Nexperia USA Inc. PMCM950ENEZ
- Part No.:
- PMCM950ENEZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 9-XFBGA, WLCSP
- Datasheet:
-
PMCM950ENEZ.pdf
- Description:
- MOSFET N-CH 60V 4.8A 9WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:2,672
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Product details
Overview
PMCM950ENE from Nexperia is a 60 V, N-channel enhancement-mode Trench MOSFET in a 9-bump Wafer Level Chip-Scale Package (WLCSP9_3x3), optimized for low-side switching with RDS(on) = 28 mΩ at VGS = 10 V and ID = 3 A, 25 °C, and ESD protection >2 kV HBM. It serves as a compact, high-speed load switch in space-constrained portable electronics.
For engineers reviewing the PMCM950ENE datasheet, PMCM950ENE pinout, PMCM950ENE application, or PMCM950ENE equivalent, this device is selected for ultra-small footprint switching where thermal resistance to solder point (Rth(j-sp)) ≤10 K/W and sub-1.5 V gate threshold enable direct microcontroller drive without level shifting.
Technical Context
This MOSFET uses Trench technology to achieve low RDS(on) and fast switching (td(on) = 2 ns, tf = 17 ns) with minimal gate charge (QG(tot) = 30–45 nC). Its WLCSP9 package integrates three drain, five source, and one gate bump - enabling symmetrical current distribution and low-inductance layout.
The device features a 0.9–1.5 V gate threshold (VGS(th)) and supports operation up to 150 °C junction temperature. Its normalized RDS(on) increases only ~1.7× from 25 °C to 150 °C, ensuring stable conduction in thermally demanding environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum drain-source blocking voltage; suitable for 48 V rail switching and industrial power supplies. |
| RDS(on) | 28 mΩ (typ) at VGS = 10 V, ID = 3 A, Tj = 25 °C - Enables <100 mW conduction loss at 3 A, critical for battery-powered efficiency. |
| VGS(th) | 0.9–1.5 V - Ensures reliable turn-on with 1.8 V or 3.3 V logic-level microcontrollers without gate driver. |
| QG(tot) | 30–45 nC - Low total gate charge reduces drive power and enables high-frequency PWM (>1 MHz) operation. |
| Rth(j-sp) | 5–10 K/W - Thermal resistance to solder point allows direct PCB copper pad cooling, supporting 12.5 W Ptot at Tsp = 25 °C. |
| ESD HBM | >2 kV - Robust electrostatic discharge immunity simplifies handling and eliminates need for external ESD protection in final assembly. |
| ID (continuous) | 4.8 A at Tamb = 25 °C - Validated continuous current rating on standard FR4 PCB with 6 cm² drain pad. |
Pinout & Package
Package: WLCSP9_3x3 - Wafer Level Chip-Scale Package, 1.48 × 1.48 × 0.35 mm, metal-coated backside connected to drain potential.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | G | Single gate terminal; requires low-impedance MCU GPIO connection to minimize switching losses. |
| A2, A3, B1, B2, B3 | S | Five parallel source terminals - reduce bond wire inductance and improve current sharing in high-di/dt switching. |
| C1, C2, C3 | D | Three drain terminals tied to metal-coated device back - enable low-thermal-resistance mounting to large copper pour. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-compact WLCSP9 footprint | 1.48 × 1.48 mm - Reduces board area by >70% vs. SOT-23, enabling integration into wearables and hearing aids. |
| Trench MOSFET architecture | Enables 28 mΩ RDS(on) at 10 V drive while maintaining <1.5 V VGS(th) - balances low-loss conduction and logic-level compatibility. |
| Multi-terminal drain/source configuration | 3 drain + 5 source bumps - lowers package parasitic inductance (<0.5 nH) and improves thermal spreading across PCB copper. |
| ESD-hardened gate | >2 kV HBM rating - Eliminates need for external TVS diodes in handheld device front-end switches. |
Applications
| High-Speed Line Driver | Low-Side Load Switch |
|---|---|
|
Use Scenario: Driving high-capacitance USB data lines or MIPI D-PHY lanes in smartphones. IC Role / Device Role / Timing Role: N-channel MOSFET configured as active pull-down switch to terminate or isolate signal paths. Use Value: 2 ns turn-on delay and 17 ns fall time ensure clean edge control up to 1.5 Gbps without overshoot or ringing. |
Use Scenario: Power gating of Bluetooth SoC peripherals in always-on wearable sensors. IC Role / Device Role / Timing Role: Low-side switch controlling VDD supply to sensor subsystems during sleep mode. Use Value: 0.9 V VGS(th) allows direct 1.8 V MCU GPIO control; 28 mΩ RDS(on) limits dropout to <17 mV at 600 mA load. |
| Switching Power Converter | LED Current Sink |
|
Use Scenario: Synchronous rectifier in buck converter for portable medical monitors. IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diode to improve efficiency at light loads. Use Value: 45 nC QG(tot) and 62 pF Crss enable efficient 500 kHz operation with <5% gate drive loss. |
Use Scenario: Constant-current sink for RGB indicator LEDs in smart home hubs. IC Role / Device Role / Timing Role: PWM-controlled current path with analog dimming via gate voltage modulation. Use Value: Linear region stability (gfs = 20 S) and low VSD (0.7 V typ) ensure precise 1–20 mA LED current control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2004LKQ-7 | Higher RDS(on) (45 mΩ @ 4.5 V), larger X2-DFN-10 package (2.0 × 2.0 mm), no WLCSP form factor. | Requires PCB redesign for footprint; better suited for higher-current (5.5 A) but less space-constrained designs. | Select when thermal margin >15 K/W is acceptable and board real estate permits larger package. |
| PMZB200UN,115 | Lower voltage rating (20 V), smaller WLCSP6 package (1.0 × 1.0 mm), RDS(on) = 32 mΩ @ 4.5 V. | Limited to 3.3 V/5 V systems; unsuitable for 12–48 V industrial or automotive auxiliary loads. | Select only for ultra-low-voltage, ultra-dense consumer IoT nodes where 60 V capability is unnecessary. |
Compared with DMN2004LKQ-7 and PMZB200UN,115, the PMCM950ENE uniquely delivers 60 V capability in a 1.48 mm² WLCSP9 package with sub-1.5 V gate threshold - making it the sole option for miniaturized, medium-voltage, logic-level-switched applications.
Availability
PMCM950ENE is available at Aetrix Electronics and suitable for high-speed line drivers, low-side load switches, and switching circuits requiring stable component supply, consistent wafer-level packaging, and traceable lot-level qualification.
Supply support for PMCM950ENE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET solutions with focus on efficiency, miniaturization, and robustness.
The PMCM950ENE belongs to Nexperia's TrenchMOS WLCSP portfolio, engineered specifically for space-constrained, high-frequency switching in portable and wearable electronics where thermal and electrical performance must coexist with sub-2 mm² footprints.
FAQ
What is the maximum continuous drain current for PMCM950ENE under standard PCB conditions?
The PMCM950ENE supports 4.8 A continuous drain current when mounted on an FR4 PCB with single-sided copper, tin-plated finish, and a 6 cm² drain pad at ambient temperature of 25 °C. Derating applies above 25 °C per the normalized Ider(%) curve in Figure 3, reaching 3 A at 100 °C ambient.
Can PMCM950ENE be driven directly by a 1.8 V GPIO without a level shifter?
Yes - its gate threshold voltage (VGS(th)) ranges from 0.9 V to 1.5 V at 25 °C, and RDS(on) remains 47 mΩ (max) at VGS = 4.5 V and ID = 3 A. At 1.8 V drive, the device operates in linear mode with predictable VSD and is suitable for analog current sinking or soft-start control.
How is thermal performance affected by PCB layout for this WLCSP device?
Thermal resistance from junction to solder point (Rth(j-sp)) is 5–10 K/W, but junction-to-ambient (Rth(j-a)) varies from 130 K/W (free air) to 42 K/W with a 6 cm² drain pad. Use the recommended reflow footprint (Figure 20) and maximize exposed copper area under the metal-coated backside to achieve rated 12.5 W power dissipation.
Does PMCM950ENE include integrated body diode functionality, and what is its forward voltage?
Yes - it incorporates a monolithic source-drain body diode with VSD = 0.7–1.2 V at IS = 1.4 A and Tj = 25 °C. This diode supports freewheeling in inductive switching applications and reverse polarity protection when used in low-side configurations.
PMCM950ENEZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 9-XFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 41mOhm @ 3A, 10V
- Vgs(th) (Max) @ Id:
- 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 45 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1160 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 780mW (Ta), 12.5W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-WLCSP (1.48x1.48)
PMCM950ENEZ FAQ
1.How can I place an order for PMCM950ENEZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PMCM950ENEZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMCM950ENEZ reliable?
The price and inventory of PMCM950ENEZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMCM950ENEZ is usually 5 days.
3.What payment methods are accepted for PMCM950ENEZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMCM950ENEZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMCM950ENEZ?
PMCM950ENEZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMCM950ENEZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMCM950ENEZ?
For technical support, including PMCM950ENEZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMCM950ENEZ requirements.
6.How does Aetrix verify that PMCM950ENEZ is sourced from the original manufacturer or authorized distributors?
All PMCM950ENEZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMCM950ENEZ meets industry standards.
7.What is the process for return or replacement of PMCM950ENEZ?
All PMCM950ENEZ units undergo pre-shipment inspection (PSI). If there is an issue with PMCM950ENEZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMCM950ENEZ part is unused and in its original packaging.
Return procedure for PMCM950ENEZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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