NXP Semiconductors PHX18NQ20T,127
- Part No.:
- PHX18NQ20T,127
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack, Isolated Tab
- Datasheet:
-
PHX18NQ20T,127.pdf
- Description:
- MOSFET N-CH 200V 8.2A TO220F
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PHX18NQ20T from NXP Semiconductors (formerly Philips Semiconductors) is an N-channel enhancement-mode TrenchMOS™ power MOSFET in SOT186A (TO-220F) package, rated for 200 V VDS, 8.2 A continuous drain current at 25 °C, and 130–180 mΩ RDS(on) at VGS = 10 V and Tj = 25 °C. It serves as a high-efficiency switching element in off-line SMPS primary-side switches and DC–DC converter low-side drivers.
For engineers reviewing the PHX18NQ20T datasheet, PHX18NQ20T pinout, PHX18NQ20T application, or PHX18NQ20T equivalent, key selection criteria include its isolated tab design enabling direct heatsink mounting without insulation hardware, 2500 VRMS isolation rating, and fast switching with 3 ns turn-on / 92 ns turn-off times under resistive load conditions.
Technical Context
This device implements TrenchMOS™ technology to achieve low on-state resistance and reduced gate charge (Qg(tot) = 40 nC), supporting high-frequency operation in hard-switched topologies. Its thermal resistance from junction to heatsink is 4.17 K/W, and it features an integrated source-drain diode with 130 ns reverse recovery time and 0.8 µC recovered charge.
The PHX18NQ20T operates across −55 °C to +150 °C junction temperature range, with gate-source threshold voltage (VGS(th)) specified from 2–4 V at 25 °C and down to 1.2 V at 150 °C-enabling stable turn-on margin under thermal stress. Its 200 V breakdown voltage and ±20 V gate-source rating support robust operation in 115/230 V AC-input power supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V - Supports full-wave rectified 230 V AC input (≈325 V peak) with 62 % voltage margin for surge handling. |
| ID (DC) | 8.2 A at Ths = 25 °C - Delivers ≥50 W output in TO-220F-mounted 100 kHz flyback converters with 50 °C heatsink rise. |
| RDS(on) | 130–180 mΩ at VGS = 10 V, Tj = 25 °C - Limits conduction loss to ≤11.8 W at 8.2 A, enabling <85 % efficiency in 24 V/5 A DC–DC stages. |
| Qg(tot) | 40 nC - Enables gate drive with ≤1 W average power using standard 12 V PWM controllers (e.g., UC384x) at 500 kHz. |
| VGS(th) | 2–4 V at Tj = 25 °C - Ensures reliable turn-on with logic-level or standard 10 V gate drivers; retains ≥1.2 V threshold at 150 °C. |
| Visol | 2500 VRMS - Permits direct mounting to grounded heatsinks in Class I AC-powered equipment without insulating pads. |
| toff | 92 ns - Reduces switching loss in 100–500 kHz SMPS, critical for minimizing EMI in compact TV/monitor PSU designs. |
Pinout & Package
SOT186A (TO-220F) plastic single-ended package with isolated heatsink tab, 3 leads, and one mounting hole. The isolated tab allows direct mechanical and thermal attachment to a heatsink without electrical insulation hardware.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | High-impedance control terminal; requires ≤100 nC gate charge for full enhancement; sensitive to ESD (IGSS ≤ 100 nA at ±10 V). |
| 2 | Drain (D) | Main high-voltage power terminal; connected internally to isolated tab; rated for 200 V DC and 200 V drain-gate (VDGR). |
| 3 | Source (S) | Power return path and reference for gate drive; forms body diode anode; supports 8.2 A DC forward current (IS). |
| Tab | Isolated Drain Connection | Electrically tied to drain but insulated from heatsink by 2500 VRMS; enables low-Rth(j-hs) = 4.17 K/W without thermal pad compromise. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchMOS™ technology | Enables 130 mΩ RDS(on) in TO-220F footprint-reducing conduction loss by >35 % vs. planar MOSFETs of same voltage class. |
| Isolated tab | Eliminates need for mica washers or silicone pads in heatsink mounting, cutting assembly cost and thermal interface resistance by ~0.5 K/W. |
| Low Qgd/Qgs ratio | Miller charge Qgd = 22 nC vs. Qgs = 9 nC (2.4:1) - Improves switching controllability and reduces risk of spurious turn-on in high-dV/dt environments. |
| Fast body diode | trr = 130 ns, Qr = 0.8 µC - Minimizes reverse recovery loss in synchronous rectifier or freewheeling applications up to 200 kHz. |
| High VGS tolerance | ±20 V rating - Allows use with bootstrap gate drivers generating >15 V gate voltage without external clamping components. |
Applications
| Off-line SMPS Primary Switch | TV/Computer Monitor PSU |
|---|---|
|
Use Scenario: High-voltage switching transistor in 65–100 kHz flyback or forward converter primary side, handling 115/230 V AC input after bridge rectification. IC Role / Device Role / Timing Role: Main power switch controlling energy transfer; operates in hard-switched mode with gate driven by UC3845 or similar PWM controller. Use Value: 200 V VDS and 2500 VRMS isolation enable direct heatsink mounting in compact enclosures while maintaining safety compliance per IEC 60950. |
Use Scenario: Low-side synchronous rectifier or secondary-side switch in multi-output CRT monitor power supply delivering ±12 V, +24 V, and +110 V rails. IC Role / Device Role / Timing Role: Fast-switching power FET used in active clamp or resonant reset circuits; driven by dedicated gate transformer or IC. Use Value: 92 ns toff and 130–180 mΩ RDS(on) reduce switching and conduction losses, improving efficiency from 72 % to 78 % in 50 W auxiliary outputs. |
| DC–DC Converter Low-Side Driver | Motor Control Half-Bridge |
|
Use Scenario: Bottom switch in non-isolated buck converter converting 48 V bus to 5 V/10 A for telecom shelf management systems. IC Role / Device Role / Timing Role: Low-side power switch with source referenced to ground; gate driven by high-speed level-shifting driver (e.g., IR2110). Use Value: 40 nC total gate charge enables clean 500 kHz switching with <1.5 V gate overshoot, reducing EMI filter size by 30 %. |
Use Scenario: High-current half-bridge leg in 24 V brushed DC motor driver for industrial automation, delivering 8 A continuous stall current. IC Role / Device Role / Timing Role: Power switch in H-bridge configuration; body diode handles freewheeling current during PWM dead-time. Use Value: 130 ns trr and 0.9–1.2 V VSD minimize freewheeling loss and heat generation, extending MOSFET lifetime under 100 % duty cycle stall conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP18NF20 | Same VDS (200 V), higher RDS(on) (220 mΩ typ), no isolated tab, TO-220AB package. | Requires insulating washer for heatsink mounting; higher conduction loss increases thermal design complexity. | Select when isolation is not required and lower gate charge (32 nC) is prioritized over thermal performance. |
| IRF640NPBF | Lower VDS (200 V), higher RDS(on) (180 mΩ min), TO-220 package with electrically connected tab. | Tab tied to drain-mandates insulated mounting; lacks 2500 VRMS isolation and fast body diode specs. | Choose only for cost-sensitive, non-safety-critical 24–48 V DC systems where heatsink isolation is managed externally. |
Compared with STP18NF20 and IRF640NPBF, the PHX18NQ20T delivers superior thermal integration via its isolated tab and lower RDS(on), making it uniquely suited for space-constrained, safety-certified AC/DC power supplies where layout simplicity and reliability are critical.
Availability
PHX18NQ20T is available at Aetrix Electronics and suitable for off-line switched-mode power supplies, television/computer monitor power supplies, and DC–DC converters requiring stable component supply, long-term lifecycle support, and certified isolation performance.
Supply support for PHX18NQ20T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader formed from the spin-off of Philips Semiconductors in 2006, specializing in high-performance analog, logic, and power management solutions for automotive, industrial, and consumer markets.
The PHX18NQ20T belongs to NXP's legacy TrenchMOS™ power MOSFET product line, engineered specifically for high-efficiency, high-reliability AC/DC and DC/DC conversion in safety-critical power supply applications.
FAQ
What is the maximum continuous drain current rating for PHX18NQ20T at 100 °C heatsink temperature?
The PHX18NQ20T supports 5.2 A continuous drain current (ID) at Ths = 100 °C and VGS = 10 V, as specified in Table 3 (Limiting Values). This derating reflects thermal constraints of the SOT186A package and ensures safe operation within the 150 °C maximum junction temperature limit. Designers must verify PCB copper area and airflow to sustain this current in real-world conditions.
Does PHX18NQ20T have a built-in body diode, and what are its key parameters?
Yes, the PHX18NQ20T integrates a source-drain body diode with forward voltage VSD = 0.9–1.2 V at IS = 16 A and reverse recovery time trr = 130 ns. Its recovered charge Qr is 0.8 µC, and peak forward current ISM reaches 33 A in pulsed operation. These values are confirmed in Table 5 (Characteristics) and support efficient freewheeling in hard-switched topologies.
Can PHX18NQ20T be used with gate drive voltages below 10 V, and what is its guaranteed turn-on threshold?
Yes-PHX18NQ20T has a gate-source threshold voltage VGS(th) of 2–4 V at Tj = 25 °C and remains functional down to 1.2 V at 150 °C (Table 5). It achieves full enhancement at VGS = 10 V, but will conduct meaningfully at ≥4.5 V. For robust operation, gate drive should exceed 5 V minimum to ensure low RDS(on) across temperature and process variation.
What is the thermal resistance from junction to heatsink (Rth(j-hs)) for PHX18NQ20T, and how does it impact heatsink sizing?
The PHX18NQ20T has Rth(j-hs) = 4.17 K/W (Table 4), measured with the isolated tab directly mounted to a heatsink. This low value-enabled by the metal tab's direct thermal path-means a 30 W dissipation (Ptot) at 25 °C ambient yields only ~125 °C junction rise, well within the 150 °C limit. Heatsink selection must account for interface resistance and ambient rise, but no insulator is needed.
Is PHX18NQ20T RoHS compliant and lead-free?
The PHX18NQ20T was originally released in 2000, predating RoHS legislation (2006). While NXP's later revisions of compatible devices (e.g., PHX18NQ20T/118) are RoHS-compliant and lead-free, the base PHX18NQ20T part number as documented in Rev. 01 (2000) does not carry RoHS certification. Customers requiring compliance must verify the specific date code and consult NXP's current product change notices for qualified variants.
PHX18NQ20T,127 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- TrenchMOS™
- Package/Case:
- TO-220-3 Full Pack, Isolated Tab
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.2A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 180mOhm @ 8A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 40 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1850 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 30W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220F
PHX18NQ20T,127 FAQ
1.How can I place an order for PHX18NQ20T,127 through Aetrix?
Please submit a Request for Quotation (RFQ) for PHX18NQ20T,127 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PHX18NQ20T,127 reliable?
The price and inventory of PHX18NQ20T,127 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PHX18NQ20T,127 is usually 5 days.
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5.How can I obtain technical support or documentation for PHX18NQ20T,127?
For technical support, including PHX18NQ20T,127 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PHX18NQ20T,127 requirements.
6.How does Aetrix verify that PHX18NQ20T,127 is sourced from the original manufacturer or authorized distributors?
All PHX18NQ20T,127 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PHX18NQ20T,127 meets industry standards.
7.What is the process for return or replacement of PHX18NQ20T,127?
All PHX18NQ20T,127 units undergo pre-shipment inspection (PSI). If there is an issue with PHX18NQ20T,127, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PHX18NQ20T,127 part is unused and in its original packaging.
Return procedure for PHX18NQ20T,127:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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