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Nexperia USA Inc. PMDT290UNEH

Part No.:
PMDT290UNEH
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
SOT-563, SOT-666
Datasheet:
AetrixPMDT290UNEH.pdf
Description:
MOSFET 2N-CH 20V 0.8A SOT666
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,695

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Product details

Overview

PMDT290UNE from Nexperia is a dual N-channel enhancement-mode Trench MOSFET in SOT666 package, designed for low-side switching and high-speed line driving. It delivers 800 mA continuous drain current per transistor at VGS = 4.5 V, with RDS(on) = 290 mΩ (typ) at 500 mA/25 °C, 20 V VDS rating, and integrated ESD protection up to 2 kV - enabling compact loadswitching in space-constrained consumer and industrial PCBs.

For engineers reviewing the PMDT290UNE datasheet, PMDT290UNE pinout, PMDT290UNE application, or PMDT290UNE equivalent, key selection criteria include per-transistor RDS(on) temperature stability, gate charge (QG(tot) = 0.45–0.68 nC), thermal resistance (Rth(j-a) = 330 K/W typical on FR4), and dual-channel isolation for independent control in relay driver or bus-switching topologies.

Technical Context

This dual MOSFET integrates two fully isolated N-channel channels in a single ultra-small SOT666 package. Each channel features trench-gate architecture optimized for fast switching (td(on) = 6–12 ns, tf = 31 ns) and low gate drive requirements (VGS(th) = 0.5–0.95 V), supporting logic-level operation from 1.8 V to 4.5 V gate drive.

Thermal design is constrained by junction-to-ambient Rth(j-a) = 330 K/W (per transistor, FR4, 1 cm² drain pad) and derating curves showing 50% power reduction at Tj = 125 °C. Safe operating area (SOA) supports peak drain current of 3.2 A (10 µs pulse) at VDS ≤ 10 V, confirming suitability for transient-loaded switching circuits.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 20 V - Maximum drain-source voltage before breakdown; defines safe DC/peak operating range in low-voltage systems (e.g., 3.3 V/5 V rails).
ID (continuous) 800 mA @ VGS = 4.5 V, Tamb = 25 °C - Per-channel steady-state current capability; sufficient for driving small relays or LED strings.
RDS(on) 290 mΩ (typ) @ VGS = 4.5 V, ID = 500 mA, Tj = 25 °C - On-resistance directly determines conduction loss (Ploss ≈ I² × R); enables <150 mW dissipation at 500 mA.
QG(tot) 0.45–0.68 nC - Total gate charge dictates drive strength needed; compatible with standard GPIO or low-power logic drivers without external buffers.
VGS(th) 0.5–0.95 V - Gate threshold voltage ensures reliable turn-on with 1.8 V microcontroller outputs, reducing need for level shifters.
ESD Rating 2000 V HBM - Robust electrostatic discharge immunity simplifies handling and board-level ESD protection design.
Tj max 150 °C - Maximum junction temperature sets thermal margin; requires thermal pad layout per Figure 19 for sustained 800 mA operation.

Pinout & Package

The PMDT290UNE is housed in a 6-pin SOT666 surface-mount plastic package (1.6 mm × 1.2 mm × 0.55 mm body, 0.5 mm pitch), optimized for high-density PCB layouts and reflow soldering per IPC-7095 guidelines.

Pin/Terminal Circuit Role Design Meaning
1 S1 Source terminal of transistor TR1 - connects to system ground or low-side return path for first channel.
2 G1 Gate terminal of transistor TR1 - accepts logic-level control signal; low Ciss (55–83 pF) minimizes drive capacitance burden.
3 D2 Drain terminal of transistor TR2 - connects to load supply rail for second channel; electrically isolated from D1.
4 S2 Source terminal of transistor TR2 - independent return path; enables dual low-side switching with separate load grounds.
5 G2 Gate terminal of transistor TR2 - fully decoupled from G1; allows asynchronous or synchronized control of both channels.
6 D1 Drain terminal of transistor TR1 - connects to first load; drain pad (pin 6) is thermally enhanced for PCB heat spreading.

Key Features

Feature Design Value
Ultra-small SOT666 footprint 1.6 mm × 1.2 mm area saves >60% board space vs. SO-8 dual MOSFETs - critical for wearables and IoT sensor nodes.
Trench MOSFET technology Enables low RDS(on) at 1.8 V gate drive and fast switching (tr = 4 ns) - reduces transition losses in PWM-driven loads.
Independent dual-channel structure No internal connection between TR1 and TR2 - supports isolated load control, e.g., dual motor phases or redundant power paths.
ESD protection (2 kV HBM) Eliminates need for external TVS diodes on gate lines in handheld or field-deployed equipment.
Low thermal resistance (Rth(j-sp) = 115 K/W) Direct thermal path from die to solder point enables efficient heat transfer to PCB copper - improves reliability under pulsed loads.

Applications

Relay Driver High-Speed Line Driver

Use Scenario: Driving 5 V/12 V electromagnetic relays in PLC I/O modules or smart home hubs.

IC Role / Device Role: Low-side switch controlling relay coil current (typically 20–100 mA), replacing discrete BJT + base resistor networks.

Use Value: Eliminates base-drive current loss and thermal runaway risk; 290 mΩ RDS(on) ensures <20 mW coil-switching loss at 100 mA, extending relay lifetime.

Use Scenario: Transmitting TTL/CMOS signals across noisy industrial backplanes or USB-C sideband use cases.

IC Role / Device Role: Active pull-down element in open-drain bus interface, enabling bidirectional signaling with controlled slew rate.

Use Value: Fast 4 ns rise time and low output capacitance (Coss = 15 pF) maintain signal integrity up to 50 MHz, reducing jitter in timing-critical links.

Low-Side Load Switch Switching Power Supply Auxiliary Control

Use Scenario: Enabling/disabling power to peripheral ICs (e.g., sensors, radios) in battery-powered edge devices.

IC Role / Device Role: Dual-channel power gate managing two independent 3.3 V domains with independent enable control.

Use Value: 0.5 V VGS(th) ensures full turn-on from MCU GPIO; <1 µA IDSS leakage preserves battery life during deep sleep modes.

Use Scenario: Controlling synchronous rectifier gates or auxiliary bias windings in DC-DC converters below 20 V input.

IC Role / Device Role: Secondary-side switch in flyback or buck-derived topologies where low QG and fast turn-off (td(off) = 86–172 ns) minimize dead-time losses.

Use Value: 0.15 nC QGD reduces Miller-induced shoot-through risk; 3.2 A peak current rating supports short-circuit robustness during startup transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel low-side switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004LSD-13 Higher RDS(on) (350 mΩ typ @ 4.5 V), larger TSOP-6 package (2.9 mm × 1.6 mm), no specified ESD rating. Limited to lower-frequency switching (<1 MHz) due to higher QG (1.1 nC); less suitable for space-constrained designs. Choose when cost sensitivity outweighs size and ESD requirements; verify thermal performance on FR4 without extended drain pad.
FDMA1023NZ Lower VDS (12 V), smaller WLCSP-6 package (1.5 mm × 1.0 mm), but RDS(on) = 420 mΩ @ 4.5 V and no HBM rating published. Restricted to sub-12 V systems; unsuitable for 20 V relay coils or industrial 15 V buses. Select only for ultra-miniature 3.3 V applications where voltage headroom is not required; avoid in environments requiring ESD immunity.

Compared with DMN2004LSD-13 and FDMA1023NZ, PMDT290UNE uniquely balances 20 V rating, 290 mΩ RDS(on), 2 kV ESD, and SOT666 size - making it the only option qualified for compact, noise-immune, medium-voltage dual switching in commercial-grade industrial controls.

Availability

PMDT290UNE is available at Aetrix Electronics and suitable for relay driver circuits, high-speed line interfaces, and low-side loadswitching applications requiring stable component supply, consistent parametric performance, and long-term manufacturability in high-mix electronics production.

Supply support for PMDT290UNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies - delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The PMDT290UNE belongs to Nexperia's TrenchMOS dual-transistor portfolio, engineered specifically for space-constrained, low-power switching applications where thermal efficiency, ESD resilience, and logic-level drivability are prioritized over automotive qualification.

FAQ

What is the maximum continuous drain current per channel at 100 °C ambient temperature?

The PMDT290UNE supports 500 mA continuous drain current per transistor at Tamb = 100 °C, as specified in Table 5 (Limiting Values). This derating reflects thermal constraints of the SOT666 package on standard FR4 PCBs; actual current depends on copper area and airflow. The device remains within safe SOA up to 3.2 A for 10 µs pulses even at elevated temperatures.

Can both channels be used simultaneously with independent gate drives?

Yes - the PMDT290UNE contains two fully isolated N-channel MOSFETs (TR1 and TR2) with no internal connection between channels. Pins 1–2–6 form TR1 (S1–G1–D1); pins 3–4–5 form TR2 (D2–S2–G2). Independent gate control enables asynchronous switching, phase-split operation, or redundancy schemes without crosstalk or shared thermal coupling beyond package-level conduction.

Is the SOT666 package lead-free and RoHS compliant?

Yes - the PMDT290UNE is manufactured in a lead-free, halogen-free, RoHS-compliant SOT666 package per Nexperia's product compliance documentation (v.2, December 2022). The package meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL1) and is qualified for standard SnAgCu reflow profiles up to 260 °C peak temperature, as validated in Section 13 (Soldering).

Does the device include body diode functionality, and what is its forward voltage?

Each channel includes an inherent source-drain body diode. At IS = 300 mA and Tj = 25 °C, the typical forward voltage (VSD) is 0.77 V, with a range of 0.48–1.2 V (Table 7). This diode enables freewheeling in inductive loads like relays, but is not rated for continuous reverse conduction - external Schottky diodes are recommended for high-repetition flyback energy recovery.

PMDT290UNEH Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
SOT-563, SOT-666
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
800mA (Ta)
Rds On (Max) @ Id, Vgs:
380mOhm @ 500mA, 4.5V
Vgs(th) (Max) @ Id:
950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.68nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
83pF @ 10V
Power - Max:
330mW (Ta), 1.09W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-666

PMDT290UNEH FAQ

1.How can I place an order for PMDT290UNEH through Aetrix?

Please submit a Request for Quotation (RFQ) for PMDT290UNEH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMDT290UNEH reliable?

The price and inventory of PMDT290UNEH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMDT290UNEH is usually 5 days.

3.What payment methods are accepted for PMDT290UNEH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMDT290UNEH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMDT290UNEH?

PMDT290UNEH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMDT290UNEH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMDT290UNEH?

For technical support, including PMDT290UNEH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMDT290UNEH requirements.

6.How does Aetrix verify that PMDT290UNEH is sourced from the original manufacturer or authorized distributors?

All PMDT290UNEH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMDT290UNEH meets industry standards.

7.What is the process for return or replacement of PMDT290UNEH?

All PMDT290UNEH units undergo pre-shipment inspection (PSI). If there is an issue with PMDT290UNEH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMDT290UNEH part is unused and in its original packaging.

Return procedure for PMDT290UNEH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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