Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Nexperia USA Inc. PMDXB290UNEZ

Part No.:
PMDXB290UNEZ
Manufacturer:
Nexperia USA Inc.
Category:
FET, MOSFET Arrays
Package:
6-XFDFN Exposed Pad
Datasheet:
AetrixPMDXB290UNEZ.pdf
Description:
MOSFET 2N-CH 20V 0.93A 6DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,574

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

PMDXB290UNE from Nexperia is a dual N-channel enhancement-mode Trench MOSFET in a DFN1010B-6 (SOT1216) package, designed for low-side load switching and high-speed line driving. It features 20 V drain-source voltage rating, 270 mΩ typical RDS(on) at VGS = 4.5 V and ID = 1.2 A, and ESD protection >2 kV HBM - enabling compact, robust switching in space-constrained portable and battery-powered systems.

For engineers reviewing the PMDXB290UNE datasheet, PMDXB290UNE pinout, PMDXB290UNE application, or PMDXB290UNE equivalent, key selection criteria include its ultra-small 1.1 mm × 1.0 mm footprint, dual-channel integration for matched switching, low 0.7 V gate threshold, fast 1 ns turn-on delay, and thermal resistance of 21 K/W (junction-to-solder point) on standard FR4 PCBs.

Technical Context

This dual MOSFET integrates two independent N-channel devices sharing no internal connection - each with separate gate, source, and drain terminals. Its Trench MOSFET architecture delivers low RDS(on) and fast switching (tr = 3 ns, tf = 3 ns) while maintaining stable sub-threshold behavior down to VGS = 1.2 V.

The device operates within ±8 V gate-source voltage limits and supports continuous drain current up to 930 mA at 25 °C ambient (derated to 590 mA at 100 °C), with peak pulse capability of 14 A (10 µs). Its 1.5 V typical VGS(th) enables direct drive from 1.8 V and 3.3 V logic without level shifting.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 20 V - Maximum blocking voltage; suitable for 12 V rail and Li-ion battery (≤4S) applications
RDS(on) 270 mΩ (typ) at VGS = 4.5 V - Enables <100 mW conduction loss at 600 mA load
VGS(th) 0.7 V (typ) - Ensures reliable turn-on with 1.8 V GPIO or low-voltage microcontrollers
td(on) 1 ns - Supports >500 MHz switching in digital load control and PWM dimming
QG(tot) 0.75 nC (typ) - Minimizes gate drive power and allows use with weak drivers (e.g., MCU GPIO)
ESD Rating 2000 V HBM - Reduces need for external ESD protection in handheld and wearables
Rth(j-sp) 21 K/W - Enables 370 mW continuous dissipation on standard FR4 with 1 cm² drain pad

Pinout & Package

Package: DFN1010B-6 (SOT1216), ultra-thin 1.1 mm × 1.0 mm × 0.37 mm body, leadless, thermally enhanced, 0.35 mm pitch. Exposed drain pads (Pins 1, 6, 7, 8) provide low thermal resistance and dual-channel isolation.

Pin/Terminal Circuit Role Design Meaning
1 S1 Source terminal of transistor TR1; connects to ground or low-side return path
2 G1 Gate terminal of TR1; controls switching of first channel independently
3 D2 Drain terminal of TR2; connects to load or supply rail for second channel
4 S2 Source terminal of TR2; electrically isolated from S1 for dual-load independence
5 G2 Gate terminal of TR2; enables synchronous or independent control of second channel
6–8 D1 / D1 / D2 Drain terminals of TR1 (pins 6 & 7) and TR2 (pin 8); tied to exposed copper pads for thermal and electrical performance

Key Features

Feature Design Value
Ultra-small footprint 1.1 mm × 1.0 mm DFN1010B-6 package saves >60% board area vs. SO-8 dual MOSFETs
Low VGS(th) 0.7 V typical threshold enables direct interface with 1.8 V logic without level shifters
Matched dual channels Identical RDS(on), QG, and timing specs ensure synchronized switching in parallel or complementary topologies
Thermally optimized layout Four dedicated drain terminals (including exposed pads) reduce Rth(j-sp) to 21 K/W
High ESD immunity 2 kV HBM rating eliminates need for discrete TVS diodes in consumer-grade USB/IO interfaces

Applications

USB Port Power Switching Smartphone LED Backlight Control

Use Scenario: Enabling/disabling VBUS power to downstream USB peripherals in portable devices.

IC Role / Device Role / Timing Role: Dual low-side switch controlling two independent USB ports or VBUS + data-line pull-up paths.

Use Value: 270 mΩ RDS(on) limits voltage drop to <0.26 V at 900 mA, preserving USB 2.0 compliance; 1 ns td(on) ensures fast port enumeration.

Use Scenario: PWM-driven current control for multi-segment LCD backlight LEDs in smartphones.

IC Role / Device Role / Timing Role: Dual-channel constant-current sink switch synchronizing with display controller PWM signals.

Use Value: Matched RDS(on) ensures uniform brightness across segments; 0.7 V VGS(th) allows direct 1.8 V PWM signal drive from display IC.

Wearable Sensor Power Gating IoT Button Debounce & Wake-Up Circuit

Use Scenario: Selectively powering MEMS accelerometers, gyroscopes, or environmental sensors during active measurement cycles.

IC Role / Device Role / Timing Role: Dual low-side switch isolating sensor supply rails to minimize standby current leakage.

Use Value: Sub-µA IDSS (<1 µA) prevents parasitic current paths; 1.1 mm × 1.0 mm size fits within tight wearable PCB real estate.

Use Scenario: Debouncing mechanical push buttons and generating clean wake-up interrupts for ultra-low-power MCUs.

IC Role / Device Role / Timing Role: One channel as RC-based debounce filter, second as edge-triggered wake-up switch to MCU interrupt pin.

Use Value: Fast 3 ns rise/fall times eliminate contact bounce artifacts; dual integration reduces component count vs. discrete solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2020LSD-13 Higher RDS(on) (320 mΩ typ), larger TSOP-6 package (2.9 mm × 1.6 mm), 30 V rating Better suited for 24 V industrial IO modules where voltage margin matters more than size Select when higher VDS headroom is required and PCB area is not constrained
AOB290 Single-channel, TO-252 package, 19 mΩ RDS(on), 30 V rating, no ESD protection Targeted at high-current (>3 A), non-portable applications requiring minimal conduction loss Choose only for single-load, high-power scenarios where ESD hardening and miniaturization are secondary

Compared with DMN2020LSD-13 and AOB290, PMDXB290UNE uniquely balances ultra-compact size, dual-channel integration, low-threshold drive, and built-in ESD protection - making it optimal for space- and power-sensitive portable electronics where both channels must operate independently under 1.8–3.3 V logic control.

Availability

PMDXB290UNE is available at Aetrix Electronics and suitable for USB power delivery, smartphone backlight control, wearable sensor gating, and IoT button debounce circuits requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for PMDXB290UNE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, serving automotive, industrial, mobile, and computing markets with scalable manufacturing and rigorous quality systems.

The PMDXB290UNE belongs to Nexperia's TrenchMOS® dual small-signal MOSFET product line, engineered specifically for miniaturized, battery-operated consumer electronics demanding low-voltage drive, fast switching, and robust ESD tolerance in sub-1 mm² footprints.

FAQ

What is the maximum continuous drain current for PMDXB290UNE at 85 °C ambient temperature?

At 85 °C ambient temperature, the maximum continuous drain current per channel is 720 mA. This value is derived from linear derating of the 930 mA rating at 25 °C using the normalized current curve in Figure 3 of the datasheet, accounting for thermal resistance and PCB mounting conditions.

Can PMDXB290UNE be used in a high-side switching configuration?

No - PMDXB290UNE is a dual N-channel MOSFET with no integrated charge pump or bootstrap circuitry. High-side operation would require gate voltage exceeding the source potential, which this device cannot self-generate. It is specified and validated exclusively for low-side switching applications.

Is the DFN1010B-6 package compatible with standard reflow soldering profiles?

Yes - the DFN1010B-6 package is qualified for lead-free reflow soldering per JEDEC J-STD-020. Recommended peak temperature is 260 °C for ≤30 seconds, with preheat ramp rate ≤3 °C/s and time above 217 °C limited to 60–150 seconds, matching standard Class 3 IPC-A-610 profiles.

Does PMDXB290UNE have body diode conduction capability in reverse direction?

Yes - each channel includes an inherent source-drain body diode with typical forward voltage of 0.9 V at 0.7 A and 25 °C junction temperature. This enables freewheeling in inductive loads, though the diode is not rated for continuous reverse recovery stress and should not be relied upon for high-frequency flyback energy transfer.

PMDXB290UNEZ Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
6-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
930mA (Ta), 3.5A (Tc)
Rds On (Max) @ Id, Vgs:
320mOhm @ 1.2A, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.9nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
43.6pF @ 10V
Power - Max:
280mW (Ta), 6W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DFN1010B-6

PMDXB290UNEZ FAQ

1.How can I place an order for PMDXB290UNEZ through Aetrix?

Please submit a Request for Quotation (RFQ) for PMDXB290UNEZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PMDXB290UNEZ reliable?

The price and inventory of PMDXB290UNEZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMDXB290UNEZ is usually 5 days.

3.What payment methods are accepted for PMDXB290UNEZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMDXB290UNEZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PMDXB290UNEZ?

PMDXB290UNEZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PMDXB290UNEZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PMDXB290UNEZ?

For technical support, including PMDXB290UNEZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMDXB290UNEZ requirements.

6.How does Aetrix verify that PMDXB290UNEZ is sourced from the original manufacturer or authorized distributors?

All PMDXB290UNEZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMDXB290UNEZ meets industry standards.

7.What is the process for return or replacement of PMDXB290UNEZ?

All PMDXB290UNEZ units undergo pre-shipment inspection (PSI). If there is an issue with PMDXB290UNEZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PMDXB290UNEZ part is unused and in its original packaging.

Return procedure for PMDXB290UNEZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PMDXB290UNEZ Tags

  • PMDXB290UNEZ
  • PMDXB290UNEZ PDF
  • PMDXB290UNEZ Datasheet
  • PMDXB290UNEZ Specifications
  • PMDXB290UNEZ Images
  • Nexperia USA Inc.
  • Nexperia USA Inc. PMDXB290UNEZ
  • Buy PMDXB290UNEZ
  • PMDXB290UNEZ Price
  • PMDXB290UNEZ Distributor
  • PMDXB290UNEZ Supplier
  • PMDXB290UNEZ Wholesale
Related Products
SSM6N7002KFU,LF
SSM6N7002KFU,LF

Toshiba Semiconductor and Storage

2N7002DW-7-F
2N7002DW-7-F

Diodes Incorporated

SSM6L56FE,LM
SSM6L56FE,LM

Toshiba Semiconductor and Storage

SSM6N37FU,LF
SSM6N37FU,LF

Toshiba Semiconductor and Storage

2N7002DWH6327XTSA1
2N7002DWH6327XTSA1

Infineon Technologies

2N7002BKS,115
2N7002BKS,115

Nexperia USA Inc.

DMG1016UDW-7
DMG1016UDW-7

Diodes Incorporated

UM6K33NTN
UM6K33NTN

Rohm Semiconductor

DMG6602SVT-7
DMG6602SVT-7

Diodes Incorporated

EM6K34T2CR
EM6K34T2CR

Rohm Semiconductor

UM6K34NTCN
UM6K34NTCN

Rohm Semiconductor

DMG6601LVT-7
DMG6601LVT-7

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER