Nexperia USA Inc. PMDPB30XN,115

Overview

PMDPB30XN from Nexperia is a dual N-channel Trench MOSFET in a DFN2020-6 (SOT1118) package, rated for 20 V drain-source voltage, 5.3 A continuous drain current per transistor at 4.5 V gate drive, and 32 mΩ typical R_DS(on) at 3 A/25 °C. It serves as a compact, thermally efficient power switch in portable battery management and DC-DC conversion circuits.

For engineers reviewing the PMDPB30XN datasheet, PMDPB30XN pinout, PMDPB30XN application, or PMDPB30XN equivalent, this device is selected for high-density, low-profile dual-switching roles where thermal performance, fast switching (t_d(on) = 4 ns, t_f = 16 ns), and ultra-thin packaging (0.65 mm max height) are critical design constraints.

Technical Context

This dual MOSFET integrates two independent N-channel enhancement-mode transistors using Trench technology, enabling synchronous rectification or complementary half-bridge operation without cross-conduction risk when driven separately. Each channel supports ±12 V gate-source voltage and exhibits sub-1 V source-drain diode forward voltage at 1.2 A.

Its thermal design relies on an exposed drain pad soldered to a 6 cm² copper mounting area on FR4 PCB, achieving 55 K/W junction-to-solder-point resistance and enabling 1170 mW continuous power dissipation at 25 °C ambient. The device operates across –55 °C to 150 °C junction temperature range.

Key Specifications

Pinout & Package

Package: DFN2020-6 (SOT1118), 2.0 × 2.0 × 0.65 mm, leadless, thermally enhanced with exposed drain pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Compared with DMN2020LSD-13 and SI2302DDS-T1-GE3, PMDPB30XN uniquely balances ultra-low profile, dual-channel integration, and optimized gate charge for high-frequency portable power stages-making it preferred where PCB thickness, layout density, and 1–2 MHz switching coexist.

Availability

PMDPB30XN is available at Aetrix Electronics and suitable for charging switches in portable devices, DC-DC converters in SSDs and wearables, and power management in battery-driven medical electronics requiring stable component supply and long-term manufacturability.

Supply support for PMDPB30XN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, and consumer markets.

The PMDPB30XN belongs to Nexperia's TrenchMOS dual-FET product line, engineered specifically for space-constrained, thermally demanding portable power applications requiring dual-channel integration and low-voltage logic compatibility.

FAQ

What is the maximum continuous drain current per channel at 100 °C ambient?

At T_amb = 100 °C, the maximum continuous drain current per channel is 2.6 A, as specified in Table 5 (Limiting values). This reflects thermal derating based on the device's R_th(j-a) of 93–107 K/W on a 6 cm² drain pad, ensuring safe operation without exceeding 150 °C junction temperature.

Can PMDPB30XN be used in a synchronous buck converter as both high-side and low-side switch?

No - PMDPB30XN contains two N-channel MOSFETs only and lacks integrated bootstrap circuitry or level-shifting. It can serve as the low-side switch directly, but the high-side requires either an external high-side driver or a P-channel device; using both channels as high-side is not feasible without gate voltage boosting beyond 20 V.

Is the exposed drain pad electrically connected to both D1 and D2 terminals?

Yes - Pins 3 (D2) and 6 (D1) are internally connected to the same exposed drain pad, forming a common thermal and electrical node for both transistors. This configuration simplifies PCB thermal design but requires that both drains operate at the same potential in the circuit.

What is the recommended solder paste stencil aperture for the DFN2020-6 package?

The recommended reflow footprint (Fig. 19) specifies 0.49 mm × 0.49 mm solder lands for pins 1–5 and 0.65 mm × 0.65 mm for the central drain pad. A 0.12 mm thick stencil with 1:1 aperture ratio is advised to ensure sufficient paste volume on the thermal pad while avoiding bridging on fine-pitch terminals.