessitates gate drive designs that maintain ≥10 V over temperature to ensure full enhancement and minimize RDS(ON) drift. PHX14NQ20T's VGS(TO) vs. Tj curve is provided in Figure 10 of the datasheet.
Can PHX14NQ20T be used in avalanche mode, and what are the validated limits?
Yes, PHX14NQ20T is rated for non-repetitive avalanche operation with EAS = 70 mJ and IAS = 14 A under defined test conditions (unclamped inductive load, tp = 38 µs, VDD ≤ 25 V, VGS = 10 V). These limits are verified per IEC 134 and documented in the Avalanche Energy Limiting Values table. PHX14NQ20T must not be operated repeatedly in avalanche without verifying thermal and reliability impact per application-specific stress analysis.
What is the thermal resistance from junction to ambient for PHX14NQ20T in free air?
The PHX14NQ20T has a thermal resistance of Rth j-a = 55 K/W when mounted in free air (no heatsink), as stated in the Thermal Resistances table. This value assumes standard SOT186A mounting per JEDEC guidelines and is significantly higher than the 4.17 K/W Rth j-hs, confirming that effective heatsinking is essential for sustained operation above ~1 W dissipation. PHX14NQ20T's thermal performance is validated in Figures 4 and 6 of the datasheet.
PHX14NQ20T,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 7.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 230mOhm @ 7A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 38 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1500 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 30W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220F
PHX14NQ20T,127 FAQ
1.How can I place an order for PHX14NQ20T,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHX14NQ20T,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PHX14NQ20T,127 reliable?
The price and inventory of PHX14NQ20T,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHX14NQ20T,127 is usually 5 days.
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5.How can I obtain technical support or documentation for PHX14NQ20T,127?
For technical support, including PHX14NQ20T,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PHX14NQ20T,127 requirements.
6.How does Aetrix verify that PHX14NQ20T,127 is sourced from the original manufacturer or authorized distributors?
All PHX14NQ20T,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHX14NQ20T,127 meets industry standards.
7.What is the process for return or replacement of PHX14NQ20T,127?
All PHX14NQ20T,127 units undergo pre-shipment inspection (PSI). If there is an issue with PHX14NQ20T,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHX14NQ20T,127 part is unused and in its original packaging.
Return procedure for PHX14NQ20T,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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