Nexperia USA Inc. PMFPB8032XP,115
- Part No.:
- PMFPB8032XP,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- FETs, MOSFETs
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
PMFPB8032XP,115.pdf
- Description:
- MOSFET P-CH 20V 2.7A HUSON6
- Quantity:
- Payment:

- Shipping:

Inventory:183
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Product details
Overview
PMFPB8032XP from Nexperia is a P-channel enhancement-mode Trench MOSFET integrated with an ultra-low forward-voltage (320 mV typ. at 1 A) MEGA Schottky diode in a single DFN2020-6 (SOT1118) package. It delivers 3.7 A continuous drain current at VGS = −4.5 V, 80 mΩ RDS(on) at 25 °C, and −20 V drain-source voltage rating - optimized for compact, high-efficiency power switching in portable battery systems.
For engineers reviewing the PMFPB8032XP datasheet, PMFPB8032XP pinout, PMFPB8032XP application, or PMFPB8032XP equivalent, key selection criteria include its dual-function MOSFET–Schottky co-packaging, 1.8 V gate-threshold compatibility, exposed-drain thermal pad, and validated performance in charging switches and DC-DC converter synchronous rectification paths.
Technical Context
This device implements a monolithic integration of a P-channel Trench MOSFET and a Schottky diode sharing common terminals (anode/cathode and source/drain), enabling bidirectional current handling with intrinsic body-diode replacement. Its gate threshold voltage (−0.6 V typ.) and low RDS(on) support efficient low-voltage gate drive down to 1.8 V.
The DFN2020-6 package features an exposed drain pad for direct thermal conduction to PCB copper, achieving 54 K/W Rth(j–sp) under optimized mounting. The Schottky diode's VF remains ≤365 mV up to 1 A and 25 °C, with reverse leakage <700 µA at 20 V and 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −20 V - maximum blocking voltage for battery-side high-side switching |
| ID | −3.7 A @ VGS = −4.5 V, Tamb = 25 °C - continuous load current capability in portable power rails |
| RDS(on) | 80 mΩ typ. @ VGS = −4.5 V, ID = −2.7 A, Tj = 25 °C - enables <100 mW conduction loss at 2.7 A |
| VF | 320 mV typ. @ IF = 1 A, Tj = 25 °C - ultra-low forward drop reduces diode conduction loss in buck sync rectifiers |
| VGS(th) | −0.6 V typ. @ ID = −250 µA - supports logic-level gate drive from 1.8 V microcontrollers |
| Package | DFN2020-6 (SOT1118), 2 × 2 × 0.65 mm - ultra-thin leadless footprint for space-constrained portable PCBs |
| Tj(max) | +150 °C - rated junction temperature enabling operation in thermally dense battery management modules |
Pinout & Package
DFN2020-6 (SOT1118) is a 2 mm × 2 mm × 0.65 mm ultra-thin, leadless, surface-mount plastic package with an exposed drain pad on the bottom side for enhanced thermal dissipation. The top-side marking "1X" identifies the device orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode (A) | Schottky diode anode - connects to input/battery rail in reverse-polarity protection or OR-ing configurations |
| 2 | Not Connected (n.c.) | No internal connection - electrically isolated; must remain unconnected on PCB |
| 3 | Drain (D) | MOSFET drain and Schottky cathode common node - ties to load side and provides thermal path via exposed pad |
| 4 | Source (S) | MOSFET source - referenced to system ground or battery negative in high-side switch layouts |
| 5 | Gate (G) | MOSFET control terminal - accepts 1.8 V–12 V negative gate drive relative to source |
| 6 & 7 & 8 | Cathode (K) / Drain (D) | Shared Schottky cathode and MOSFET drain terminals - pins 6 and 7 are cathode; pin 8 is redundant drain connection per package layout |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Schottky diode | 320 mV VF at 1 A eliminates need for external catch diode in buck converters |
| Low gate threshold | −0.6 V VGS(th) enables direct drive from 1.8 V GPIO without level-shifting circuitry |
| Thermally enhanced package | Exposed drain pad achieves 54 K/W Rth(j–sp), supporting >1 W continuous dissipation on 6 cm² copper |
| Ultra-thin profile | 0.65 mm max height meets Z-height constraints in slim smartphones and wearables |
| Low RDS(on) | 80 mΩ at −4.5 V ensures <220 mW I²R loss at 3.3 A, critical for thermal budget in sealed enclosures |
Applications
| Charging Switch | DC-DC Synchronous Rectifier |
|---|---|
Use Scenario: Bidirectional power path control between USB input and Li-ion battery in portable chargers. IC Role / Device Role / Timing Role: P-channel MOSFET acts as reverse-current blocking switch; integrated Schottky handles inrush and fault current clamping. Use Value: Eliminates discrete diode + MOSFET solution, reducing BOM count by 2 components and PCB area by >30%. | Use Scenario: Low-loss rectification in 3.3 V/5 V buck converters powering SoCs in tablets. IC Role / Device Role / Timing Role: MOSFET replaces body diode during synchronous rectification phase; Schottky provides fast recovery during dead-time. Use Value: Achieves >94% efficiency at 2 A output due to combined 320 mV VF and 80 mΩ RDS(on), versus 500 mV discrete Schottky solutions. |
| Hard Disk Power Management | Battery-Driven Portable Power Rail |
Use Scenario: Hot-swap isolation and surge suppression for 2.5″ HDD spindle motor supply. IC Role / Device Role / Timing Role: MOSFET controls 12 V rail enable; Schottky absorbs inductive kickback during motor stop. Use Value: Withstands 11 A peak drain current and 25 A non-repetitive surge, preventing controller latch-up during spin-down events. | Use Scenario: Main power switch for Bluetooth headset audio subsystems operating from 3.7 V Li-Po. IC Role / Device Role / Timing Role: High-side load switch with integrated reverse-polarity protection via Schottky anode connection. Use Value: 1.8 V gate drive compatibility allows direct control from BLE SoC GPIO, removing dedicated level shifter IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET–Schottky combination applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN6016LFG-7 | 60 V VDS, 3.8 A ID, no integrated Schottky - requires external diode | Higher voltage rating suits 48 V industrial systems; lacks co-packaged diode for compactness | Select when higher blocking voltage is required and board space permits discrete diode placement |
| SI7850DP-T1-GE3 | 20 V VDS, 4.5 A ID, 50 mΩ RDS(on), no integrated Schottky | Lower RDS(on) improves conduction loss but adds component count and layout complexity | Prefer when maximum efficiency at >3 A is critical and Schottky function is implemented separately |
Compared with DMN6016LFG-7 and SI7850DP-T1-GE3, PMFPB8032XP uniquely integrates both functions in a 2×2 mm footprint - trading minor RDS(on) penalty for significant BOM reduction, layout simplification, and guaranteed timing alignment between MOSFET and diode.
Availability
PMFPB8032XP is available at Aetrix Electronics and suitable for charging switches, DC-DC synchronous rectifiers, and battery-driven portable power rails requiring stable component supply across consumer electronics, computing peripherals, and storage subsystems.
Supply support for PMFPB8032XP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors - delivering high-performance, reliable components for automotive, industrial, mobile, and computing markets.
PMFPB8032XP belongs to Nexperia's MEGA Schottky + Trench MOSFET co-packaged product line, engineered specifically to reduce size and improve efficiency in portable power management circuits.
FAQ
What is the maximum continuous drain current for PMFPB8032XP at 100 °C ambient?
The maximum continuous drain current is −1.7 A at Tamb = 100 °C with VGS = −4.5 V, as specified in Table 5 (Limiting Values). This derating reflects thermal limits imposed by the DFN2020-6 package's junction-to-ambient thermal resistance (99–115 K/W) and 150 °C maximum junction temperature.
Can PMFPB8032XP be used in reverse-polarity protection circuits?
Yes - connect the anode (pin 1) to the input supply, source (pin 4) to system ground, and load to drain (pin 3). The integrated Schottky blocks reverse current while the MOSFET conducts forward current with low RDS(on). No external diode is needed, and the −0.6 V gate threshold allows direct control from low-voltage supervisors.
How does the dual-cathode pin configuration (pins 6 and 7) affect PCB layout?
Pins 6 and 7 are internally shorted cathodes of the Schottky diode and must be connected together on the PCB to the same net - typically tied to the drain node (pin 3). This redundancy improves current sharing and thermal distribution across the cathode interface, enhancing reliability in high-pulse-current applications like HDD motor braking.
Is the exposed drain pad electrically isolated from other terminals?
No - the exposed drain pad is electrically connected to pin 3 (drain) and pins 6/7 (cathode), forming a single low-impedance thermal and electrical node. It must be soldered to a dedicated PCB copper pour tied to the drain net; floating or grounded pads will cause functional failure or thermal runaway.
PMFPB8032XP,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 6-UFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.7A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V
- Rds On (Max) @ Id, Vgs:
- 102mOhm @ 2.7A, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 8.6 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 550 pF @ 10 V
- FET Feature:
- Schottky Diode (Isolated)
- Power Dissipation (Max):
- 485mW (Ta), 6.25W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-HUSON (2x2)
PMFPB8032XP,115 FAQ
1.How can I place an order for PMFPB8032XP,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMFPB8032XP,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMFPB8032XP,115 reliable?
The price and inventory of PMFPB8032XP,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMFPB8032XP,115 is usually 5 days.
3.What payment methods are accepted for PMFPB8032XP,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMFPB8032XP,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMFPB8032XP,115?
PMFPB8032XP,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMFPB8032XP,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMFPB8032XP,115?
For technical support, including PMFPB8032XP,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMFPB8032XP,115 requirements.
6.How does Aetrix verify that PMFPB8032XP,115 is sourced from the original manufacturer or authorized distributors?
All PMFPB8032XP,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMFPB8032XP,115 meets industry standards.
7.What is the process for return or replacement of PMFPB8032XP,115?
All PMFPB8032XP,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMFPB8032XP,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMFPB8032XP,115 part is unused and in its original packaging.
Return procedure for PMFPB8032XP,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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