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Nexperia USA Inc. PMCPB5530X,115

Part No.:
PMCPB5530X,115
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
6-UFDFN Exposed Pad
Datasheet:
AetrixPMCPB5530X,115.pdf
Description:
MOSFET N/P-CH 20V 4A 6HUSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:34,842

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Product details

Overview

PMCPB5530X,115 from Nexperia is a complementary N/P-channel Trench MOSFET pair in a DFN2020-6 (SOT1118) package, designed for bidirectional power switching in space-constrained portable systems. It delivers 20 V drain-source voltage rating, 26 mΩ N-channel and 55 mΩ P-channel RDS(on) at 4.5 V gate drive, and supports 5.3 A N-channel / −4.5 A P-channel continuous drain current - enabling compact charging switches and DC-DC converter high-side/low-side control.

For engineers reviewing the PMCPB5530X,115 datasheet, PMCPB5530X,115 pinout, PMCPB5530X,115 application, or PMCPB5530X,115 equivalent, this dual-channel discrete FET offers verified thermal performance via exposed drain pad, fast switching (4 ns turn-on delay), and validated operation across −55 °C to 150 °C junction temperature range in battery-powered power management circuits.

Technical Context

This device integrates two enhancement-mode MOSFETs - an N-channel (TR1) with VGS(th) = 0.65 V typ and a P-channel (TR2) with VGS(th) = −0.65 V typ - sharing a monolithic die in a thermally enhanced leadless package. Both channels support ±12 V gate-source voltage and exhibit matched dynamic characteristics: QG(tot) of 14.4 nC (N) and 8.1 nC (P), with Ciss values of 660 pF and 785 pF respectively.

The DFN2020-6 footprint features an exposed drain pad (pins 3 and 6) for low Rth(j-sp) (10–15 K/W), enabling efficient heat transfer to PCB copper. Pin configuration separates source/gate/drain terminals per channel without internal connection, supporting independent gate control for synchronous buck or H-bridge topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDS ±20 V - Supports rail-to-rail operation in 12 V and lower battery systems without breakdown risk.
RDS(on) (N) 26 mΩ @ VGS = 4.5 V, ID = 3 A - Enables <150 mW conduction loss at 3 A, critical for efficiency in portable DC-DC converters.
RDS(on) (P) 55 mΩ @ VGS = −4.5 V, ID = −3.4 A - Allows low-loss reverse-path control in load switches and battery protection circuits.
QG(tot) 14.4 nC (N), 8.1 nC (P) - Enables fast switching with moderate gate drive strength; reduces transition losses in >1 MHz applications.
Tj Range −55 °C to 150 °C - Qualified for extended industrial and automotive ambient environments when mounted on FR4 with 6 cm² drain pad.
Rth(j-sp) 10–15 K/W - Confirmed thermal path from junction to solder point enables reliable 1.17 W power dissipation under pulsed conditions.
Package DFN2020-6 (SOT1118), 2.0 × 2.0 × 0.65 mm - Ultra-thin footprint saves board area vs. SO-8 or TSOP-6, ideal for slim mobile designs.

Pinout & Package

DFN2020-6 (SOT1118) is a 2.0 mm × 2.0 mm × 0.65 mm leadless plastic package with an exposed drain pad for thermal conduction. Six terminals are arranged in a single row with no leads; pins 3 and 6 connect to the common drain pad (TR1 D1 and TR2 D2).

Pin/Terminal Circuit Role Design Meaning
1 Source TR1 (S1) N-channel source node - connects to ground or low-side return path in buck or load-switch configurations.
2 Gate TR1 (G1) N-channel gate input - requires positive voltage relative to S1 to turn on; isolated from P-channel control.
3 Drain TR2 (D2) P-channel drain node - ties to exposed pad; used as high-side switch output or reverse-blocking terminal.
4 Source TR2 (S2) P-channel source node - connects to input rail (e.g., battery+) in high-side load switch applications.
5 Gate TR2 (G2) P-channel gate input - requires negative voltage relative to S2 to turn on; driven independently from G1.
6 Drain TR1 (D1) N-channel drain node - ties to same exposed pad as D2; forms common drain connection for half-bridge layout.

Key Features

Feature Design Value
Complementary N+P trench MOSFET pair Single-package integration eliminates layout mismatch and timing skew between high/low-side switches in DC-DC and motor drivers.
Exposed drain pad (pins 3 & 6) Reduces Rth(j-sp) to 10–15 K/W - enables 1.17 W pulsed dissipation without external heatsink on standard FR4.
Ultra-thin DFN2020-6 package 0.65 mm max height - fits under 1 mm camera modules and thin battery compartments in smartphones and wearables.
Fast switching (4 ns td(on)) Minimizes dead-time losses in synchronous rectification; supports >2 MHz converter operation with low gate charge.
VGS(th) matching (±0.65 V typ) Ensures consistent turn-on behavior across temperature - simplifies gate driver design for balanced conduction in H-bridges.

Applications

Charging Switch for Portable Devices DC-to-DC Converters

Use Scenario: Bidirectional USB-C power path control in smartphones, where battery charging and OTG power delivery share one port.

IC Role / Device Role / Timing Role: N-channel (TR1) acts as low-side battery switch; P-channel (TR2) serves as high-side input switch - both controlled independently to prevent shoot-through.

Use Value: 26 mΩ/55 mΩ RDS(on) limits voltage drop to <160 mV at 3 A, preserving system efficiency during 5 V/3 A charging.

Use Scenario: Synchronous buck converter in tablet PMIC, stepping down 8.4 V battery to 3.3 V core logic rail.

IC Role / Device Role / Timing Role: TR1 (N-ch) as synchronous rectifier; TR2 (P-ch) as high-side switch - operated in complementary PWM mode with dead-time control.

Use Value: Low QG(tot) (8.1–14.4 nC) and fast td(on)/tf (4–16 ns) reduce switching losses, enabling >92% efficiency at 1.5 MHz.

Small Brushless DC Motor Drive Power Management in Battery-Driven Portables

Use Scenario: Three-phase gate driver stage for 5 V fan or haptic motor in smartwatch, using half-bridge topology per phase.

IC Role / Device Role / Timing Role: One PMCPB5530X per half-bridge leg - TR1 as low-side switch, TR2 as high-side switch - driven by dedicated gate driver IC.

Use Value: Matched VGS(th) and RDS(on) ensure symmetrical rise/fall times, minimizing torque ripple and audible noise below 20 kHz.

Use Scenario: System-level power sequencing in Bluetooth earbuds, enabling battery isolation, charging enable, and LDO bypass control.

IC Role / Device Role / Timing Role: TR2 (P-ch) as battery disconnect switch; TR1 (N-ch) as charger enable switch - both controlled by MCU GPIOs.

Use Value: −55 °C to 150 °C Tj rating ensures reliability during rapid charge/discharge cycles and ambient temperature swings in pocket/worn devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMC3025LSD-13 N/P RDS(on) = 25/42 mΩ @ 4.5 V; larger TSOP-6 package (3.05 × 1.65 mm); higher QG (18.5/11.5 nC) Better RDS(on) but 50% larger footprint - suitable only if board area permits and thermal pad access is limited. Select when lower conduction loss outweighs size constraint; verify gate drive capability for higher QG.
SI3588DV-T1-GE3 N/P RDS(on) = 32/65 mΩ @ 4.5 V; same DFN2020-6 package; slower td(on) (10 ns) and higher Ciss (800/900 pF) Compatible footprint but higher switching loss - acceptable for ≤500 kHz DC-DC, not recommended for >1 MHz. Choose for cost-sensitive designs where 20% higher RDS(on) and reduced speed are acceptable trade-offs.

Compared with DMC3025LSD-13 and SI3588DV-T1-GE3, PMCPB5530X,115 provides optimal balance of ultra-compact size, low RDS(on), and fast switching - making it preferred for high-frequency, space-critical portable power stages where thermal performance and layout simplicity are prioritized.

Availability

PMCPB5530X,115 is available at Aetrix Electronics and suitable for charging switches, DC-DC converters, and small BLDC motor drives requiring stable component supply and long-term manufacturability in consumer electronics production.

Supply support for PMCPB5530X,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

PMCPB5530X,115 belongs to Nexperia's TrenchMOS complementary FET product line, engineered specifically for high-efficiency, miniaturized power management in battery-powered portable electronics.

FAQ

What is the maximum continuous drain current for each channel at 100 °C ambient?

At Tamb = 100 °C with standard FR4 mounting (single-sided copper, 6 cm² drain pad), the N-channel supports 2.6 A continuous drain current and the P-channel supports −2.2 A. These values derive from derating curves in Table 5 and Fig 2/18, reflecting thermal limits under sustained operation.

Can PMCPB5530X,115 be used in a synchronous boost converter?

No - the device lacks integrated body diode optimization for reverse recovery in boost topologies. Its P-channel is rated for −20 V VDS, limiting use to step-down or bidirectional switching. For boost, a dedicated N-channel+N-channel or logic-level P-channel with faster VSD recovery is required.

Is the exposed drain pad electrically connected between TR1 and TR2?

Yes - pins 3 (D2) and 6 (D1) are internally connected to the same exposed copper pad, forming a common drain node. This allows shared thermal sinking but prohibits independent drain biasing; both channels must operate with drains at identical potential.

What is the gate threshold voltage variation over temperature?

VGS(th) decreases linearly with junction temperature: N-channel drops from 0.65 V at 25 °C to ~0.45 V at 150 °C (Fig 11); P-channel shifts from −0.65 V to ~−0.45 V (Fig 22). This negative tempco ensures stable turn-on margin across operating range without external compensation.

PMCPB5530X,115 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
6-UFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
-
Configuration:
N and P-Channel
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
4A (Ta), 3.4A (Ta)
Rds On (Max) @ Id, Vgs:
34mOhm @ 3A, 4.5V
Vgs(th) (Max) @ Id:
900mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
21.7nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
660pF @ 10V
Power - Max:
490mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-HUSON (2x2)

PMCPB5530X,115 FAQ

1.How can I place an order for PMCPB5530X,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for PMCPB5530X,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMCPB5530X,115 reliable?

The price and inventory of PMCPB5530X,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMCPB5530X,115 is usually 5 days.

3.What payment methods are accepted for PMCPB5530X,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMCPB5530X,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMCPB5530X,115?

PMCPB5530X,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMCPB5530X,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMCPB5530X,115?

For technical support, including PMCPB5530X,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMCPB5530X,115 requirements.

6.How does Aetrix verify that PMCPB5530X,115 is sourced from the original manufacturer or authorized distributors?

All PMCPB5530X,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMCPB5530X,115 meets industry standards.

7.What is the process for return or replacement of PMCPB5530X,115?

All PMCPB5530X,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMCPB5530X,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMCPB5530X,115 part is unused and in its original packaging.

Return procedure for PMCPB5530X,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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