NXP Semiconductors PMCM6501UNE023
- Part No.:
- PMCM6501UNE023
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
PMCM6501UNE023.pdf
- Description:
- NEXPERIA PMCM6501UNE - 20V, N-CH
- Quantity:
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Inventory:85,500
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Product details
Overview
PMCM6501UNE from Nexperia is a 20 V, N-channel enhancement-mode Trench MOSFET in a 6-bump WLCSP package (0.98 × 1.48 × 0.35 mm), optimized for low-side load switching with RDS(on) = 17 mΩ at VGS = 4.5 V and ID = 3 A, 25 °C, and ESD protection >2 kV HBM. It serves in space-constrained portable electronics requiring fast switching and minimal board footprint.
For engineers reviewing the PMCM6501UNE datasheet, PMCM6501UNE pinout, PMCM6501UNE application, or PMCM6501UNE equivalent, this page delivers verified electrical parameters, thermal derating curves, gate charge behavior, safe operating area limits, and validated alternative MOSFETs for relay drivers, high-speed line drivers, and low-side loadswitches.
Technical Context
This device uses Trench MOSFET technology to achieve low threshold voltage (VGS(th) = 0.4–0.9 V) and low on-resistance while maintaining robust 20 V drain-source breakdown (V(BR)DSS ≥ 20 V). Its ultra-compact WLCSP6_3-2 package integrates drain, source, and gate terminals across six solder bumps with metal-coated device back tied to drain potential.
Thermal performance is defined by junction-to-solder-point resistance (Rth(j-sp) = 5–10 K/W) and junction-to-ambient resistance (Rth(j-a) = 45–225 K/W depending on PCB layout), enabling operation up to 150 °C junction temperature. Dynamic characteristics include QG(tot) = 19–28 nC and tf = 46 ns under specified test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V maximum - defines absolute maximum blocking capability in low-voltage switching applications |
| RDS(on) | 17–21 mΩ at VGS = 4.5 V, ID = 3 A, 25 °C - enables <100 mW conduction loss at 3 A continuous current |
| ID | 8.7 A max (t ≤ 5 s, Tamb = 25 °C) - supports short-duration peak loads in pulsed switching |
| VGS(th) | 0.4–0.9 V - ensures reliable turn-on with 1.8 V logic-level drive, suitable for battery-powered systems |
| QG(tot) | 19–28 nC - determines gate driver power requirement and switching speed trade-off |
| Ptot | 12.5 W at Tsp = 25 °C - sets maximum steady-state power dissipation with proper solder-point thermal path |
| ESD HBM | >2 kV - provides handling robustness during assembly without additional protection circuitry |
Pinout & Package
PMCM6501UNE is housed in a wafer-level chip-scale package (WLCSP6_3-2) measuring 0.98 × 1.48 × 0.35 mm with six solder bumps arranged in a 3×2 grid. The device back is metal-coated and electrically connected to the drain terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Gate (G) | Control input; requires <1 µA leakage current and drives 19–28 nC total gate charge |
| A2 | Source (S) | Reference node for gate drive and current return path; tied internally to B1 and B2 |
| B1 | Source (S) | Parallel source connection; reduces package inductance and improves current sharing in high-frequency switching |
| B2 | Source (S) | Third source bump; enhances thermal and electrical connection to PCB ground plane |
| C1 | Drain (D) | Main current output; connected to metal-coated device back for low-inductance, high-current path |
| C2 | Drain (D) | Second drain bump; increases current-carrying capacity and thermal dissipation to PCB copper |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small WLCSP6 footprint | 0.98 × 1.48 mm area - saves >70% board space vs. SOT-23, critical for wearables and hearing aids |
| Low VGS(th) | 0.4–0.9 V - enables direct interface with 1.8 V microcontrollers without level-shifting circuitry |
| Trench MOSFET architecture | Optimized cell pitch and trench depth - achieves 17 mΩ RDS(on) at 20 V rating with minimal gate charge |
| Drain-connected metal back | Direct thermal path from die to PCB - reduces Rth(j-sp) to 5–10 K/W for improved power handling |
| ESD robustness | >2 kV HBM - eliminates need for external ESD protection diodes in handheld product designs |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
Use Scenario: Driving electromagnetic relays in compact industrial I/O modules where PCB real estate is constrained. IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current up to 6.6 A DC with fast turn-on/turn-off (<100 ns delay + 46 ns fall time). Use Value: Eliminates discrete driver transistors and base resistors; enables single-chip relay control with <0.1 V saturation drop at 3 A. | Use Scenario: Transmitting digital signals across short PCB traces or flexible cables in USB-C accessory detection circuits. IC Role / Device Role / Timing Role: Active pull-down element in open-drain bus configurations, supporting >10 MHz toggle rates with minimal capacitive loading (Ciss = 1050 pF). Use Value: Reduces signal rise/fall distortion versus passive pull-downs; maintains clean edge integrity with 28 ns rise time and 46 ns fall time. |
| Low-Side Loadswitch | Switching Circuit |
Use Scenario: Power sequencing and fault-isolation for 3.3 V/5 V subsystems in battery-powered medical sensors. IC Role / Device Role / Timing Role: Controlled power rail switch with <1 µA off-state leakage and <17 mΩ on-resistance at 4.5 V gate drive. Use Value: Enables <10 µA system standby current; supports hot-swap functionality with controlled inrush via gate resistor tuning. | Use Scenario: PWM-controlled LED backlight dimming in smartwatch displays with tight thermal constraints. IC Role / Device Role / Timing Role: Synchronous rectifier or main switching element operating at 100–500 kHz with 27 A peak drain current capability. Use Value: Delivers <150 mW conduction loss at 3 A, minimizing local heating in thermally isolated display modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PMZ210UNEA | Same WLCSP6 package, but higher RDS(on) (22–27 mΩ @ 4.5 V), lower ID (6.5 A), and no documented ESD rating | Suitable for less demanding loadswitch roles where 17 mΩ is not required | Select when cost sensitivity outweighs on-resistance and ESD requirements |
| DMN2011UFD-7 | DFN1006-3 package (1.0 × 0.6 mm), RDS(on) = 19–24 mΩ @ 4.5 V, 20 V rating, 7.5 A ID, 2 kV HBM ESD | Offers larger thermal pad area than WLCSP but requires reflow-compatible footprint | Choose for easier assembly or higher thermal margin where 0.6 mm width is acceptable |
Compared with PMCM6501UNE, PMZ210UNEA trades lower cost for higher conduction loss and unverified ESD robustness, while DMN2011UFD-7 provides comparable performance in a more manufacturable DFN package-making it preferable for production ramp where WLCSP placement yield is a concern.
Availability
PMCM6501UNE is available at Aetrix Electronics and suitable for relay drivers, high-speed line drivers, low-side loadswitches, and switching circuits requiring stable component supply, consistent parametric performance, and long-term lifecycle support.
Supply support for PMCM6501UNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard products including MOSFETs, diodes, logic ICs, and ESD protection devices.
The PMCM6501UNE belongs to Nexperia's TrenchMOS family designed specifically for space-constrained, low-voltage power switching applications in portable and wearable electronics.
FAQ
What is the maximum continuous drain current for PMCM6501UNE at 100 °C ambient temperature?
The PMCM6501UNE supports 4.2 A continuous drain current at Tamb = 100 °C with VGS = 4.5 V, as specified in Table 5 (Limiting values). This value reflects thermal derating due to reduced heat dissipation at elevated ambient temperatures and assumes mounting on an FR4 PCB with a 6 cm² drain pad per datasheet condition [1]. The PMCM6501UNE must be used within this limit to avoid exceeding its 150 °C maximum junction temperature.
Does PMCM6501UNE have a body diode, and what is its forward voltage?
Yes, the PMCM6501UNE includes an intrinsic source-drain body diode with VSD = 0.6–1.2 V at IS = 1.2 A and Tj = 25 °C, as listed in Table 7. This diode conducts when the drain is biased below the source, enabling freewheeling in inductive load applications. The PMCM6501UNE body diode exhibits typical reverse recovery characteristics appropriate for low-frequency switching; it is not optimized for high-speed synchronous rectification.
Can PMCM6501UNE be driven directly by a 1.8 V GPIO without a level shifter?
Yes, PMCM6501UNE can be fully enhanced with a 1.8 V gate drive: its VGS(th) range is 0.4–0.9 V, and RDS(on) remains 20–25 mΩ at VGS = 1.8 V and ID = 2 A (Table 7). At 1.8 V, the PMCM6501UNE delivers usable on-state performance for low-current loads (<2 A), though conduction loss increases ~20% versus 4.5 V drive. For higher currents, 2.5 V or above is recommended.
What is the thermal resistance from junction to solder point (Rth(j-sp)) for PMCM6501UNE?
The PMCM6501UNE has a junction-to-solder-point thermal resistance of 5–10 K/W, as specified in Table 6. This low value results from the metal-coated device back directly contacting the PCB solder joint, providing an efficient thermal path. When designing layouts, ensure adequate solder volume and thermal vias beneath the drain bumps to realize the 5 K/W minimum value cited for optimal mounting conditions.
Is PMCM6501UNE automotive qualified?
No, PMCM6501UNE is not automotive qualified. Per Nexperia's legal disclaimers (Section 15), this device is classified as "non-automotive qualified" - it has not undergone AEC-Q101 stress testing or been validated for automotive temperature ranges, reliability, or failure mechanisms. The PMCM6501UNE is intended for consumer, industrial, and portable electronics applications only; use in automotive systems is at the customer's sole risk and requires full independent qualification.
PMCM6501UNE023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
PMCM6501UNE023 FAQ
1.How can I place an order for PMCM6501UNE023 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMCM6501UNE023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMCM6501UNE023 reliable?
The price and inventory of PMCM6501UNE023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMCM6501UNE023 is usually 5 days.
3.What payment methods are accepted for PMCM6501UNE023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMCM6501UNE023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMCM6501UNE023?
PMCM6501UNE023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMCM6501UNE023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMCM6501UNE023?
For technical support, including PMCM6501UNE023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMCM6501UNE023 requirements.
6.How does Aetrix verify that PMCM6501UNE023 is sourced from the original manufacturer or authorized distributors?
All PMCM6501UNE023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMCM6501UNE023 meets industry standards.
7.What is the process for return or replacement of PMCM6501UNE023?
All PMCM6501UNE023 units undergo pre-shipment inspection (PSI). If there is an issue with PMCM6501UNE023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMCM6501UNE023 part is unused and in its original packaging.
Return procedure for PMCM6501UNE023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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