NXP Semiconductors PMN25EN,115
- Part No.:
- PMN25EN,115
- Manufacturer:
- NXP Semiconductors
- Category:
- FETs, MOSFETs
- Package:
- SC-74, SOT-457
- Datasheet:
-
PMN25EN,115.pdf
- Description:
- MOSFET N-CH 30V 6.2A 6TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PMN25EN from Nexperia is a 30 V, 6.2 A N-channel enhancement-mode Trench MOSFET in SOT457 (TSOP6) package, optimized for low-side switching with logic-level gate drive compatibility, 20 mΩ RDS(on) at VGS = 10 V, and fast 5 ns turn-on delay-used in relay drivers and high-speed line drivers.
For engineers reviewing the PMN25EN datasheet, PMN25EN pinout, PMN25EN application, or PMN25EN equivalent, key selection criteria include its 30 V VDS, 6.2 A continuous drain current at 25 °C, 20–23 mΩ on-resistance, logic-level gate threshold (1.5 V typ), and SOT457 thermal performance with Rth(j-a) as low as 78 K/W on 6 cm² drain pad.
Technical Context
This N-channel MOSFET employs Trench MOSFET technology to achieve low RDS(on) and fast switching, with VGS(th) of 1.5 V (typ) enabling direct interface with 3.3 V and 5 V logic controllers. Its gate charge profile includes 9.6 nC total QG and 1.5 nC QGD, supporting efficient PWM operation up to several MHz.
The device features integrated source-drain diode with 1.4 A forward current capability and 0.78 V typical VSD, and operates across –55 °C to 150 °C junction temperature range. Thermal resistance from junction to solder point is 15–20 K/W, facilitating compact PCB layout with minimal heatsinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines safe operating range in 24 V systems and transient-tolerant low-voltage switching. |
| ID (continuous) | 6.2 A at Tamb = 25 °C - Sustained load current capability on standard FR4 PCB with 6 cm² drain pad; derates to 3.9 A at 100 °C ambient. |
| RDS(on) | 20 mΩ (typ) at VGS = 10 V, ID = 6.2 A - Low conduction loss enabling <125 mW power dissipation at 2.5 A, critical for thermally constrained designs. |
| VGS(th) | 1.5 V (typ) - Logic-level gate threshold ensures full enhancement with 3.3 V microcontroller outputs without level-shifting circuitry. |
| QG(tot) | 9.6 nC (typ) - Enables fast switching with low gate-drive power; supports >1 MHz PWM in low-inductance layouts with 6 Ω external gate resistor. |
| td(on)/tf | 5 ns / 40 ns - Short propagation and fall times reduce switching losses and EMI in high-frequency loadswitching applications. |
| Ciss | 492 pF (typ) - Input capacitance determines gate drive strength requirement; compatible with standard logic buffers and microcontroller GPIOs. |
Pinout & Package
SOT457 (TSOP6) plastic surface-mounted package: 2.7 mm × 3.1 mm footprint, 0.95 mm height, 6-lead single-row configuration with exposed drain pads on pins 1, 2, 5, and 6 for thermal and current handling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6 | D (drain) | Four parallel drain terminals reduce package inductance and thermal resistance; must be connected to large copper pour for 1385 mW Ptot capability. |
| 3 | G (gate) | Control input requiring <100 nA leakage; sensitive to ESD-requires gate resistor (≥10 Ω) and TVS protection in noisy environments. |
| 4 | S (source) | Reference node for gate drive and current sensing; ties to system ground or low-side shunt; forms cathode of integrated body diode. |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced with 3.3 V or 5 V controllers-eliminates need for gate driver ICs in space-constrained MCU-based loadswitches. |
| Trench MOSFET architecture | Delivers 20 mΩ RDS(on) in SOT457-enables higher current density than planar MOSFETs of same size, reducing board area by ~30% vs. comparable SO-8 devices. |
| Fast switching (5 ns td(on)) | Minimizes transition losses in PWM dimming and motor control; supports clean edge integrity up to 10 MHz with proper layout. |
| Integrated source-drain diode | 1.4 A rated body diode with 0.78 V VSD enables freewheeling in inductive loads (e.g., relays, solenoids) without external diode. |
| Robust thermal design | Rth(j-a) = 78 K/W on 6 cm² drain pad-allows 1.385 W continuous dissipation at 25 °C ambient, suitable for sealed enclosures without forced air. |
Applications
| Relay Driver | High-Speed Line Driver |
|---|---|
Use Scenario: Driving 12 V/24 V electromagnetic relays in industrial PLC I/O modules. IC Role / Device Role / Timing Role: Low-side switch controlling relay coil current; handles 100 ms inrush and steady-state hold current. Use Value: 6.2 A rating and 20 mΩ RDS(on) ensure <150 mW coil drive loss at 2 A, extending relay life and reducing thermal stress on PCB. |
Use Scenario: Transmitting TTL/CMOS signals across 50 Ω transmission lines in test equipment backplanes. IC Role / Device Role / Timing Role: Active pull-down stage providing fast edge rates and impedance matching. Use Value: 5 ns td(on) and 40 ns tf enable clean 100 Mbps digital signaling; low Ciss avoids signal distortion. |
| Low-Side Loadswitch | Switching Power Supply Sync Rectifier |
Use Scenario: Enabling/disabling 5 V or 12 V rails in portable medical monitors and handheld instruments. IC Role / Device Role / Timing Role: Controlled power path switch with logic-compatible enable input and fast turn-on/off. Use Value: 1.5 V VGS(th) allows direct connection to 3.3 V microcontroller GPIO; 20 mΩ RDS(on) limits voltage drop to <125 mV at 6.2 A. |
Use Scenario: Replacing Schottky diodes in 5 V output buck converters for improved efficiency. IC Role / Device Role / Timing Role: Synchronous rectifier controlled by controller's gate driver signal. Use Value: Low QGD (1.5 nC) and fast tf (40 ns) minimize shoot-through risk; RDS(on) reduces conduction loss by >60% vs. 0.4 V diode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-side switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2004LK-7 | 20 V VDS, 4.2 A ID, 30 mΩ RDS(on), same SOT457 package | Limited to ≤16 V systems; lower current and higher on-resistance increase conduction loss by ~50% at 4 A. | Choose when 20 V rating suffices and cost sensitivity outweighs efficiency needs. |
| PSMN022-30PL | 30 V VDS, 10.5 A ID, 13.5 mΩ RDS(on), larger LFPAK56 package | Higher current and lower RDS(on) improve thermal margin but require PCB redesign due to different footprint and thermal pad layout. | Choose for higher-power 30 V applications where board space allows LFPAK56 and thermal performance is critical. |
Compared with DMN2004LK-7, PMN25EN delivers 50% higher current and 33% lower RDS(on) in identical SOT457 packaging; versus PSMN022-30PL, it trades 35% lower RDS(on) and 70% higher current for smaller footprint and easier layout integration.
Availability
PMN25EN is available at Aetrix Electronics and suitable for relay drivers, high-speed line drivers, low-side loadswitches, and switching circuits requiring stable component supply across industrial automation, test instrumentation, and embedded power management.
Supply support for PMN25EN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, spun off from NXP in 2017 and focused on automotive, industrial, computing, consumer, and wearable markets.
The PMN25EN belongs to Nexperia's TrenchMOS low-voltage logic-level MOSFET product line, engineered for high-efficiency, space-constrained low-side switching in battery-powered and thermally limited applications.
FAQ
What is the maximum continuous drain current for PMN25EN at 100 °C ambient temperature?
The PMN25EN supports 3.9 A continuous drain current at Tamb = 100 °C with VGS = 10 V, as specified in the Limiting Values table. This derating reflects thermal constraints of the SOT457 package on standard FR4 PCB; using a 6 cm² drain pad improves heat dissipation and sustains higher current in real-world layouts. Always verify junction temperature with actual board layout and airflow conditions before final design sign-off for PMN25EN.
Is PMN25EN suitable for driving inductive loads like relays or solenoids?
Yes, PMN25EN is explicitly qualified for relay driver applications per its Product Profile. Its integrated source-drain diode (1.4 A, 0.78 V VSD) provides freewheeling path for coil energy, and its 25 A peak drain current rating handles relay inrush transients. For robust operation, add a 10–100 nF RC snubber across the coil and ensure gate drive includes a 10–47 Ω series resistor to damp ringing. The PMN25EN datasheet confirms this use case in Section 1.3 Applications.
Does PMN25EN require a gate driver IC when used with a 3.3 V microcontroller?
No, PMN25EN does not require an external gate driver IC with 3.3 V microcontrollers. Its 1.5 V typical gate threshold voltage and logic-level compatibility allow full enhancement at VGS = 3.3 V, delivering near-minimum RDS(on) (24–31 mΩ at 5.4 A). However, for high-frequency PWM (>500 kHz) or high-current switching (>4 A), a small gate resistor (10–22 Ω) is recommended to control dv/dt and prevent oscillation-verified in PMN25EN's dynamic characteristics testing.
What is the thermal resistance from junction to ambient for PMN25EN on a standard PCB?
On a standard FR4 PCB with single-sided copper and tin-plated finish (no extended drain pad), PMN25EN has Rth(j-a) = 200–230 K/W. With a 6 cm² copper mounting pad for the drain terminals, this improves to 78–90 K/W-enabling 1385 mW continuous power dissipation at 25 °C ambient. These values are measured per IEC 60134 and documented in Table 6 of the PMN25EN datasheet; actual performance depends on copper area, layer count, and airflow.
Can PMN25EN replace older NXP PMN25EN variants or pin-compatible parts?
PMN25EN is the current Nexperia part number for this device; earlier NXP-branded versions (e.g., pre-2017) are functionally identical and fully interchangeable. It is not pin-compatible with SO-8 or TO-252 MOSFETs due to its SOT457 footprint. Cross-references like PMN25EN,115 indicate tape-and-reel packaging-no electrical or mechanical differences exist between variants. Always confirm marking code "T8" and date code on physical units to ensure authenticity when sourcing PMN25EN.
PMN25EN,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SC-74, SOT-457
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 6.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 23mOhm @ 6.2A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 492 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 540mW (Ta), 6.25W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-74
PMN25EN,115 FAQ
1.How can I place an order for PMN25EN,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PMN25EN,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PMN25EN,115 reliable?
The price and inventory of PMN25EN,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PMN25EN,115 is usually 5 days.
3.What payment methods are accepted for PMN25EN,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PMN25EN,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PMN25EN,115?
PMN25EN,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PMN25EN,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PMN25EN,115?
For technical support, including PMN25EN,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PMN25EN,115 requirements.
6.How does Aetrix verify that PMN25EN,115 is sourced from the original manufacturer or authorized distributors?
All PMN25EN,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PMN25EN,115 meets industry standards.
7.What is the process for return or replacement of PMN25EN,115?
All PMN25EN,115 units undergo pre-shipment inspection (PSI). If there is an issue with PMN25EN,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PMN25EN,115 part is unused and in its original packaging.
Return procedure for PMN25EN,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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